From 6d2a9badd440664695e593ca533f9b838c857d6c Mon Sep 17 00:00:00 2001 From: Emard Date: Fri, 6 Jul 2018 00:41:54 +0200 Subject: [PATCH] PCB: change RTC PCF8523 -> MCP7940NT --- ulx3s.kicad_pcb | 18 +++++++++--------- ulx3s.kicad_pcb-bak | 12 ++++++------ 2 files changed, 15 insertions(+), 15 deletions(-) diff --git a/ulx3s.kicad_pcb b/ulx3s.kicad_pcb index 59469c8..d648143 100644 --- a/ulx3s.kicad_pcb +++ b/ulx3s.kicad_pcb @@ -1346,7 +1346,7 @@ (fp_text reference U7 (at 2.032 -3.937 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) - (fp_text value PCF8523 (at 1.27 -6.35 180) (layer B.Fab) + (fp_text value MCP7940NT (at 1.27 -6.35 180) (layer B.Fab) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) (fp_line (start -0.95 2.45) (end 1.95 2.45) (layer B.Fab) (width 0.15)) @@ -16238,7 +16238,7 @@ (segment (start 166.251 89.886) (end 166.251 89.162) (width 0.3) (layer B.Cu) (net 318)) (segment (start 167.267 90.902) (end 166.251 89.886) (width 0.3) (layer B.Cu) (net 318)) - (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B621D88) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B3E9FCF) (hatch edge 0.508) (connect_pads (clearance 0.254)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -18108,7 +18108,7 @@ ) ) ) - (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B621D85) (hatch edge 0.508) + (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B3E9FCC) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -18174,7 +18174,7 @@ ) ) ) - (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B621D82) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B3E9FC9) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.1) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -19527,7 +19527,7 @@ ) ) ) - (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B621D7F) (hatch edge 0.508) + (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B3E9FC6) (hatch edge 0.508) (connect_pads (clearance 0.254)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -20779,7 +20779,7 @@ ) ) ) - (zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B621D7C) (hatch edge 0.508) + (zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B3E9FC3) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.127) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -21030,7 +21030,7 @@ ) ) ) - (zone (net 170) (net_name +1V1) (layer In1.Cu) (tstamp 5B621D79) (hatch edge 0.508) + (zone (net 170) (net_name +1V1) (layer In1.Cu) (tstamp 5B3E9FC0) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.254) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -21107,7 +21107,7 @@ ) ) ) - (zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B621D76) (hatch edge 0.508) + (zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B3E9FBD) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.127) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) @@ -21264,7 +21264,7 @@ ) ) ) - (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B621D73) (hatch edge 0.508) + (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B3E9FBA) (hatch edge 0.508) (connect_pads (clearance 0.127)) (min_thickness 0.127) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) diff --git a/ulx3s.kicad_pcb-bak b/ulx3s.kicad_pcb-bak index fd8f5ef..59469c8 100644 --- a/ulx3s.kicad_pcb-bak +++ b/ulx3s.kicad_pcb-bak @@ -762,7 +762,7 @@ (descr "Diode SMA (DO-214AC)") (tags "Diode SMA (DO-214AC)") (path /56AC389C/56AC4846) - (attr smd) + (attr virtual) (fp_text reference RD52 (at -4.064 0.127) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) @@ -808,7 +808,7 @@ (descr "Diode SMA (DO-214AC)") (tags "Diode SMA (DO-214AC)") (path /56AC389C/56AC483B) - (attr smd) + (attr virtual) (fp_text reference RD51 (at 4.191 0.127 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) @@ -854,7 +854,7 @@ (descr "Diode SMA (DO-214AC)") (tags "Diode SMA (DO-214AC)") (path /58D6BF46/58D6C83C) - (attr smd) + (attr virtual) (fp_text reference RD9 (at 0.889 -2.54 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) @@ -900,7 +900,7 @@ (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator") (tags "resistor handsolder") (path /58D51CAD/59DFB617) - (attr smd) + (attr virtual) (fp_text reference RP2 (at -0.635 1.651 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) @@ -10371,7 +10371,7 @@ (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator") (tags "resistor handsolder") (path /58D51CAD/59DFB08A) - (attr smd) + (attr virtual) (fp_text reference RP1 (at 0 1.65 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) ) @@ -10408,7 +10408,7 @@ (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator") (tags "resistor handsolder") (path /58D51CAD/59DFBF34) - (attr smd) + (attr virtual) (fp_text reference RP3 (at 0 3.414 270) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) )