From 3eabc3d722a478fa8f47681b9dd55c008455c3fb Mon Sep 17 00:00:00 2001 From: Emard Date: Wed, 12 Sep 2018 21:22:38 +0200 Subject: [PATCH] PCB: ft231x enlarged silkscreen outline --- ulx3s.kicad_pcb | 174 +++++++++++++++++++++--------------------- ulx3s.kicad_pcb-bak | 180 ++++++++++++++++++++++---------------------- 2 files changed, 177 insertions(+), 177 deletions(-) diff --git a/ulx3s.kicad_pcb b/ulx3s.kicad_pcb index de0253f..ef4ac63 100644 --- a/ulx3s.kicad_pcb +++ b/ulx3s.kicad_pcb @@ -664,6 +664,85 @@ (add_net 2V5_3V3) ) + (module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 5B9966E3) (tstamp 5B2637EB) + (at 132.835 107.14 180) + (descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)") + (tags "FT231X SSOP 0.65") + (path /58D6BF46/58EB61C6) + (attr smd) + (fp_text reference U6 (at -3.556 4.318 180) (layer B.SilkS) + (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) + ) + (fp_text value FT231XS (at -0.045 -4.86 180) (layer B.Fab) hide + (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) + ) + (fp_line (start 2.286 -4.064) (end 2.286 -3.429) (layer B.SilkS) (width 0.15)) + (fp_line (start -2.286 -4.064) (end 2.286 -4.064) (layer B.SilkS) (width 0.15)) + (fp_line (start -2.286 -3.429) (end -2.286 -4.064) (layer B.SilkS) (width 0.15)) + (fp_line (start -2.286 3.429) (end -3.302 3.429) (layer B.SilkS) (width 0.15)) + (fp_line (start -2.286 4.064) (end -2.286 3.429) (layer B.SilkS) (width 0.15)) + (fp_line (start -0.508 4.064) (end -2.286 4.064) (layer B.SilkS) (width 0.15)) + (fp_line (start 2.286 4.064) (end 2.286 3.429) (layer B.SilkS) (width 0.15)) + (fp_line (start 0.508 4.064) (end 2.286 4.064) (layer B.SilkS) (width 0.15)) + (fp_arc (start 0 4.064) (end -0.508 4.064) (angle 180) (layer B.SilkS) (width 0.15)) + (fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05)) + (fp_line (start -3.65 3.55) (end 3.65 3.55) (layer B.CrtYd) (width 0.05)) + (fp_line (start 3.65 3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05)) + (fp_line (start -3.65 3.55) (end -3.65 -3.55) (layer B.CrtYd) (width 0.05)) + (fp_line (start -2.2 2.25) (end -1.2 3.25) (layer B.Fab) (width 0.15)) + (fp_line (start -2.2 -3.25) (end -2.2 2.25) (layer B.Fab) (width 0.15)) + (fp_line (start 2.2 -3.25) (end -2.2 -3.25) (layer B.Fab) (width 0.15)) + (fp_line (start 2.2 3.25) (end 2.2 -3.25) (layer B.Fab) (width 0.15)) + (fp_line (start -1.2 3.25) (end 2.2 3.25) (layer B.Fab) (width 0.15)) + (fp_text user %R (at 0 0 180) (layer B.Fab) + (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) + ) + (pad 20 smd oval (at 2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 94 FTDI_TXD)) + (pad 19 smd oval (at 2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 122 FTDI_nSLEEP)) + (pad 18 smd oval (at 2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 160 FTDI_TXDEN)) + (pad 17 smd oval (at 2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)) + (pad 16 smd oval (at 2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 1 GND)) + (pad 15 smd oval (at 2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 38 USB5V)) + (pad 14 smd oval (at 2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 40 nRESET)) + (pad 13 smd oval (at 2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 173 FT2V5)) + (pad 12 smd oval (at 2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 100 USB_FTDI_D-)) + (pad 11 smd oval (at 2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 99 USB_FTDI_D+)) + (pad 10 smd oval (at -2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 121 FTDI_nTXLED)) + (pad 9 smd oval (at -2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 21 JTAG_TDO)) + (pad 8 smd oval (at -2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 20 JTAG_TMS)) + (pad 7 smd oval (at -2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 19 JTAG_TCK)) + (pad 6 smd oval (at -2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 1 GND)) + (pad 5 smd oval (at -2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 18 JTAG_TDI)) + (pad 4 smd oval (at -2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 95 FTDI_RXD)) + (pad 3 smd oval (at -2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 173 FT2V5)) + (pad 2 smd oval (at -2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 93 FTDI_nRTS)) + (pad 1 smd rect (at -2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 41 FTDI_nDTR)) + (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl + (at (xyz 0 0 0)) + (scale (xyz 1 1 1)) + (rotate (xyz 0 0 0)) + ) + ) + (module Capacitor_SMD:C_0603_1608Metric (layer F.Cu) (tedit 5B301BBE) (tstamp 5AF6F50B) (at 151.758 75.771 90) (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator") @@ -6345,85 +6424,6 @@ ) ) - (module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 5B937925) (tstamp 5B2637EB) - (at 132.835 107.14 180) - (descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)") - (tags "FT231X SSOP 0.65") - (path /58D6BF46/58EB61C6) - (attr smd) - (fp_text reference U6 (at -3.556 4.318 180) (layer B.SilkS) - (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) - ) - (fp_text value FT231XS (at -0.045 -4.86 180) (layer B.Fab) hide - (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) - ) - (fp_line (start 2.286 -3.81) (end 2.286 -3.429) (layer B.SilkS) (width 0.15)) - (fp_line (start -2.286 -3.81) (end 2.286 -3.81) (layer B.SilkS) (width 0.15)) - (fp_line (start -2.286 -3.429) (end -2.286 -3.81) (layer B.SilkS) (width 0.15)) - (fp_line (start -2.286 3.429) (end -3.302 3.429) (layer B.SilkS) (width 0.15)) - (fp_line (start -2.286 3.81) (end -2.286 3.429) (layer B.SilkS) (width 0.15)) - (fp_line (start -0.508 3.81) (end -2.286 3.81) (layer B.SilkS) (width 0.15)) - (fp_line (start 2.286 3.81) (end 2.286 3.429) (layer B.SilkS) (width 0.15)) - (fp_line (start 0.508 3.81) (end 2.286 3.81) (layer B.SilkS) (width 0.15)) - (fp_arc (start 0 3.81) (end -0.508 3.81) (angle 180) (layer B.SilkS) (width 0.15)) - (fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05)) - (fp_line (start -3.65 3.55) (end 3.65 3.55) (layer B.CrtYd) (width 0.05)) - (fp_line (start 3.65 3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05)) - (fp_line (start -3.65 3.55) (end -3.65 -3.55) (layer B.CrtYd) (width 0.05)) - (fp_line (start -2.2 2.25) (end -1.2 3.25) (layer B.Fab) (width 0.15)) - (fp_line (start -2.2 -3.25) (end -2.2 2.25) (layer B.Fab) (width 0.15)) - (fp_line (start 2.2 -3.25) (end -2.2 -3.25) (layer B.Fab) (width 0.15)) - (fp_line (start 2.2 3.25) (end 2.2 -3.25) (layer B.Fab) (width 0.15)) - (fp_line (start -1.2 3.25) (end 2.2 3.25) (layer B.Fab) (width 0.15)) - (fp_text user %R (at 0 0 180) (layer B.Fab) - (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) - ) - (pad 20 smd oval (at 2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 94 FTDI_TXD)) - (pad 19 smd oval (at 2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 122 FTDI_nSLEEP)) - (pad 18 smd oval (at 2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 160 FTDI_TXDEN)) - (pad 17 smd oval (at 2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)) - (pad 16 smd oval (at 2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 1 GND)) - (pad 15 smd oval (at 2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 38 USB5V)) - (pad 14 smd oval (at 2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 40 nRESET)) - (pad 13 smd oval (at 2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 173 FT2V5)) - (pad 12 smd oval (at 2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 100 USB_FTDI_D-)) - (pad 11 smd oval (at 2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 99 USB_FTDI_D+)) - (pad 10 smd oval (at -2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 121 FTDI_nTXLED)) - (pad 9 smd oval (at -2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 21 JTAG_TDO)) - (pad 8 smd oval (at -2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 20 JTAG_TMS)) - (pad 7 smd oval (at -2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 19 JTAG_TCK)) - (pad 6 smd oval (at -2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 1 GND)) - (pad 5 smd oval (at -2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 18 JTAG_TDI)) - (pad 4 smd oval (at -2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 95 FTDI_RXD)) - (pad 3 smd oval (at -2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 173 FT2V5)) - (pad 2 smd oval (at -2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 93 FTDI_nRTS)) - (pad 1 smd rect (at -2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 41 FTDI_nDTR)) - (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl - (at (xyz 0 0 0)) - (scale (xyz 1 1 1)) - (rotate (xyz 0 0 0)) - ) - ) - (module usb_otg:USB-MICRO-B-FCI-10118192-0001LF (layer F.Cu) (tedit 5B1AC2A8) (tstamp 5B24ABD3) (at 111.88 63.325 180) (path /58D6BF46/58D6C840) @@ -16627,7 +16627,7 @@ (segment (start 138.08 97.88801) (end 138.114991 97.923001) (width 0.127) (layer In1.Cu) (net 271)) (segment (start 133.68 89.4) (end 136.340188 92.060188) (width 0.127) (layer In1.Cu) (net 271)) - (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B994501) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B996B9A) (hatch edge 0.508) (connect_pads (clearance 0.254)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -18574,7 +18574,7 @@ ) ) ) - (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B9944FE) (hatch edge 0.508) + (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B996B97) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -18641,7 +18641,7 @@ ) ) ) - (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B9944FB) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B996B94) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.126) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20078,7 +20078,7 @@ ) ) ) - (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B9944F8) (hatch edge 0.508) + (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B996B91) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.126) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20338,7 +20338,7 @@ ) ) ) - (zone (net 169) (net_name +1V1) (layer In1.Cu) (tstamp 5B9944F5) (hatch edge 0.508) + (zone (net 169) (net_name +1V1) (layer In1.Cu) (tstamp 5B996B8E) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20428,7 +20428,7 @@ ) ) ) - (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B9944F2) (hatch edge 0.508) + (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B996B8B) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.127) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20585,7 +20585,7 @@ ) ) ) - (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B9944EF) (hatch edge 0.508) + (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B996B88) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.126) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -22025,7 +22025,7 @@ ) ) ) - (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B9944EC) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B996B85) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) diff --git a/ulx3s.kicad_pcb-bak b/ulx3s.kicad_pcb-bak index 1546c59..69c3c13 100644 --- a/ulx3s.kicad_pcb-bak +++ b/ulx3s.kicad_pcb-bak @@ -11,9 +11,9 @@ (page A4) (layers - (0 F.Cu signal hide) - (1 In1.Cu signal hide) - (2 In2.Cu signal hide) + (0 F.Cu signal) + (1 In1.Cu signal) + (2 In2.Cu signal) (31 B.Cu signal) (32 B.Adhes user) (33 F.Adhes user) @@ -664,6 +664,85 @@ (add_net 2V5_3V3) ) + (module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 5B9965A8) (tstamp 5B2637EB) + (at 132.835 107.14 180) + (descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)") + (tags "FT231X SSOP 0.65") + (path /58D6BF46/58EB61C6) + (attr smd) + (fp_text reference U6 (at -3.556 4.318 180) (layer B.SilkS) + (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) + ) + (fp_text value FT231XS (at -0.045 -4.86 180) (layer B.Fab) hide + (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) + ) + (fp_line (start 2.286 -4.318) (end 2.286 -3.429) (layer B.SilkS) (width 0.15)) + (fp_line (start -2.286 -4.318) (end 2.286 -4.318) (layer B.SilkS) (width 0.15)) + (fp_line (start -2.286 -3.429) (end -2.286 -4.318) (layer B.SilkS) (width 0.15)) + (fp_line (start -2.286 3.429) (end -3.302 3.429) (layer B.SilkS) (width 0.15)) + (fp_line (start -2.286 4.318) (end -2.286 3.429) (layer B.SilkS) (width 0.15)) + (fp_line (start -0.508 4.318) (end -2.286 4.318) (layer B.SilkS) (width 0.15)) + (fp_line (start 2.286 4.318) (end 2.286 3.429) (layer B.SilkS) (width 0.15)) + (fp_line (start 0.508 4.318) (end 2.286 4.318) (layer B.SilkS) (width 0.15)) + (fp_arc (start 0 4.318) (end -0.508 4.318) (angle 180) (layer B.SilkS) (width 0.15)) + (fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05)) + (fp_line (start -3.65 3.55) (end 3.65 3.55) (layer B.CrtYd) (width 0.05)) + (fp_line (start 3.65 3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05)) + (fp_line (start -3.65 3.55) (end -3.65 -3.55) (layer B.CrtYd) (width 0.05)) + (fp_line (start -2.2 2.25) (end -1.2 3.25) (layer B.Fab) (width 0.15)) + (fp_line (start -2.2 -3.25) (end -2.2 2.25) (layer B.Fab) (width 0.15)) + (fp_line (start 2.2 -3.25) (end -2.2 -3.25) (layer B.Fab) (width 0.15)) + (fp_line (start 2.2 3.25) (end 2.2 -3.25) (layer B.Fab) (width 0.15)) + (fp_line (start -1.2 3.25) (end 2.2 3.25) (layer B.Fab) (width 0.15)) + (fp_text user %R (at 0 0 180) (layer B.Fab) + (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) + ) + (pad 20 smd oval (at 2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 94 FTDI_TXD)) + (pad 19 smd oval (at 2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 122 FTDI_nSLEEP)) + (pad 18 smd oval (at 2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 160 FTDI_TXDEN)) + (pad 17 smd oval (at 2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)) + (pad 16 smd oval (at 2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 1 GND)) + (pad 15 smd oval (at 2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 38 USB5V)) + (pad 14 smd oval (at 2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 40 nRESET)) + (pad 13 smd oval (at 2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 173 FT2V5)) + (pad 12 smd oval (at 2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 100 USB_FTDI_D-)) + (pad 11 smd oval (at 2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 99 USB_FTDI_D+)) + (pad 10 smd oval (at -2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 121 FTDI_nTXLED)) + (pad 9 smd oval (at -2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 21 JTAG_TDO)) + (pad 8 smd oval (at -2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 20 JTAG_TMS)) + (pad 7 smd oval (at -2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 19 JTAG_TCK)) + (pad 6 smd oval (at -2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 1 GND)) + (pad 5 smd oval (at -2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 18 JTAG_TDI)) + (pad 4 smd oval (at -2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 95 FTDI_RXD)) + (pad 3 smd oval (at -2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 173 FT2V5)) + (pad 2 smd oval (at -2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 93 FTDI_nRTS)) + (pad 1 smd rect (at -2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) + (net 41 FTDI_nDTR)) + (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl + (at (xyz 0 0 0)) + (scale (xyz 1 1 1)) + (rotate (xyz 0 0 0)) + ) + ) + (module Capacitor_SMD:C_0603_1608Metric (layer F.Cu) (tedit 5B301BBE) (tstamp 5AF6F50B) (at 151.758 75.771 90) (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator") @@ -6345,85 +6424,6 @@ ) ) - (module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 5B937925) (tstamp 5B2637EB) - (at 132.835 107.14 180) - (descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)") - (tags "FT231X SSOP 0.65") - (path /58D6BF46/58EB61C6) - (attr smd) - (fp_text reference U6 (at -3.556 4.318 180) (layer B.SilkS) - (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) - ) - (fp_text value FT231XS (at -0.045 -4.86 180) (layer B.Fab) hide - (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) - ) - (fp_line (start 2.286 -3.81) (end 2.286 -3.429) (layer B.SilkS) (width 0.15)) - (fp_line (start -2.286 -3.81) (end 2.286 -3.81) (layer B.SilkS) (width 0.15)) - (fp_line (start -2.286 -3.429) (end -2.286 -3.81) (layer B.SilkS) (width 0.15)) - (fp_line (start -2.286 3.429) (end -3.302 3.429) (layer B.SilkS) (width 0.15)) - (fp_line (start -2.286 3.81) (end -2.286 3.429) (layer B.SilkS) (width 0.15)) - (fp_line (start -0.508 3.81) (end -2.286 3.81) (layer B.SilkS) (width 0.15)) - (fp_line (start 2.286 3.81) (end 2.286 3.429) (layer B.SilkS) (width 0.15)) - (fp_line (start 0.508 3.81) (end 2.286 3.81) (layer B.SilkS) (width 0.15)) - (fp_arc (start 0 3.81) (end -0.508 3.81) (angle 180) (layer B.SilkS) (width 0.15)) - (fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05)) - (fp_line (start -3.65 3.55) (end 3.65 3.55) (layer B.CrtYd) (width 0.05)) - (fp_line (start 3.65 3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05)) - (fp_line (start -3.65 3.55) (end -3.65 -3.55) (layer B.CrtYd) (width 0.05)) - (fp_line (start -2.2 2.25) (end -1.2 3.25) (layer B.Fab) (width 0.15)) - (fp_line (start -2.2 -3.25) (end -2.2 2.25) (layer B.Fab) (width 0.15)) - (fp_line (start 2.2 -3.25) (end -2.2 -3.25) (layer B.Fab) (width 0.15)) - (fp_line (start 2.2 3.25) (end 2.2 -3.25) (layer B.Fab) (width 0.15)) - (fp_line (start -1.2 3.25) (end 2.2 3.25) (layer B.Fab) (width 0.15)) - (fp_text user %R (at 0 0 180) (layer B.Fab) - (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) - ) - (pad 20 smd oval (at 2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 94 FTDI_TXD)) - (pad 19 smd oval (at 2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 122 FTDI_nSLEEP)) - (pad 18 smd oval (at 2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 160 FTDI_TXDEN)) - (pad 17 smd oval (at 2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)) - (pad 16 smd oval (at 2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 1 GND)) - (pad 15 smd oval (at 2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 38 USB5V)) - (pad 14 smd oval (at 2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 40 nRESET)) - (pad 13 smd oval (at 2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 173 FT2V5)) - (pad 12 smd oval (at 2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 100 USB_FTDI_D-)) - (pad 11 smd oval (at 2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 99 USB_FTDI_D+)) - (pad 10 smd oval (at -2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 121 FTDI_nTXLED)) - (pad 9 smd oval (at -2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 21 JTAG_TDO)) - (pad 8 smd oval (at -2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 20 JTAG_TMS)) - (pad 7 smd oval (at -2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 19 JTAG_TCK)) - (pad 6 smd oval (at -2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 1 GND)) - (pad 5 smd oval (at -2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 18 JTAG_TDI)) - (pad 4 smd oval (at -2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 95 FTDI_RXD)) - (pad 3 smd oval (at -2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 173 FT2V5)) - (pad 2 smd oval (at -2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 93 FTDI_nRTS)) - (pad 1 smd rect (at -2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask) - (net 41 FTDI_nDTR)) - (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl - (at (xyz 0 0 0)) - (scale (xyz 1 1 1)) - (rotate (xyz 0 0 0)) - ) - ) - (module usb_otg:USB-MICRO-B-FCI-10118192-0001LF (layer F.Cu) (tedit 5B1AC2A8) (tstamp 5B24ABD3) (at 111.88 63.325 180) (path /58D6BF46/58D6C840) @@ -16627,7 +16627,7 @@ (segment (start 138.08 97.88801) (end 138.114991 97.923001) (width 0.127) (layer In1.Cu) (net 271)) (segment (start 133.68 89.4) (end 136.340188 92.060188) (width 0.127) (layer In1.Cu) (net 271)) - (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5BA19499) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B996B9A) (hatch edge 0.508) (connect_pads (clearance 0.254)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -18574,7 +18574,7 @@ ) ) ) - (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5BA19496) (hatch edge 0.508) + (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B996B97) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -18641,7 +18641,7 @@ ) ) ) - (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5BA19493) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B996B94) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.126) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20078,7 +20078,7 @@ ) ) ) - (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5BA19490) (hatch edge 0.508) + (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B996B91) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.126) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20338,7 +20338,7 @@ ) ) ) - (zone (net 169) (net_name +1V1) (layer In1.Cu) (tstamp 5BA1948D) (hatch edge 0.508) + (zone (net 169) (net_name +1V1) (layer In1.Cu) (tstamp 5B996B8E) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20428,7 +20428,7 @@ ) ) ) - (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5BA1948A) (hatch edge 0.508) + (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B996B8B) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.127) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20585,7 +20585,7 @@ ) ) ) - (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5BA19487) (hatch edge 0.508) + (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B996B88) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.126) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -22025,7 +22025,7 @@ ) ) ) - (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5BA19484) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B996B85) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))