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fs-TrellisBoard/hardware/ecp5_mainboard/mainboard_prod
History
Jeff Moe 0834d5be66
Move do not clean, do not place to spreadsheet 		5 years ago
..
gerber hardware/mainboard: Add Rev 1.0 production assets 6 years ago
ecp5_mainboard-NPTH.drl hardware/mainboard: Add Rev 1.0 production assets 6 years ago
ecp5_mainboard-PTH.drl hardware/mainboard: Add Rev 1.0 production assets 6 years ago
ecp5_mainboard-all-pos.csv Use CSV position file 5 years ago
ecp5_mainboard-bottom.pos Add footprint position / pick & place files 5 years ago
ecp5_mainboard-top.pos Add footprint position / pick & place files 5 years ago
ecp5_mainboard_bom_advancedcircuits-export.xls Move do not clean, do not place to spreadsheet 5 years ago
ecp5_mainboard_bom_advancedcircuits.ods Move do not clean, do not place to spreadsheet 5 years ago
ecp5_mainboard_bom_elecrow.xls hardware/mainboard: Add Rev 1.0 production assets 6 years ago
ecp5_mainboard_bom_protoexpress-export.xls Change protoexpress mfg p/n to FT2232HL-REEL 5 years ago
ecp5_mainboard_bom_protoexpress.ods Change protoexpress mfg p/n to FT2232HL-REEL 5 years ago
ecp5_mainboard_bom_royalcircuit-export.xls Spreadsheet formatting/readability 5 years ago
ecp5_mainboard_bom_royalcircuit.ods Spreadsheet formatting/readability 5 years ago
ecp5_mainboard_protoexpress-BOM204387.xls BOM quote back from ProtoExpress 5 years ago
part_mapping_bottom.svg hardware/mainboard: Add Rev 1.0 production assets 6 years ago
part_mapping_top.svg hardware/mainboard: Add Rev 1.0 production assets 6 years ago
pos-report.txt pos report from pos sent to protoexpress 5 years ago
readme-advancedcircuits.txt Move do not clean, do not place to spreadsheet 5 years ago
readme-protoexpress.txt Add readme for protoexpress 5 years ago
readme-royalcircuit.txt RoHS 5 years ago
readme.txt hardware/mainboard: Add Rev 1.0 production assets 6 years ago

readme.txt 

TrellisBoard rev1.0

--------------------



Contact: David Shah <dave@ds0.me>



Files:

 - gerber/: gerbers for all layers

        F_Cu, In1_Cu..In6_Cu, B_Cu: copper layers from top to bottom (8 layers)

        F_SilkS, B_SilkS: top and bottom silkscreen

        F_Mask, B_Mask: top and bottom soldermask

        F_Paste, B_Paste: top and bottom stencil

        Edge_Cuts: board outline

        NPTH: non-plated holes drill

        PTH: plated holes drill

 - part_mapping_top.svg, part_mapping_bottom.svg: graphical part mapping (copy of silkscreen)

 - ecp5_mainboard-all-pos.csv: x & y coordinates for all SMD parts

 - ecp5_mainboard_bom_elecrow.xls: bill-of-materials for all parts



BOM notes:

 - Turnkey order, all parts to be ordered by Elecrow

 - Parts with "Substition Allowed" = N must be exact part number match from a distributor (DigiKey, Mouser, etc). DigiKey part numbers are typically given but other distributors may be used

 - Parts with "Substition Allowed" = Y may be substitued with parts of an equal or better specification from another manufacturer/distributor.



PCB specification:

 - 200mm x 111.14mm

 - 8 layers

 - FR4 material

 - 1.6mm board thickness

 - 1oz copper thickness

 - 3mil track/3mil space

 - 0.2mm minimum hole diameter

 - ENIG surface finish

 - Hard gold fingers with 30 degree bevelling for card edge connector

 - Matte black soldermask (black if matte unavailable)

 - White silkscreen