diff --git a/footprints/adc/max1112x-tqfn28.pretty/MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm.kicad_mod b/footprints/adc/max1112x-tqfn28.pretty/MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm.kicad_mod
index b83d409..ec2ad1e 100644
--- a/footprints/adc/max1112x-tqfn28.pretty/MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm.kicad_mod
+++ b/footprints/adc/max1112x-tqfn28.pretty/MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm.kicad_mod
@@ -1,4 +1,4 @@
-(module max1112x-tqfn28:MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm (layer F.Cu) (tedit 5B8FE9AB)
+(module max1112x-tqfn28:MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm (layer F.Cu) (tedit 5B925511)
   (descr "28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN or VQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
   (tags "TQFN 0.5")
   (attr smd)
@@ -29,34 +29,34 @@
   )
   (fp_circle (center -2.3 -3.1496) (end -2.2 -3.1496) (layer F.SilkS) (width 0.15))
   (fp_line (start -2.625 -2.625) (end -2.9 -2.9) (layer F.SilkS) (width 0.15))
-  (pad 1 smd rect (at -2.45 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 2 smd rect (at -2.45 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 3 smd rect (at -2.45 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 4 smd rect (at -2.45 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 5 smd rect (at -2.45 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 6 smd rect (at -2.45 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 7 smd rect (at -2.45 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 8 smd rect (at -1.5 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 9 smd rect (at -1 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 10 smd rect (at -0.5 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 11 smd rect (at 0 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 12 smd rect (at 0.5 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 13 smd rect (at 1 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 14 smd rect (at 1.5 2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 15 smd rect (at 2.45 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 16 smd rect (at 2.45 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 17 smd rect (at 2.45 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 18 smd rect (at 2.45 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 19 smd rect (at 2.45 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 20 smd rect (at 2.45 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 21 smd rect (at 2.45 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 22 smd rect (at 1.5 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 23 smd rect (at 1 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 24 smd rect (at 0.5 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 25 smd rect (at 0 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 26 smd rect (at -0.5 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 27 smd rect (at -1 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
-  (pad 28 smd rect (at -1.5 -2.45 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 1 smd rect (at -2.34 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 2 smd rect (at -2.34 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 3 smd rect (at -2.34 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 4 smd rect (at -2.34 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 5 smd rect (at -2.34 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 6 smd rect (at -2.34 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 7 smd rect (at -2.34 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 8 smd rect (at -1.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 9 smd rect (at -1 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 10 smd rect (at -0.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 11 smd rect (at 0 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 12 smd rect (at 0.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 13 smd rect (at 1 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 14 smd rect (at 1.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 15 smd rect (at 2.34 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 16 smd rect (at 2.34 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 17 smd rect (at 2.34 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 18 smd rect (at 2.34 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 19 smd rect (at 2.34 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 20 smd rect (at 2.34 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 21 smd rect (at 2.34 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 22 smd rect (at 1.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 23 smd rect (at 1 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 24 smd rect (at 0.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 25 smd rect (at 0 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 26 smd rect (at -0.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 27 smd rect (at -1 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
+  (pad 28 smd rect (at -1.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 29 smd rect (at 0.8125 0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
     (solder_paste_margin_ratio -0.2))
   (pad 29 smd rect (at 0.8125 -0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)