diff --git a/hardware/ecp5_mainboard/mainboard_prod/readme-royalcircuit.txt b/hardware/ecp5_mainboard/mainboard_prod/readme-royalcircuit.txt new file mode 100644 index 0000000..c30f2bf --- /dev/null +++ b/hardware/ecp5_mainboard/mainboard_prod/readme-royalcircuit.txt @@ -0,0 +1,35 @@ +TrellisBoard rev1.0 +-------------------- + +Contact: David Shah + +Files: + - gerber/: gerbers for all layers + F_Cu, In1_Cu..In6_Cu, B_Cu: copper layers from top to bottom (8 layers) + F_SilkS, B_SilkS: top and bottom silkscreen + F_Mask, B_Mask: top and bottom soldermask + F_Paste, B_Paste: top and bottom stencil + Edge_Cuts: board outline + NPTH: non-plated holes drill + PTH: plated holes drill + - part_mapping_top.svg, part_mapping_bottom.svg: graphical part mapping (copy of silkscreen) + - ecp5_mainboard-all-pos.csv: x & y coordinates for all SMD parts + - ecp5_mainboard_bom_elecrow.xls: bill-of-materials for all parts + +BOM notes: + - Turnkey order, all parts to be ordered by Elecrow + - Parts with "Substition Allowed" = N must be exact part number match from a distributor (DigiKey, Mouser, etc). DigiKey part numbers are typically given but other distributors may be used + - Parts with "Substition Allowed" = Y may be substitued with parts of an equal or better specification from another manufacturer/distributor. + +PCB specification: + - 200mm x 111.14mm + - 8 layers + - FR4 material + - 1.6mm board thickness + - 1oz copper thickness + - 3mil track/3mil space + - 0.2mm minimum hole diameter + - ENIG surface finish + - Hard gold fingers with 30 degree bevelling for card edge connector + - Matte black soldermask (black if matte unavailable) + - White silkscreen \ No newline at end of file