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44 lines
3.1 KiB
44 lines
3.1 KiB
(module TSSOP-16_4.4x5mm_Pitch0.65mm (layer F.Cu) (tedit 5B8B8A9A)
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(descr "16-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
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(tags "SSOP 0.65")
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(attr smd)
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(fp_text reference REF** (at 0 -3.55) (layer F.Fab)
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(effects (font (size 0.75 0.75) (thickness 0.15)))
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)
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(fp_text value TSSOP-16_4.4x5mm_Pitch0.65mm (at 0 3.55) (layer F.Fab)
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(effects (font (size 0.75 0.75) (thickness 0.15)))
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)
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(fp_line (start -1.2 -2.5) (end 2.2 -2.5) (layer F.Fab) (width 0.15))
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(fp_line (start 2.2 -2.5) (end 2.2 2.5) (layer F.Fab) (width 0.15))
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(fp_line (start 2.2 2.5) (end -2.2 2.5) (layer F.Fab) (width 0.15))
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(fp_line (start -2.2 2.5) (end -2.2 -1.5) (layer F.Fab) (width 0.15))
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(fp_line (start -2.2 -1.5) (end -1.2 -2.5) (layer F.Fab) (width 0.15))
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(fp_line (start -3.8 -2.9) (end -3.8 2.8) (layer F.CrtYd) (width 0.05))
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(fp_line (start 3.8 -2.9) (end 3.8 2.8) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.8 -2.9) (end 3.8 -2.9) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.8 2.8) (end 3.8 2.8) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.2 2.7) (end 2.2 2.7) (layer F.SilkS) (width 0.15))
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(fp_line (start -3.7 -2.8) (end 2.2 -2.8) (layer F.SilkS) (width 0.15))
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(pad 1 smd roundrect (at -2.8 -2.275) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 2 smd roundrect (at -2.8 -1.625) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 3 smd roundrect (at -2.8 -0.975) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 4 smd roundrect (at -2.8 -0.325) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 5 smd roundrect (at -2.8 0.325) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 6 smd roundrect (at -2.8 0.975) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 7 smd roundrect (at -2.8 1.625) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 8 smd roundrect (at -2.8 2.275) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 9 smd roundrect (at 2.8 2.275) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 10 smd roundrect (at 2.8 1.625) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 11 smd roundrect (at 2.8 0.975) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 12 smd roundrect (at 2.8 0.325) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 13 smd roundrect (at 2.8 -0.325) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 14 smd roundrect (at 2.8 -0.975) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 15 smd roundrect (at 2.8 -1.625) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 16 smd roundrect (at 2.8 -2.275) (size 1.5 0.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-16_4.4x5mm_P0.65mm.step
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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