From 01c84700b8a2c54a887f49d1a053ea29d76cf8cf Mon Sep 17 00:00:00 2001
From: Emard <vordah@gmail.com>
Date: Sat, 15 Sep 2018 17:04:44 +0200
Subject: [PATCH] readme update

---
 README.md | 2 +-
 1 file changed, 1 insertion(+), 1 deletion(-)

diff --git a/README.md b/README.md
index feb429e..e28a9d7 100644
--- a/README.md
+++ b/README.md
@@ -287,7 +287,7 @@ Here is checklist what was done or should be done in the next PCB release.
     [x] USB: copper fill keepout
     [x] ADC: footprint according to MAX1112x land pattern 90-0023
     [ ] fix tombstoning see https://www.tempoautomation.com/blog/surface-mount-tombstone-experiment/
-    [ ] Avoid VIAs on the PADs
+    [x] Avoid VIAs on the PADs
     [x] aligment marks for BGA footprint using exposed gold plated copper
     [ ] Order ADCs in reel (not bulk, not tube).
     [x] check increased distance of 2 pad rows of SDRAM