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fs-TrellisBoard/hardware/ecp5_mainboard/mainboard_prod/readme-royalcircuit.txt

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TrellisBoard rev1.0
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Fork Sand, Inc. fork/clone.
Contact: Jeff Moe <moe@forksand.com>
Files:
- gerber/: gerbers for all layers
F_Cu, In1_Cu..In6_Cu, B_Cu: copper layers from top to bottom (8 layers)
F_SilkS, B_SilkS: top and bottom silkscreen
F_Mask, B_Mask: top and bottom soldermask
F_Paste, B_Paste: top and bottom stencil
Edge_Cuts: board outline
NPTH: non-plated holes drill
PTH: plated holes drill
- part_mapping_top.svg, part_mapping_bottom.svg: graphical part mapping (copy of silkscreen)
- ecp5_mainboard-all-pos.csv: x & y coordinates for all SMD parts
- ecp5_mainboard_bom_royalcircuit.ods: bill-of-materials for all parts in LibreOffice format
- ecp5_mainboard_bom_royalcircuit-export.xls: bill-of-materials for all parts exported to XLS format
BOM notes:
- Turnkey order, all parts to be ordered by Royal Circuit
- Parts with "Substition Allowed" = N must be exact part number match from a distributor (DigiKey, Mouser, etc). DigiKey part numbers are typically given but other distributors may be used
- Parts with "Substition Allowed" = Y may be substitued with parts of an equal or better specification from another manufacturer/distributor.
PCB specification:
- 200mm x 111.14mm
- 8 layers
- FR4 material
- 1.6mm board thickness
- 1oz copper thickness
- 3mil track/3mil space
- 0.2mm minimum hole diameter
- ENIG surface finish
- Hard gold fingers with 30 degree bevelling for card edge connector
- Matte black soldermask (black if matte unavailable)
- White silkscreen
- RoHS: Yes