footprints: FCI 10029449-111RLF connector for future boards

pull/3/head
davor 7 years ago
parent a74ef6f980
commit 16dee1b082

@ -12,29 +12,29 @@
(fp_line (start -5 -1.75) (end -4.75 -1.5) (layer B.Paste) (width 0.35))
(fp_line (start -4.75 -1.5) (end -5 -1.25) (layer B.Paste) (width 0.35))
(fp_line (start -5 -1.25) (end -5 -1.75) (layer B.Paste) (width 0.35))
(pad 1 smd rect (at -4.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -3.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -3.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -1.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -1.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -0.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -0.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at -4.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at -3.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at -3.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -2.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at -2.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at -1.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at -1.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at -0.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at -0.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 0.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 0.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 1.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 1.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 2.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 2.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 3.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 3.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at 4.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at 4.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad S thru_hole circle (at -7.25 0) (size 2 2) (drill 1.3) (layers *.Cu *.Mask))
(pad S thru_hole circle (at 7.25 0) (size 2 2) (drill 1.3) (layers *.Cu *.Mask))
(pad S thru_hole circle (at -7.85 4.9) (size 2 2) (drill 1.3) (layers *.Cu *.Mask))
(pad S thru_hole circle (at 7.85 4.9) (size 2 2) (drill 1.3) (layers *.Cu *.Mask))
(pad 9 smd rect (at 0.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 1.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at 1.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 2.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at 3.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at 3.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at 4.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at 4.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 0 thru_hole circle (at -7.25 0) (size 2 2) (drill 1.3) (layers *.Cu *.Mask))
(pad 0 thru_hole circle (at 7.25 0) (size 2 2) (drill 1.3) (layers *.Cu *.Mask))
(pad 0 thru_hole circle (at -7.85 4.9) (size 2 2) (drill 1.3) (layers *.Cu *.Mask))
(pad 0 thru_hole circle (at 7.85 4.9) (size 2 2) (drill 1.3) (layers *.Cu *.Mask))
(model ${KISYS3DMOD}/fci-10029449.step
(at (xyz 0 -0.007874015748031498 0.1299212598425197))
(scale (xyz 1 1 1))

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