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fs-TrellisBoard/hardware/ecp5_mainboard/mainboard_prod/readme-advancedassembly.txt

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TrellisBoard
------------
Part Name: TrellisBoard
Company: Fork Sand, Inc.
Contact: Jeff Moe <moe@forksand.com>
Fork Sand, Inc. fork/clone.
Files:
- gerber/: gerbers for all layers
F_Cu, In1_Cu..In6_Cu, B_Cu: copper layers from top to bottom (8 layers)
F_SilkS, B_SilkS: top and bottom silkscreen
F_Mask, B_Mask: top and bottom soldermask
F_Paste, B_Paste: top and bottom stencil
Edge_Cuts: board outline
NPTH: non-plated holes drill
PTH: plated holes drill
- part_mapping_top.svg, part_mapping_bottom.svg: graphical part mapping (copy of silkscreen)
- ecp5_mainboard-all-pos.csv: x & y coordinates for all SMD parts
- ecp5_mainboard_bom_advancedcircuits.ods: bill-of-materials for all parts in LibreOffice format
- ecp5_mainboard_bom_advancedcircuits-export.xls: bill-of-materials for all parts exported to XLS format
BOM notes:
- Turnkey order, all parts to be ordered by Advanced Assembly.
- Parts with "Substition Allowed" = N must be exact part number match from a distributor (DigiKey, Mouser, etc). DigiKey part numbers are typically given but other distributors may be used
- Parts with "Substition Allowed" = Y may be substitued with parts of an equal or better specification from another manufacturer/distributor.
PCB specification:
- 200mm x 111.14mm (7.87" x 4.38").
- 8 layers.
- FR4 material.
- 1.6mm board thickness.
- 1oz copper thickness.
- 3mil track/3mil space (.003").
- 0.2mm (0.0077") minimum hole diameter.
- ENIG surface finish.
- No gold fingers.
- 30 degree bevelling for card edge connector. "15 mils bevel depth with 45 degree angle" OK alternate.
- 3,367 holes.
- Green soldermask.
- White silkscreen.
- RoHS: Yes.
- ITAR: No.
- SMT Both Sides: Yes.
- Lead Free: Yes.
- # of BOM Line Items: 97.
- SMT Placements/board: 94
- Fine Pitch Placements/board:
- Thru-Hole Placement/board:
- BGA/Leadless Placement/board: 1