diff --git a/ulx3s.kicad_pcb b/ulx3s.kicad_pcb index e6d9956..630fe5e 100644 --- a/ulx3s.kicad_pcb +++ b/ulx3s.kicad_pcb @@ -1211,10 +1211,11 @@ (module ESP32:ESP32-WROOM (layer B.Cu) (tedit 5B1AAE56) (tstamp 5A111CE5) (at 117.23 105.75 180) (path /58D6D447/58E5662B) + (attr smd) (fp_text reference U9 (at -8.366 13.85 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) - (fp_text value ESP-WROOM-32 (at 5.715 -14.224 180) (layer B.Fab) + (fp_text value ESP-WROOM32 (at 5.715 -14.224 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text user "Espressif Systems" (at -6.858 0.889 90) (layer B.SilkS) @@ -2349,12 +2350,12 @@ (at 160.14 74.12 90) (descr "4x-dip-switch, Slide, row spacing 8.61 mm (338 mils), SMD, LowProfile") (tags "DIP Switch Slide 8.61mm 338mil SMD LowProfile") - (path /58D6547C/595B94DC) + (path /58D6547C/5B1DD3B8) (attr smd) (fp_text reference SW1 (at -4.59 -7.224) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.25))) ) - (fp_text value DIPSW (at 0 6.98 90) (layer F.Fab) + (fp_text value SW_DIP_x04 (at 0 6.98 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -2.34 -5.86) (end 3.34 -5.86) (layer F.Fab) (width 0.1)) @@ -3457,6 +3458,7 @@ (descr "Micro SD card slot SCHD3A0100 from ALPS or ON-STARS") (tags "Micro SD SCHD3A0100") (path /58DA7327/590C84AE) + (attr smd) (fp_text reference SD1 (at 5.55 0) (layer F.SilkS) (effects (font (size 0.59944 0.59944) (thickness 0.12446))) ) @@ -8210,14 +8212,14 @@ ) ) - (module Resistor_SMD:R_0603_1608Metric (layer B.Cu) (tedit 59FE48B8) (tstamp 5B0D6FDC) + (module Resistor_SMD:R_0603_1608Metric (layer B.Cu) (tedit 5B1D7498) (tstamp 5B0D6FDC) (at 128.39 109.68 270) (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator") (tags resistor) (path /58D6BF46/58EB9CB5) (attr smd) - (fp_text reference R9 (at 1.542 -1.666) (layer B.SilkS) - (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) + (fp_text reference R9 (at -2.141 -0.015 90) (layer B.SilkS) + (effects (font (size 1 0.75) (thickness 0.15)) (justify mirror)) ) (fp_text value 15k (at 0 -1.65 270) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) @@ -9751,7 +9753,7 @@ (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator") (tags "resistor handsolder") (path /58D51CAD/5AF31FAC) - (attr smd) + (attr virtual) (fp_text reference RV2 (at 0.254 -1.65) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) @@ -9785,7 +9787,7 @@ (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator") (tags "resistor handsolder") (path /58D51CAD/5AF3694A) - (attr smd) + (attr virtual) (fp_text reference RV3 (at 0 -1.65) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) @@ -10063,7 +10065,7 @@ (at 115.07 65.629 180) (descr "Imported from /home/davor/tmp/koncar/koncar.svg") (tags svg2mod) - (attr smd) + (attr virtual) (fp_text reference svg2mod (at 0 4.407697 180) (layer B.SilkS) hide (effects (font (size 1.524 1.524) (thickness 0.3048)) (justify mirror)) ) @@ -15859,7 +15861,7 @@ (segment (start 130.422 73.898) (end 129.622 73.898) (width 0.3) (layer B.Cu) (net 317)) (segment (start 129.622 73.898) (end 128.532 72.808) (width 0.3) (layer B.Cu) (net 317)) - (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B1BE106) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B1D7544) (hatch edge 0.508) (connect_pads (clearance 0.254)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -17721,7 +17723,7 @@ ) ) ) - (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B1BE103) (hatch edge 0.508) + (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B1D7541) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -17787,7 +17789,7 @@ ) ) ) - (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B1BE100) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B1D753E) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.1) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -18979,7 +18981,7 @@ ) ) ) - (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B1BE0FD) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B1D753B) (hatch edge 0.508) (connect_pads (clearance 0.254)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20097,7 +20099,7 @@ ) ) ) - (zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1BE0FA) (hatch edge 0.508) + (zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1D7538) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.127) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20348,7 +20350,7 @@ ) ) ) - (zone (net 170) (net_name +1V1) (layer In1.Cu) (tstamp 5B1BE0F7) (hatch edge 0.508) + (zone (net 170) (net_name +1V1) (layer In1.Cu) (tstamp 5B1D7535) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20425,7 +20427,7 @@ ) ) ) - (zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1BE0F4) (hatch edge 0.508) + (zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1D7532) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.127) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20589,7 +20591,7 @@ ) ) ) - (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B1BE0F1) (hatch edge 0.508) + (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B1D752F) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.127) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) diff --git a/ulx3s.kicad_pcb-bak b/ulx3s.kicad_pcb-bak index df3553f..0fda3d0 100644 --- a/ulx3s.kicad_pcb-bak +++ b/ulx3s.kicad_pcb-bak @@ -11,10 +11,10 @@ (page A4) (layers - (0 F.Cu signal hide) - (1 In1.Cu signal hide) - (2 In2.Cu signal hide) - (31 B.Cu signal hide) + (0 F.Cu signal) + (1 In1.Cu signal) + (2 In2.Cu signal) + (31 B.Cu signal) (32 B.Adhes user) (33 F.Adhes user) (34 B.Paste user) @@ -62,7 +62,7 @@ (pad_to_mask_clearance 0.05) (aux_axis_origin 94.1 112.22) (grid_origin 93.48 113) - (visible_elements 7FFFFDFF) + (visible_elements 7FFFFFFF) (pcbplotparams (layerselection 0x010fc_ffffffff) (usegerberextensions true) @@ -1211,10 +1211,11 @@ (module ESP32:ESP32-WROOM (layer B.Cu) (tedit 5B1AAE56) (tstamp 5A111CE5) (at 117.23 105.75 180) (path /58D6D447/58E5662B) + (attr smd) (fp_text reference U9 (at -8.366 13.85 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) - (fp_text value ESP-WROOM-32 (at 5.715 -14.224 180) (layer B.Fab) + (fp_text value ESP-WROOM32 (at 5.715 -14.224 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text user "Espressif Systems" (at -6.858 0.889 90) (layer B.SilkS) @@ -2349,12 +2350,12 @@ (at 160.14 74.12 90) (descr "4x-dip-switch, Slide, row spacing 8.61 mm (338 mils), SMD, LowProfile") (tags "DIP Switch Slide 8.61mm 338mil SMD LowProfile") - (path /58D6547C/595B94DC) + (path /58D6547C/5B1DD3B8) (attr smd) (fp_text reference SW1 (at -4.59 -7.224) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.25))) ) - (fp_text value DIPSW (at 0 6.98 90) (layer F.Fab) + (fp_text value SW_DIP_x04 (at 0 6.98 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -2.34 -5.86) (end 3.34 -5.86) (layer F.Fab) (width 0.1)) @@ -4441,7 +4442,7 @@ (tags capacitor) (path /58D51CAD/59246E14) (attr smd) - (fp_text reference C20 (at -2.703 -0.065) (layer B.SilkS) + (fp_text reference C20 (at -2.83 -0.065) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 2.2uF (at 0 -1.85 270) (layer B.Fab) @@ -4657,7 +4658,7 @@ (tags capacitor) (path /58D51CAD/5A5F91FE) (attr smd) - (fp_text reference C26 (at -3.192 -0.052 270) (layer B.SilkS) + (fp_text reference C26 (at -3.319 -0.052 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 22nF (at 0 -1.65 270) (layer B.Fab) @@ -4801,7 +4802,7 @@ (tags capacitor) (path /58D51CAD/5A5FC402) (attr smd) - (fp_text reference C30 (at 0.009 1.288 270) (layer B.SilkS) + (fp_text reference C30 (at 0.136 1.288 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 22nF (at 0 -1.65 270) (layer B.Fab) @@ -4837,7 +4838,7 @@ (tags capacitor) (path /58D51CAD/5A5FEEA6) (attr smd) - (fp_text reference C31 (at -2.869 0.069) (layer B.SilkS) + (fp_text reference C31 (at -2.869 -0.058) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 22nF (at 0 -1.65) (layer B.Fab) @@ -5593,7 +5594,7 @@ (tags capacitor) (path /58D51CAD/5AC310F3) (attr smd) - (fp_text reference C53 (at 2.8842 0 180) (layer B.SilkS) + (fp_text reference C53 (at 2.8842 -0.127 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_text value 22nF (at 0 -1.65 180) (layer B.Fab) @@ -9751,7 +9752,7 @@ (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator") (tags "resistor handsolder") (path /58D51CAD/5AF31FAC) - (attr smd) + (attr virtual) (fp_text reference RV2 (at 0.254 -1.65) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) @@ -9785,7 +9786,7 @@ (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator") (tags "resistor handsolder") (path /58D51CAD/5AF3694A) - (attr smd) + (attr virtual) (fp_text reference RV3 (at 0 -1.65) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) @@ -10063,7 +10064,7 @@ (at 115.07 65.629 180) (descr "Imported from /home/davor/tmp/koncar/koncar.svg") (tags svg2mod) - (attr smd) + (attr virtual) (fp_text reference svg2mod (at 0 4.407697 180) (layer B.SilkS) hide (effects (font (size 1.524 1.524) (thickness 0.3048)) (justify mirror)) ) @@ -10215,7 +10216,7 @@ (gr_line (start 138.057 84.679) (end 134.628 84.679) (layer B.SilkS) (width 0.2)) (gr_line (start 138.311 84.933) (end 138.057 84.679) (layer B.SilkS) (width 0.2)) (gr_line (start 138.057 89.378) (end 138.438 89.886) (layer B.SilkS) (width 0.2)) - (gr_line (start 132.215 89.378) (end 138.057 89.378) (layer B.SilkS) (width 0.2)) + (gr_line (start 132.342 89.378) (end 138.057 89.378) (layer B.SilkS) (width 0.2) (tstamp 5B1E2C48)) (gr_circle (center 153.551 76.551) (end 153.678 76.551) (layer F.SilkS) (width 0.2) (tstamp 5B1AF3C4)) (gr_circle (center 179.459 103.475) (end 179.586 103.475) (layer F.SilkS) (width 0.2)) (gr_text 9 (at 99.703 95.728) (layer B.SilkS) (tstamp 5B283687) @@ -10881,7 +10882,7 @@ (gr_text +3.3V (at 131.072 84.552) (layer B.SilkS) (effects (font (size 1.5 1.5) (thickness 0.3)) (justify mirror)) ) - (gr_text +1.1V (at 128.659 89.251) (layer B.SilkS) + (gr_text +1.1V (at 128.786 89.251) (layer B.SilkS) (tstamp 5B1E2555) (effects (font (size 1.5 1.5) (thickness 0.3)) (justify mirror)) ) (gr_text TCK (at 142.233 107.14 90) (layer B.SilkS) @@ -15859,7 +15860,7 @@ (segment (start 130.422 73.898) (end 129.622 73.898) (width 0.3) (layer B.Cu) (net 317)) (segment (start 129.622 73.898) (end 128.532 72.808) (width 0.3) (layer B.Cu) (net 317)) - (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B1BE106) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B1D7522) (hatch edge 0.508) (connect_pads (clearance 0.254)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -17721,7 +17722,7 @@ ) ) ) - (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B1BE103) (hatch edge 0.508) + (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B1D751F) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -17787,7 +17788,7 @@ ) ) ) - (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B1BE100) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B1D751C) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.1) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -18979,7 +18980,7 @@ ) ) ) - (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B1BE0FD) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B1D7519) (hatch edge 0.508) (connect_pads (clearance 0.254)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20097,7 +20098,7 @@ ) ) ) - (zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1BE0FA) (hatch edge 0.508) + (zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1D7516) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.127) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20348,7 +20349,7 @@ ) ) ) - (zone (net 170) (net_name +1V1) (layer In1.Cu) (tstamp 5B1BE0F7) (hatch edge 0.508) + (zone (net 170) (net_name +1V1) (layer In1.Cu) (tstamp 5B1D7513) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20425,7 +20426,7 @@ ) ) ) - (zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1BE0F4) (hatch edge 0.508) + (zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1D7510) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.127) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20589,7 +20590,7 @@ ) ) ) - (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B1BE0F1) (hatch edge 0.508) + (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B1D750D) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.127) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))