fs-TrellisBoard/hardware/ecp5_mainboard/mainboard_prod/readme-advancedassembly.txt

TrellisBoard
------------

Part Name: TrellisBoard
Company:   Fork Sand, Inc.
Contact:   Jeff Moe <moe@forksand.com>

Fork Sand, Inc. fork/clone.

Files:
 - gerber/: gerbers for all layers
        F_Cu, In1_Cu..In6_Cu, B_Cu: copper layers from top to bottom (8 layers)
        F_SilkS, B_SilkS: top and bottom silkscreen
        F_Mask, B_Mask: top and bottom soldermask
        F_Paste, B_Paste: top and bottom stencil
        Edge_Cuts: board outline
        NPTH: non-plated holes drill
        PTH: plated holes drill
 - part_mapping_top.svg, part_mapping_bottom.svg: graphical part mapping (copy of silkscreen)
 - ecp5_mainboard-all-pos.csv: x & y coordinates for all SMD parts
 - ecp5_mainboard_bom_advancedcircuits.ods: bill-of-materials for all parts in LibreOffice format
 - ecp5_mainboard_bom_advancedcircuits-export.xls: bill-of-materials for all parts exported to XLS format

BOM notes:
 - Turnkey order, all parts to be ordered by Advanced Assembly.
 - Parts with "Substition Allowed" = N must be exact part number match from a distributor (DigiKey, Mouser, etc). DigiKey part numbers are typically given but other distributors may be used
 - Parts with "Substition Allowed" = Y may be substitued with parts of an equal or better specification from another manufacturer/distributor.

PCB specification:
 - 200mm x 111.14mm (7.87" x 4.38").
 - 8 layers.
 - FR4 material.
 - 1.6mm board thickness.
 - 1oz copper thickness.
 - 3mil track/3mil space (.003").
 - 0.2mm (0.0077") minimum hole diameter.
 - ENIG surface finish.
 - No gold fingers.
 - 30 degree bevelling for card edge connector. "15 mils bevel depth with 45 degree angle" OK alternate.
 - 3,367 holes.
 - Green soldermask.
 - White silkscreen.
 - RoHS: Yes.
 - ITAR: No.
 - SMT Both Sides: Yes.
 - Lead Free: Yes.
 - # of BOM Line Items: 97.
 - SMT Placements/board: 94
 - Fine Pitch Placements/board: 
 - Thru-Hole Placement/board: 
 - BGA/Leadless Placement/board: 1