From 321f82dc8661f170798a21c93fc65812e7ee5edc Mon Sep 17 00:00:00 2001
From: Emard <vordah@gmail.com>
Date: Thu, 2 Aug 2018 17:11:32 +0200
Subject: [PATCH] BGA layout updated with refernce to lattice document TN1074:
 PCB Layout Recommendations for BGA Packages

---
 doc/bga-layout.txt | 8 ++++++--
 1 file changed, 6 insertions(+), 2 deletions(-)

diff --git a/doc/bga-layout.txt b/doc/bga-layout.txt
index ca4d916..cd0b742 100644
--- a/doc/bga-layout.txt
+++ b/doc/bga-layout.txt
@@ -1,4 +1,8 @@
 for proper placing ground and power planes, see
-TN1074 - PCB Layout Recommendations for BGA Packages, page 32
-example for BGA 381 ECP5
+TN1074 - PCB Layout Recommendations for BGA Packages
+page 1: table 1: row 0.8 ball pitch, 756/554/381/400 caBGA
+Pad copper diameter:  0.4  mm
+Solder mask opening:  0.5  mm
+Solder land diameter: 0.35 mm (solder paste = stencil opening)
+page 32: example for BGA 381 ECP5