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diff --git a/hardware/ecp5_mainboard/mainboard_prod/readme-advancedcircuits.txt b/hardware/ecp5_mainboard/mainboard_prod/readme-advancedcircuits.txt
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+TrellisBoard
+------------
+
+Part Name: TrellisBoard
+Company:   Fork Sand, Inc.
+Contact:   Jeff Moe <moe@forksand.com>
+
+Fork Sand, Inc. fork/clone.
+
+Files:
+ - gerber/: gerbers for all layers
+        F_Cu, In1_Cu..In6_Cu, B_Cu: copper layers from top to bottom (8 layers)
+        F_SilkS, B_SilkS: top and bottom silkscreen
+        F_Mask, B_Mask: top and bottom soldermask
+        F_Paste, B_Paste: top and bottom stencil
+        Edge_Cuts: board outline
+        NPTH: non-plated holes drill
+        PTH: plated holes drill
+ - part_mapping_top.svg, part_mapping_bottom.svg: graphical part mapping (copy of silkscreen)
+ - ecp5_mainboard-all-pos.csv: x & y coordinates for all SMD parts
+ - ecp5_mainboard_bom_advancedcircuits.ods: bill-of-materials for all parts in LibreOffice format
+ - ecp5_mainboard_bom_advancedcircuits-export.xls: bill-of-materials for all parts exported to XLS format
+
+BOM notes:
+ - Turnkey order, all parts to be ordered by Advanced Circuits.
+ - Parts with "Substition Allowed" = N must be exact part number match from a distributor (DigiKey, Mouser, etc). DigiKey part numbers are typically given but other distributors may be used
+ - Parts with "Substition Allowed" = Y may be substitued with parts of an equal or better specification from another manufacturer/distributor.
+
+PCB specification:
+ - 200mm x 111.14mm (7.87" x 4.38").
+ - 8 layers.
+ - FR4 material.
+ - 1.6mm board thickness.
+ - 1oz copper thickness.
+ - 3mil track/3mil space.
+ - 0.2mm minimum hole diameter.
+ - ENIG surface finish.
+ - No gold fingers.
+ - 30 degree bevelling for card edge connector. "15 mils bevel depth with 45 degree angle" OK alternate.
+ - 3,367 holes.
+ - Do not clean SW1, MPN: CHP-081TA.
+ - Do not place J8,J14.
+ - Green soldermask.
+ - White silkscreen.
+ - RoHS: Yes.