@ -2,7 +2,7 @@
(general
(thickness 1.6)
(drawings 480 )
(drawings 492 )
(tracks 4878)
(zones 0)
(modules 210)
@ -753,44 +753,131 @@
(uvia_drill 0.1)
)
(module inem:inem (layer B.Cu) (tedit 5B1A69A8) (tstamp 5B248F4A)
(at 128.913 65.883)
(fp_text reference REF** (at 0 -1.6) (layer B.SilkS) hide
(module SM8:SM8 (layer B.Cu) (tedit 5B1AB739) (tstamp 5B17ED8A)
(at 144.68 65.8015 90)
(descr "TI SM8 SOIC-8 150 mil")
(tags "SOIC-8 1.27 150 mil SOT96-1")
(path /58D686D9/5B01C6B5)
(attr smd)
(fp_text reference U11 (at 3.3475 -0.019 -180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value inem (at 0 1.6) (layer B.Fab) hide
(fp_text value PCA9306D (at 4.318 -5.588 -180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user inem (at 0 -0.1) (layer B.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify mirror))
(fp_line (start -2.45 1.95) (end 2.45 1.95) (layer B.Fab) (width 0.15))
(fp_line (start 2.45 1.95) (end 2.45 -1.95) (layer B.Fab) (width 0.15))
(fp_line (start 2.45 -1.95) (end -1.45 -1.95) (layer B.Fab) (width 0.15))
(fp_line (start -1.45 -1.95) (end -2.45 -0.95) (layer B.Fab) (width 0.15))
(fp_line (start -2.75 -3.75) (end 2.75 -3.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.75 3.75) (end 2.75 3.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.75 -3.75) (end -2.75 3.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 2.75 -3.75) (end 2.75 3.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.54 -0.635) (end -2.54 -3.302) (layer B.SilkS) (width 0.15))
(fp_line (start -2.54 0.635) (end -2.54 2.032) (layer B.SilkS) (width 0.15))
(fp_line (start 2.54 2.032) (end 2.54 -2.032) (layer B.SilkS) (width 0.15))
(fp_arc (start -2.54 0) (end -2.54 -0.635) (angle 180) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -1.905 -2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 2 smd oval (at -0.635 -2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 3 smd oval (at 0.635 -2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 262 FPDI_SCL))
(pad 4 smd oval (at 1.905 -2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 261 FPDI_SDA))
(pad 5 smd oval (at 1.905 2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 33 GPDI_SDA))
(pad 6 smd oval (at 0.635 2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 34 GPDI_SCL))
(pad 7 smd oval (at -0.635 2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 35 /gpdi/VREF2))
(pad 8 smd oval (at -1.905 2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 35 /gpdi/VREF2))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
(fp_circle (center 0 0) (end 3 0) (layer B.SilkS) (width 0.3))
)
(module fer:fer4mm6 (layer F.Cu) (tedit 5B1A6576) (tstamp 5B25673B)
(at 159.901 64.994)
(descr FER)
(tags fer)
(fp_text reference fer (at 0 -3.6) (layer F.SilkS) hide
(effects (font (size 1.524 1.524) (thickness 0.3048)))
(module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 5B1AB69B) (tstamp 5B2637EB)
(at 132.835 107.14 180)
(descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
(tags "FT231X SSOP 0.65")
(path /58D6BF46/58EB61C6)
(attr smd)
(fp_text reference U6 (at -3.556 4.318 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value fer (at 0 3.6) (layer F.SilkS) hide
(effects (font (size 1.524 1.524) (thickness 0.3048)))
(fp_text value FT231XS (at 0 -5.334 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start 2.286 -3.81) (end 2.286 -3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -3.81) (end 2.286 -3.81) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -3.429) (end -2.286 -3.81) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 3.429) (end -3.302 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 3.81) (end -2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -0.508 3.81) (end -2.286 3.81) (layer B.SilkS) (width 0.15))
(fp_line (start 2.286 3.81) (end 2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start 0.508 3.81) (end 2.286 3.81) (layer B.SilkS) (width 0.15))
(fp_arc (start 0 3.81) (end -0.508 3.81) (angle 180) (layer B.SilkS) (width 0.15))
(fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end 3.65 3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start 3.65 3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end -3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.2 2.25) (end -1.2 3.25) (layer B.Fab) (width 0.15))
(fp_line (start -2.2 -3.25) (end -2.2 2.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 -3.25) (end -2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 3.25) (end 2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start -1.2 3.25) (end 2.2 3.25) (layer B.Fab) (width 0.15))
(pad 20 smd rect (at 2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 96 FTDI_TXD))
(pad 19 smd rect (at 2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 124 FTDI_nSLEEP))
(pad 18 smd rect (at 2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 163 FTDI_TXDEN))
(pad 17 smd rect (at 2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 295 FTDI_nRXLED))
(pad 16 smd rect (at 2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 15 smd rect (at 2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 40 USB5V))
(pad 14 smd rect (at 2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 42 nRESET))
(pad 13 smd rect (at 2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 176 FT2V5))
(pad 12 smd rect (at 2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 102 USB_FTDI_D-))
(pad 11 smd rect (at 2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 101 USB_FTDI_D+))
(pad 10 smd rect (at -2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 123 FTDI_nTXLED))
(pad 9 smd rect (at -2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 21 JTAG_TDO))
(pad 8 smd rect (at -2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 20 JTAG_TMS))
(pad 7 smd rect (at -2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 19 JTAG_TCK))
(pad 6 smd rect (at -2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd rect (at -2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 18 JTAG_TDI))
(pad 4 smd rect (at -2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 97 FTDI_RXD))
(pad 3 smd rect (at -2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 176 FT2V5))
(pad 2 smd rect (at -2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 95 FTDI_nRTS))
(pad 1 smd rect (at -2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 43 FTDI_nDTR))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
(fp_line (start 4.2 1) (end 4.2 1.6) (layer F.SilkS) (width 1))
(fp_arc (start 3.4 0.8) (end 3.4 0) (angle 90) (layer F.SilkS) (width 1))
(fp_arc (start 3.4 -0.8) (end 3.4 -1.6) (angle 180) (layer F.SilkS) (width 1))
(fp_line (start 2.4 0) (end 3.4 0) (layer F.SilkS) (width 1))
(fp_line (start 2.4 -1.6) (end 3.4 -1.6) (layer F.SilkS) (width 1))
(fp_line (start -4 -1.6) (end -4 1.6) (layer F.SilkS) (width 1))
(fp_line (start -1 1.6) (end 1.2 1.6) (layer F.SilkS) (width 1))
(fp_line (start -1 0) (end 1.2 0) (layer F.SilkS) (width 1))
(fp_line (start -1 -1.6) (end 1.2 -1.6) (layer F.SilkS) (width 1))
(fp_line (start -4 -1.6) (end -2.2 -1.6) (layer F.SilkS) (width 1))
(fp_line (start -4 0) (end -2.2 0) (layer F.SilkS) (width 1))
)
(module SOA008-150mil:SOA008-150-208mil (layer B.Cu) (tedit 5B1925F8) (tstamp 5B3C9488)
(module SOA008-150mil:SOA008-150-208mil (layer B.Cu) (tedit 5B1AB188) (tstamp 5B3C9488)
(at 118.245 85.822 270)
(descr "Cypress SOA008 SOIC-8 150/208 mil")
(tags "SOA008 SOIC-8 1.27 150 208 mil")
@ -802,9 +889,6 @@
(fp_text value IS25LP128F-JBLE (at 5.08 0) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_circle (center -0.9525 2.286) (end -0.889 2.2225) (layer B.SilkS) (width 0.15))
(fp_line (start -1.778 -2.54) (end -1.778 2.54) (layer B.SilkS) (width 0.15))
(fp_line (start -1.27 2.54) (end -1.27 -2.54) (layer B.SilkS) (width 0.15))
(fp_line (start -0.95 2.45) (end 1.95 2.45) (layer B.Fab) (width 0.15))
(fp_line (start 1.95 2.45) (end 1.95 -2.45) (layer B.Fab) (width 0.15))
(fp_line (start 1.95 -2.45) (end -1.95 -2.45) (layer B.Fab) (width 0.15))
@ -814,13 +898,10 @@
(fp_line (start 3.75 2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.075 2.575) (end -2.075 2.525) (layer B.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer B.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 2.525) (end -3.475 2.525) (layer B.SilkS) (width 0.15))
(fp_arc (start 0 2.54) (end -0.762 2.54) (angle 180) (layer B.SilkS) (width 0.15))
(fp_line (start 0.762 2.54) (end 2.286 2.54) (layer B.SilkS) (width 0.15))
(fp_line (start -0.762 2.54) (end -4.318 2.54) (layer B.SilkS) (width 0.15))
(fp_line (start 2.286 -2.54) (end -2.286 -2.54) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -3.302 1.905 270) (size 2.1 0.6) (layers B.Cu B.Paste B.Mask)
(net 87 /flash/FLASH_nCS))
(pad 2 smd oval (at -3.302 0.635 270) (size 2.1 0.6) (layers B.Cu B.Paste B.Mask)
@ -849,6 +930,293 @@
)
)
(module SOT96-1:SOT96-1 (layer B.Cu) (tedit 5B1AB0D1) (tstamp 5A0BABF2)
(at 173.49 93.315 90)
(descr "NXP SOT96-1 SOIC-8 150 mil")
(tags "SOIC-8 1.27 150 mil SOT96-1")
(path /58D51CAD/58D70684)
(attr smd)
(fp_text reference U7 (at 2.032 -3.937 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value PCF8523 (at 1.27 -6.35 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -0.95 2.45) (end 1.95 2.45) (layer B.Fab) (width 0.15))
(fp_line (start 1.95 2.45) (end 1.95 -2.45) (layer B.Fab) (width 0.15))
(fp_line (start 1.95 -2.45) (end -1.95 -2.45) (layer B.Fab) (width 0.15))
(fp_line (start -1.95 -2.45) (end -1.95 1.45) (layer B.Fab) (width 0.15))
(fp_line (start -1.95 1.45) (end -0.95 2.45) (layer B.Fab) (width 0.15))
(fp_line (start -3.75 2.75) (end -3.75 -2.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 3.75 2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 0.762 2.54) (end 2.032 2.54) (layer B.SilkS) (width 0.15))
(fp_line (start -2.032 -2.54) (end 2.032 -2.54) (layer B.SilkS) (width 0.15))
(fp_arc (start 0 2.54) (end -0.762 2.54) (angle 180) (layer B.SilkS) (width 0.15))
(fp_line (start -0.762 2.54) (end -3.556 2.54) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 28 /power/OSCI_32k))
(pad 2 smd oval (at -2.7 0.635 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 29 /power/OSCO_32k))
(pad 3 smd oval (at -2.7 -0.635 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 17 /power/VBAT))
(pad 4 smd oval (at -2.7 -1.905 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd oval (at 2.7 -1.905 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 261 FPDI_SDA))
(pad 6 smd oval (at 2.7 -0.635 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 262 FPDI_SCL))
(pad 7 smd oval (at 2.7 0.635 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 22 /power/WAKEUPn))
(pad 8 smd oval (at 2.7 1.905 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 316 /power/RTCVDD))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.35x2.35mm.step
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module TSOT-25:TSOT-25 (layer B.Cu) (tedit 5B1AAF38) (tstamp 58D66E99)
(at 158.235 78.692)
(path /58D51CAD/5AFCC283)
(attr smd)
(fp_text reference U5 (at 1.793 2.812) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.2)) (justify mirror))
)
(fp_text value TLV62569DBV (at 0 2.413) (layer B.Fab)
(effects (font (size 0.4 0.4) (thickness 0.1)) (justify mirror))
)
(fp_circle (center -1 -0.2) (end -0.95 -0.3) (layer B.SilkS) (width 0.15))
(fp_line (start -0.3 0.9) (end 0.3 0.9) (layer B.SilkS) (width 0.15))
(fp_line (start 1.5 0.9) (end 1.5 -0.9) (layer B.SilkS) (width 0.15))
(fp_line (start -1.5 -0.9) (end -1.5 0.9) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.95 -1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 14 /power/PWREN))
(pad 2 smd rect (at 0 -1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 3 smd rect (at 0.95 -1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 161 /power/L3))
(pad 4 smd rect (at 0.95 1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 5 smd rect (at -0.95 1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 15 /power/FB3))
(model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module TSOT-25:TSOT-25 (layer B.Cu) (tedit 5B1AAF38) (tstamp 58D5976E)
(at 160.775 91.9)
(path /58D51CAD/5AF563F3)
(attr smd)
(fp_text reference U3 (at -0.295 2.9) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.2)) (justify mirror))
)
(fp_text value TLV62569DBV (at 0 2.286) (layer B.Fab)
(effects (font (size 0.4 0.4) (thickness 0.1)) (justify mirror))
)
(fp_circle (center -1 -0.2) (end -0.95 -0.3) (layer B.SilkS) (width 0.15))
(fp_line (start -0.3 0.9) (end 0.3 0.9) (layer B.SilkS) (width 0.15))
(fp_line (start 1.5 0.9) (end 1.5 -0.9) (layer B.SilkS) (width 0.15))
(fp_line (start -1.5 -0.9) (end -1.5 0.9) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.95 -1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 14 /power/PWREN))
(pad 2 smd rect (at 0 -1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 3 smd rect (at 0.95 -1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 160 /power/L1))
(pad 4 smd rect (at 0.95 1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 5 smd rect (at -0.95 1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 12 /power/FB1))
(model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module TSOT-25:TSOT-25 (layer B.Cu) (tedit 5B1AAF38) (tstamp 58D599CD)
(at 103.625 84.915 180)
(path /58D51CAD/5AFCB5C1)
(attr smd)
(fp_text reference U4 (at 2.525 0.4265 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.2)) (justify mirror))
)
(fp_text value TLV62569DBV (at 0 2.443 180) (layer B.Fab)
(effects (font (size 0.4 0.4) (thickness 0.1)) (justify mirror))
)
(fp_circle (center -1 -0.2) (end -0.95 -0.3) (layer B.SilkS) (width 0.15))
(fp_line (start -0.3 0.9) (end 0.3 0.9) (layer B.SilkS) (width 0.15))
(fp_line (start 1.5 0.9) (end 1.5 -0.9) (layer B.SilkS) (width 0.15))
(fp_line (start -1.5 -0.9) (end -1.5 0.9) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.95 -1.3 180) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 14 /power/PWREN))
(pad 2 smd rect (at 0 -1.3 180) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 3 smd rect (at 0.95 -1.3 180) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 162 /power/L2))
(pad 4 smd rect (at 0.95 1.3 180) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 5 smd rect (at -0.95 1.3 180) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 16 /power/FB2))
(model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module ESP32:ESP32-WROOM (layer B.Cu) (tedit 5B1AAE56) (tstamp 5A111CE5)
(at 117.23 105.75 180)
(path /58D6D447/58E5662B)
(fp_text reference U9 (at -8.366 13.85 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value ESP-WROOM-32 (at 5.715 -14.224 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user "Espressif Systems" (at -6.858 0.889 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_circle (center 9.906 -6.604) (end 10.033 -6.858) (layer B.SilkS) (width 0.5))
(fp_text user ESP32-WROOM (at -5.207 -0.254 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -9 -6.75) (end 9 -6.75) (layer B.SilkS) (width 0.15))
(fp_line (start 9 -12.75) (end 9 -6) (layer B.SilkS) (width 0.15))
(fp_line (start -9 -12.75) (end -9 -6) (layer B.SilkS) (width 0.15))
(fp_line (start -9 -12.75) (end 9 -12.75) (layer B.SilkS) (width 0.15))
(fp_line (start -9 12) (end -9 12.75) (layer B.SilkS) (width 0.15))
(fp_line (start -9 12.75) (end -6.5 12.75) (layer B.SilkS) (width 0.15))
(fp_line (start 6.5 12.75) (end 9 12.75) (layer B.SilkS) (width 0.15))
(fp_line (start 9 12.75) (end 9 12) (layer B.SilkS) (width 0.15))
(pad 38 smd oval (at -9 -5.25 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 37 smd oval (at -9 -3.98 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 18 JTAG_TDI))
(pad 36 smd oval (at -9 -2.71 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 157 PROG_DONE))
(pad 35 smd oval (at -9 -1.44 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 100 WIFI_TXD))
(pad 34 smd oval (at -9 -0.17 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 98 WIFI_RXD))
(pad 33 smd oval (at -9 1.1 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 20 JTAG_TMS))
(pad 32 smd oval (at -9 2.37 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 298 "Net-(U9-Pad32)"))
(pad 31 smd oval (at -9 3.64 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 21 JTAG_TDO))
(pad 30 smd oval (at -9 4.91 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 19 JTAG_TCK))
(pad 29 smd oval (at -9 6.18 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 233 WIFI_GPIO5))
(pad 28 smd oval (at -9 7.45 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 234 WIFI_GPIO17))
(pad 27 smd oval (at -9 8.72 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 154 WIFI_GPIO16))
(pad 26 smd oval (at -9 9.99 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 39 SD_D1))
(pad 25 smd oval (at -9 11.26 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 99 WIFI_GPIO0))
(pad 24 smd oval (at -5.715 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 38 SD_D0))
(pad 23 smd oval (at -4.445 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 36 SD_CMD))
(pad 22 smd oval (at -3.175 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 299 "Net-(U9-Pad22)"))
(pad 21 smd oval (at -1.905 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 300 "Net-(U9-Pad21)"))
(pad 20 smd oval (at -0.635 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 301 "Net-(U9-Pad20)"))
(pad 19 smd oval (at 0.635 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 302 "Net-(U9-Pad19)"))
(pad 18 smd oval (at 1.905 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 303 "Net-(U9-Pad18)"))
(pad 17 smd oval (at 3.175 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 304 "Net-(U9-Pad17)"))
(pad 16 smd oval (at 4.445 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 103 SD_D3))
(pad 15 smd oval (at 5.715 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 14 smd oval (at 9 11.26 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 128 SD_D2))
(pad 13 smd oval (at 9 9.99 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 37 SD_CLK))
(pad 12 smd oval (at 9 8.72 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 305 "Net-(U9-Pad12)"))
(pad 11 smd oval (at 9 7.45 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 227 GN11))
(pad 10 smd oval (at 9 6.18 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 228 GP11))
(pad 9 smd oval (at 9 4.91 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 229 GN12))
(pad 8 smd oval (at 9 3.64 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 230 GP12))
(pad 7 smd oval (at 9 2.37 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 231 GN13))
(pad 6 smd oval (at 9 1.1 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 232 GP13))
(pad 5 smd oval (at 9 -0.17 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 306 "Net-(U9-Pad5)"))
(pad 4 smd oval (at 9 -1.44 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 307 "Net-(U9-Pad4)"))
(pad 3 smd oval (at 9 -2.71 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 175 /wifi/WIFIEN))
(pad 2 smd oval (at 9 -3.98 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 1 smd oval (at 9 -5.25 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 39 smd rect (at 0.3 2.45 180) (size 6 6) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(model ./footprints/esp32/ESP32.3dshapes/KiCAD-ESP-WROOM-32.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module inem:inem (layer B.Cu) (tedit 5B1A69A8) (tstamp 5B248F4A)
(at 128.913 65.883)
(fp_text reference REF** (at 0 -1.6) (layer B.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value inem (at 0 1.6) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user inem (at 0 -0.1) (layer B.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify mirror))
)
(fp_circle (center 0 0) (end 3 0) (layer B.SilkS) (width 0.3))
)
(module fer:fer4mm6 (layer F.Cu) (tedit 5B1A6576) (tstamp 5B25673B)
(at 159.901 64.994)
(descr FER)
(tags fer)
(fp_text reference fer (at 0 -3.6) (layer F.SilkS) hide
(effects (font (size 1.524 1.524) (thickness 0.3048)))
)
(fp_text value fer (at 0 3.6) (layer F.SilkS) hide
(effects (font (size 1.524 1.524) (thickness 0.3048)))
)
(fp_line (start 4.2 1) (end 4.2 1.6) (layer F.SilkS) (width 1))
(fp_arc (start 3.4 0.8) (end 3.4 0) (angle 90) (layer F.SilkS) (width 1))
(fp_arc (start 3.4 -0.8) (end 3.4 -1.6) (angle 180) (layer F.SilkS) (width 1))
(fp_line (start 2.4 0) (end 3.4 0) (layer F.SilkS) (width 1))
(fp_line (start 2.4 -1.6) (end 3.4 -1.6) (layer F.SilkS) (width 1))
(fp_line (start -4 -1.6) (end -4 1.6) (layer F.SilkS) (width 1))
(fp_line (start -1 1.6) (end 1.2 1.6) (layer F.SilkS) (width 1))
(fp_line (start -1 0) (end 1.2 0) (layer F.SilkS) (width 1))
(fp_line (start -1 -1.6) (end 1.2 -1.6) (layer F.SilkS) (width 1))
(fp_line (start -4 -1.6) (end -2.2 -1.6) (layer F.SilkS) (width 1))
(fp_line (start -4 0) (end -2.2 0) (layer F.SilkS) (width 1))
)
(module Socket_Strips:Socket_Strip_Angled_2x20 (layer F.Cu) (tedit 5A2B354F) (tstamp 58E6BE3D)
(at 97.91 62.69 270)
(descr "Through hole socket strip")
@ -1034,102 +1402,6 @@
)
)
(module TSOT-25:TSOT-25 (layer B.Cu) (tedit 59CD7E8F) (tstamp 58D5976E)
(at 160.775 91.9)
(path /58D51CAD/5AF563F3)
(attr smd)
(fp_text reference U3 (at -0.295 2.9) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.2)) (justify mirror))
)
(fp_text value TLV62569DBV (at 0 2.286) (layer B.Fab)
(effects (font (size 0.4 0.4) (thickness 0.1)) (justify mirror))
)
(fp_circle (center -1 -0.4) (end -0.95 -0.5) (layer B.SilkS) (width 0.15))
(fp_line (start -1.5 0.9) (end 1.5 0.9) (layer B.SilkS) (width 0.15))
(fp_line (start 1.5 0.9) (end 1.5 -0.9) (layer B.SilkS) (width 0.15))
(fp_line (start 1.5 -0.9) (end -1.5 -0.9) (layer B.SilkS) (width 0.15))
(fp_line (start -1.5 -0.9) (end -1.5 0.9) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.95 -1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 14 /power/PWREN))
(pad 2 smd rect (at 0 -1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 3 smd rect (at 0.95 -1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 160 /power/L1))
(pad 4 smd rect (at 0.95 1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 5 smd rect (at -0.95 1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 12 /power/FB1))
(model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module TSOT-25:TSOT-25 (layer B.Cu) (tedit 59CD7E82) (tstamp 58D599CD)
(at 103.625 84.915 180)
(path /58D51CAD/5AFCB5C1)
(attr smd)
(fp_text reference U4 (at 2.525 0.4265 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.2)) (justify mirror))
)
(fp_text value TLV62569DBV (at 0 2.443 180) (layer B.Fab)
(effects (font (size 0.4 0.4) (thickness 0.1)) (justify mirror))
)
(fp_circle (center -1 -0.4) (end -0.95 -0.5) (layer B.SilkS) (width 0.15))
(fp_line (start -1.5 0.9) (end 1.5 0.9) (layer B.SilkS) (width 0.15))
(fp_line (start 1.5 0.9) (end 1.5 -0.9) (layer B.SilkS) (width 0.15))
(fp_line (start 1.5 -0.9) (end -1.5 -0.9) (layer B.SilkS) (width 0.15))
(fp_line (start -1.5 -0.9) (end -1.5 0.9) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.95 -1.3 180) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 14 /power/PWREN))
(pad 2 smd rect (at 0 -1.3 180) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 3 smd rect (at 0.95 -1.3 180) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 162 /power/L2))
(pad 4 smd rect (at 0.95 1.3 180) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 5 smd rect (at -0.95 1.3 180) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 16 /power/FB2))
(model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module TSOT-25:TSOT-25 (layer B.Cu) (tedit 59CD7D98) (tstamp 58D66E99)
(at 158.235 78.692)
(path /58D51CAD/5AFCC283)
(attr smd)
(fp_text reference U5 (at 1.793 2.812) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.2)) (justify mirror))
)
(fp_text value TLV62569DBV (at 0 2.413) (layer B.Fab)
(effects (font (size 0.4 0.4) (thickness 0.1)) (justify mirror))
)
(fp_circle (center -1 -0.4) (end -0.95 -0.5) (layer B.SilkS) (width 0.15))
(fp_line (start -1.5 0.9) (end 1.5 0.9) (layer B.SilkS) (width 0.15))
(fp_line (start 1.5 0.9) (end 1.5 -0.9) (layer B.SilkS) (width 0.15))
(fp_line (start 1.5 -0.9) (end -1.5 -0.9) (layer B.SilkS) (width 0.15))
(fp_line (start -1.5 -0.9) (end -1.5 0.9) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.95 -1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 14 /power/PWREN))
(pad 2 smd rect (at 0 -1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 3 smd rect (at 0.95 -1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 161 /power/L3))
(pad 4 smd rect (at 0.95 1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 5 smd rect (at -0.95 1.3) (size 0.7 1.2) (layers B.Cu B.Paste B.Mask)
(net 15 /power/FB3))
(model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module Socket_Strips:Socket_Strip_Angled_2x20 (layer F.Cu) (tedit 5A2B35BD) (tstamp 58E6BE69)
(at 184.27 110.95 90)
(descr "Through hole socket strip")
@ -1374,86 +1646,13 @@
(fp_text reference H4 (at 0 -3.75) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value HOLE (at 0 3.75) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center 0 0) (end 2.75 0) (layer Cmts.User) (width 0.15))
(fp_circle (center 0 0) (end 3 0) (layer F.CrtYd) (width 0.05))
(pad 1 thru_hole circle (at 0 0) (size 5.5 5.5) (drill 3.2) (layers *.Cu *.Mask)
(net 1 GND))
)
(module Housings_SSOP:SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 57AFAF80) (tstamp 58EB6259)
(at 132.835 107.14 180)
(descr "SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
(tags "SSOP 0.65")
(path /58D6BF46/58EB61C6)
(attr smd)
(fp_text reference U6 (at -3.175 4.318 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value FT231XS (at 0 -4.3 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
(fp_text value HOLE (at 0 3.75) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.2 3.25) (end 2.2 3.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 3.25) (end 2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 -3.25) (end -2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start -2.2 -3.25) (end -2.2 2.25) (layer B.Fab) (width 0.15))
(fp_line (start -2.2 2.25) (end -1.2 3.25) (layer B.Fab) (width 0.15))
(fp_line (start -3.65 3.55) (end -3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start 3.65 3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end 3.65 3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start 2.325 3.45) (end 2.325 3.35) (layer B.SilkS) (width 0.15))
(fp_line (start 2.325 -3.375) (end 2.325 -3.35) (layer B.SilkS) (width 0.15))
(fp_line (start -2.325 -3.375) (end -2.325 -3.35) (layer B.SilkS) (width 0.15))
(fp_line (start -3.4 3.45) (end 2.325 3.45) (layer B.SilkS) (width 0.15))
(fp_line (start -2.325 -3.375) (end 2.325 -3.375) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 43 FTDI_nDTR))
(pad 2 smd rect (at -2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 95 FTDI_nRTS))
(pad 3 smd rect (at -2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 176 FT2V5))
(pad 4 smd rect (at -2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 97 FTDI_RXD))
(pad 5 smd rect (at -2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 18 JTAG_TDI))
(pad 6 smd rect (at -2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 7 smd rect (at -2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 19 JTAG_TCK))
(pad 8 smd rect (at -2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 20 JTAG_TMS))
(pad 9 smd rect (at -2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 21 JTAG_TDO))
(pad 10 smd rect (at -2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 123 FTDI_nTXLED))
(pad 11 smd rect (at 2.9 -2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 101 USB_FTDI_D+))
(pad 12 smd rect (at 2.9 -2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 102 USB_FTDI_D-))
(pad 13 smd rect (at 2.9 -1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 176 FT2V5))
(pad 14 smd rect (at 2.9 -0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 42 nRESET))
(pad 15 smd rect (at 2.9 -0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 40 USB5V))
(pad 16 smd rect (at 2.9 0.325 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(fp_circle (center 0 0) (end 2.75 0) (layer Cmts.User) (width 0.15))
(fp_circle (center 0 0) (end 3 0) (layer F.CrtYd) (width 0.05))
(pad 1 thru_hole circle (at 0 0) (size 5.5 5.5) (drill 3.2) (layers *.Cu *.Mask)
(net 1 GND))
(pad 17 smd rect (at 2.9 0.975 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 295 FTDI_nRXLED))
(pad 18 smd rect (at 2.9 1.625 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 163 FTDI_TXDEN))
(pad 19 smd rect (at 2.9 2.275 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 124 FTDI_nSLEEP))
(pad 20 smd rect (at 2.9 2.925 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
(net 96 FTDI_TXD))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Socket_Strips:Socket_Strip_Straight_2x03 (layer F.Cu) (tedit 59CCC771) (tstamp 591E0B9B)
@ -3071,166 +3270,6 @@
)
)
(module SOT96-1:SOT96-1 (layer B.Cu) (tedit 5A0C2F78) (tstamp 5A0BABF2)
(at 173.49 93.315 90)
(descr "NXP SOT96-1 SOIC-8 150 mil")
(tags "SOIC-8 1.27 150 mil SOT96-1")
(path /58D51CAD/58D70684)
(attr smd)
(fp_text reference U7 (at 2.032 -3.937 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value PCF8523 (at 1.27 -6.35 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_circle (center -0.9525 2.286) (end -0.889 2.2225) (layer B.SilkS) (width 0.15))
(fp_line (start -1.778 -2.54) (end -1.778 2.54) (layer B.SilkS) (width 0.15))
(fp_line (start -1.27 2.54) (end -1.27 -2.54) (layer B.SilkS) (width 0.15))
(fp_line (start -0.95 2.45) (end 1.95 2.45) (layer B.Fab) (width 0.15))
(fp_line (start 1.95 2.45) (end 1.95 -2.45) (layer B.Fab) (width 0.15))
(fp_line (start 1.95 -2.45) (end -1.95 -2.45) (layer B.Fab) (width 0.15))
(fp_line (start -1.95 -2.45) (end -1.95 1.45) (layer B.Fab) (width 0.15))
(fp_line (start -1.95 1.45) (end -0.95 2.45) (layer B.Fab) (width 0.15))
(fp_line (start -3.75 2.75) (end -3.75 -2.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 3.75 2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.75 2.75) (end 3.75 2.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.075 2.575) (end -2.075 2.525) (layer B.SilkS) (width 0.15))
(fp_line (start 2.075 2.575) (end 2.075 2.43) (layer B.SilkS) (width 0.15))
(fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end -2.075 -2.43) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 2.525) (end -3.475 2.525) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 1.905 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 28 /power/OSCI_32k))
(pad 2 smd oval (at -2.7 0.635 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 29 /power/OSCO_32k))
(pad 3 smd oval (at -2.7 -0.635 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 17 /power/VBAT))
(pad 4 smd oval (at -2.7 -1.905 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd oval (at 2.7 -1.905 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 261 FPDI_SDA))
(pad 6 smd oval (at 2.7 -0.635 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 262 FPDI_SCL))
(pad 7 smd oval (at 2.7 0.635 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 22 /power/WAKEUPn))
(pad 8 smd oval (at 2.7 1.905 90) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 316 /power/RTCVDD))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.35x2.35mm.step
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module ESP32:ESP32-WROOM (layer B.Cu) (tedit 57D08EA8) (tstamp 5A111CE5)
(at 117.23 105.75 180)
(path /58D6D447/58E5662B)
(fp_text reference U9 (at -8.366 13.85 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value ESP-WROOM-32 (at 5.715 -14.224 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user "Espressif Systems" (at -6.858 0.889 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_circle (center 9.906 -6.604) (end 10.033 -6.858) (layer B.SilkS) (width 0.5))
(fp_text user ESP32-WROOM (at -5.207 -0.254 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -9 -6.75) (end 9 -6.75) (layer B.SilkS) (width 0.15))
(fp_line (start 9 -12.75) (end 9 12.75) (layer B.SilkS) (width 0.15))
(fp_line (start -9 -12.75) (end -9 12.75) (layer B.SilkS) (width 0.15))
(fp_line (start -9 12.75) (end 9 12.75) (layer B.SilkS) (width 0.15))
(fp_line (start -9 -12.75) (end 9 -12.75) (layer B.SilkS) (width 0.15))
(pad 38 smd oval (at -9 -5.25 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 37 smd oval (at -9 -3.98 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 18 JTAG_TDI))
(pad 36 smd oval (at -9 -2.71 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 157 PROG_DONE))
(pad 35 smd oval (at -9 -1.44 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 100 WIFI_TXD))
(pad 34 smd oval (at -9 -0.17 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 98 WIFI_RXD))
(pad 33 smd oval (at -9 1.1 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 20 JTAG_TMS))
(pad 32 smd oval (at -9 2.37 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 298 "Net-(U9-Pad32)"))
(pad 31 smd oval (at -9 3.64 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 21 JTAG_TDO))
(pad 30 smd oval (at -9 4.91 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 19 JTAG_TCK))
(pad 29 smd oval (at -9 6.18 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 233 WIFI_GPIO5))
(pad 28 smd oval (at -9 7.45 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 234 WIFI_GPIO17))
(pad 27 smd oval (at -9 8.72 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 154 WIFI_GPIO16))
(pad 26 smd oval (at -9 9.99 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 39 SD_D1))
(pad 25 smd oval (at -9 11.26 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 99 WIFI_GPIO0))
(pad 24 smd oval (at -5.715 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 38 SD_D0))
(pad 23 smd oval (at -4.445 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 36 SD_CMD))
(pad 22 smd oval (at -3.175 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 299 "Net-(U9-Pad22)"))
(pad 21 smd oval (at -1.905 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 300 "Net-(U9-Pad21)"))
(pad 20 smd oval (at -0.635 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 301 "Net-(U9-Pad20)"))
(pad 19 smd oval (at 0.635 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 302 "Net-(U9-Pad19)"))
(pad 18 smd oval (at 1.905 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 303 "Net-(U9-Pad18)"))
(pad 17 smd oval (at 3.175 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 304 "Net-(U9-Pad17)"))
(pad 16 smd oval (at 4.445 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 103 SD_D3))
(pad 15 smd oval (at 5.715 12.75 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 14 smd oval (at 9 11.26 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 128 SD_D2))
(pad 13 smd oval (at 9 9.99 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 37 SD_CLK))
(pad 12 smd oval (at 9 8.72 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 305 "Net-(U9-Pad12)"))
(pad 11 smd oval (at 9 7.45 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 227 GN11))
(pad 10 smd oval (at 9 6.18 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 228 GP11))
(pad 9 smd oval (at 9 4.91 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 229 GN12))
(pad 8 smd oval (at 9 3.64 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 230 GP12))
(pad 7 smd oval (at 9 2.37 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 231 GN13))
(pad 6 smd oval (at 9 1.1 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 232 GP13))
(pad 5 smd oval (at 9 -0.17 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 306 "Net-(U9-Pad5)"))
(pad 4 smd oval (at 9 -1.44 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 307 "Net-(U9-Pad4)"))
(pad 3 smd oval (at 9 -2.71 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 175 /wifi/WIFIEN))
(pad 2 smd oval (at 9 -3.98 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 1 smd oval (at 9 -5.25 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 39 smd rect (at 0.3 2.45 180) (size 6 6) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(model ./footprints/esp32/ESP32.3dshapes/KiCAD-ESP-WROOM-32.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module abs25:Crystal_SMD_ABS25 (layer B.Cu) (tedit 59D2C237) (tstamp 58EDF633)
(at 175.776 99.922 180)
(descr "Abracon ABS25 Plastic SMD Crystal http://www.abracon.com/Resonators/abs25.pdf")
@ -4183,7 +4222,7 @@
(tags capacitor)
(path /58D51CAD/58D84952)
(attr smd)
(fp_text reference C14 (at 0.78 7.859 270) (layer B.SilkS)
(fp_text reference C14 (at 0.018 6.97 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 220nF (at 0 -1.65 270) (layer B.Fab)
@ -4219,7 +4258,7 @@
(tags capacitor)
(path /58DA7327/590C7447)
(attr smd)
(fp_text reference C15 (at -3.193 0.904 90) (layer B.SilkS)
(fp_text reference C15 (at -2.939 0.142 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 22uF (at 0 -1.85 90) (layer B.Fab)
@ -5371,7 +5410,7 @@
(tags capacitor)
(path /58D51CAD/5ABCEADC)
(attr smd)
(fp_text reference C48 (at 0 1.65 ) (layer B.SilkS)
(fp_text reference C48 (at 0.012 -1.27 ) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 22nF (at 0 -1.65) (layer B.Fab)
@ -7018,7 +7057,7 @@
(tags SOD-323)
(path /58D6BF46/5AF760EE)
(attr smd)
(fp_text reference D25 (at -0.018 3.698 270) (layer B.SilkS)
(fp_text reference D25 (at 0.744 3.698 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 1N4148 (at 0.1 -1.9 90) (layer B.Fab)
@ -7061,7 +7100,7 @@
(tags SOD-323)
(path /58D6BF46/5AF7B2B2)
(attr smd)
(fp_text reference D26 (at 0.018 -3.063 90) (layer B.SilkS)
(fp_text reference D26 (at -0.744 -3.063 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 1N4148 (at 0.1 -1.9 270) (layer B.Fab)
@ -7197,7 +7236,7 @@
(tags resistor)
(path /58D6547C/595B9C2F)
(attr smd)
(fp_text reference R51 (at 2.779 0 180) (layer B.SilkS)
(fp_text reference R51 (at -0.015 1.27 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 150 (at 0 -1.65 180) (layer B.Fab)
@ -7700,60 +7739,6 @@
)
)
(module SM8:SM8 (layer B.Cu) (tedit 5A0C2F78) (tstamp 5B17ED8A)
(at 144.68 65.8015 90)
(descr "TI SM8 SOIC-8 150 mil")
(tags "SOIC-8 1.27 150 mil SOT96-1")
(path /58D686D9/5B01C6B5)
(attr smd)
(fp_text reference U11 (at 3.3475 -0.019 -180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value PCA9306D (at 4.318 -5.588 -180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_circle (center -2.286 -0.9525) (end -2.2225 -0.889) (layer B.SilkS) (width 0.15))
(fp_line (start 2.54 -1.778) (end -2.54 -1.778) (layer B.SilkS) (width 0.15))
(fp_line (start -2.54 -1.27) (end 2.54 -1.27) (layer B.SilkS) (width 0.15))
(fp_line (start -2.45 -0.95) (end -2.45 1.95) (layer B.Fab) (width 0.15))
(fp_line (start -2.45 1.95) (end 2.45 1.95) (layer B.Fab) (width 0.15))
(fp_line (start 2.45 1.95) (end 2.45 -1.95) (layer B.Fab) (width 0.15))
(fp_line (start 2.45 -1.95) (end -1.45 -1.95) (layer B.Fab) (width 0.15))
(fp_line (start -1.45 -1.95) (end -2.45 -0.95) (layer B.Fab) (width 0.15))
(fp_line (start -2.75 -3.75) (end 2.75 -3.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.75 3.75) (end 2.75 3.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.75 -3.75) (end -2.75 3.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 2.75 -3.75) (end 2.75 3.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.575 -2.075) (end -2.525 -2.075) (layer B.SilkS) (width 0.15))
(fp_line (start -2.575 2.075) (end -2.43 2.075) (layer B.SilkS) (width 0.15))
(fp_line (start 2.575 2.075) (end 2.43 2.075) (layer B.SilkS) (width 0.15))
(fp_line (start 2.575 -2.075) (end 2.43 -2.075) (layer B.SilkS) (width 0.15))
(fp_line (start -2.575 -2.075) (end -2.575 2.075) (layer B.SilkS) (width 0.15))
(fp_line (start 2.575 -2.075) (end 2.575 2.075) (layer B.SilkS) (width 0.15))
(fp_line (start -2.525 -2.075) (end -2.525 -3.475) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -1.905 -2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 2 smd oval (at -0.635 -2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 3 smd oval (at 0.635 -2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 262 FPDI_SCL))
(pad 4 smd oval (at 1.905 -2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 261 FPDI_SDA))
(pad 5 smd oval (at 1.905 2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 33 GPDI_SDA))
(pad 6 smd oval (at 0.635 2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 34 GPDI_SCL))
(pad 7 smd oval (at -0.635 2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 35 /gpdi/VREF2))
(pad 8 smd oval (at -1.905 2.7) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 35 /gpdi/VREF2))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module Capacitor_SMD:C_0805_2012Metric (layer B.Cu) (tedit 59FE48B8) (tstamp 5B1118A2)
(at 179.078 91.918 270)
(descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
@ -7832,7 +7817,7 @@
(tags inductor)
(path /58D51CAD/5A73C9EB)
(attr smd)
(fp_text reference L1 (at 0 2.5 180) (layer B.SilkS)
(fp_text reference L1 (at -3.063 -0.018 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 2.2uH (at 0 -2.5 180) (layer B.Fab)
@ -7862,13 +7847,13 @@
)
)
(module L_1008_1210:L_1008_1210 (layer B.Cu) (tedit 5B019496) (tstamp 5B191558 )
(module L_1008_1210:L_1008_1210 (layer B.Cu) (tedit 5B019496) (tstamp 5B2693FD )
(at 104.895 88.725)
(descr "Inductor SMD 1008-1210 (2520-3225 Metric), square (rectangular) end terminal")
(tags inductor)
(path /58D51CAD/58D67BD8)
(attr smd)
(fp_text reference L2 (at -3.16 -0.617 ) (layer B.SilkS)
(fp_text reference L2 (at -3.287 -0.236 ) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 2.2uH (at 0 -2.5) (layer B.Fab)
@ -7904,7 +7889,7 @@
(tags inductor)
(path /58D51CAD/5A73CDB3)
(attr smd)
(fp_text reference L3 (at 3.287 -0.018 180) (layer B.SilkS)
(fp_text reference L3 (at -3.063 -0.018 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 2.2uH (at 0 -2.5 180) (layer B.Fab)
@ -8012,7 +7997,7 @@
(tags resistor)
(path /58D51CAD/58E810CC)
(attr smd)
(fp_text reference R3 (at -0.018 -1.636 ) (layer B.SilkS)
(fp_text reference R3 (at -0.018 -1.382 90 ) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 4.7k (at 0 -1.65 90) (layer B.Fab)
@ -8048,7 +8033,7 @@
(tags resistor)
(path /58D51CAD/58D7CBD5)
(attr smd)
(fp_text reference R4 (at -5.476 0.236 180) (layer B.SilkS)
(fp_text reference R4 (at -0.015 -1.288 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 4.7k (at 0 -1.65 180) (layer B.Fab)
@ -8084,7 +8069,7 @@
(tags resistor)
(path /58D51CAD/58D85B68)
(attr smd)
(fp_text reference R5 (at 0.272 7.986 270) (layer B.SilkS)
(fp_text reference R5 (at 0.018 7.097 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 2.2M (at 0 -1.65 270) (layer B.Fab)
@ -8120,7 +8105,7 @@
(tags resistor)
(path /58D51CAD/58D7B291)
(attr smd)
(fp_text reference R6 (at 2.304 -0.01 5 270) (layer B.SilkS)
(fp_text reference R6 (at 0.018 -1.28 5 270) (layer B.SilkS)
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(tags resistor)
(path /58D6D447/58ED6C6D)
(attr smd)
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(tags resistor)
(path /58D6D447/58FD4C5D)
(attr smd)
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)
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)
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(module Resistor_SMD:R_0603_1608Metric (layer B.Cu) (tedit 59FE48B8) (tstamp 5B1917A8 )
(module Resistor_SMD:R_0603_1608Metric (layer B.Cu) (tedit 59FE48B8) (tstamp 5B2677DA )
(at 103.5765 99.03 90)
(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags resistor)
(path /58DA7327/590C5D62)
(attr smd)
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(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
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(tags "resistor handsolder")
(path /58D6BF46/58D6C83C)
(attr smd)
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(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 0 (at 0 -1.65 180) (layer B.Fab)
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(tags "resistor handsolder")
(path /56AC389C/56AC483B)
(attr smd)
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(fp_text value 0 (at 0 -1.65 90) (layer B.Fab)
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)
)
(module Resistor_SMD:R_0805_2012Metric_Pad1.29x1.40mm_HandSolder (layer B.Cu) (tedit 5AC5DB74 ) (tstamp 5B22CBAA)
(module Resistor_SMD:R_0805_2012Metric_Pad1.29x1.40mm_HandSolder (layer B.Cu) (tedit 5B1ABB91 ) (tstamp 5B22CBAA)
(at 160.155 66.391 270)
(descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags "resistor handsolder")
(path /56AC389C/56AC4846)
(attr smd)
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(fp_text reference RD52 (at 0 1.524 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 0 (at 0 -1.65 270) (layer B.Fab)
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(tags "Diode SMA (DO-214AC)")
(path /58D6BF46/58D6C83A)
(attr smd)
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(fp_text reference D8 (at -4.699 2.286 ) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value STPS2L30AF (at 0 -2.6) (layer B.Fab)
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)
)
(module Package_TO_SOT_SMD:SOT-23 (layer B.Cu) (tedit 5A02FF57) (tstamp 5B232848 )
(module Package_TO_SOT_SMD:SOT-23 (layer B.Cu) (tedit 5A02FF57) (tstamp 5B26C525 )
(at 176.015 84.28 90)
(descr "SOT-23, Standard")
(tags SOT-23)
(path /58D51CAD/58D89315)
(attr smd)
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(fp_text reference Q1 (at -2.304 0.015 18 0) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value BC857 (at 0 -2.5 90) (layer B.Fab)
@ -9951,12 +9936,12 @@
)
)
(module usb_otg:USB-MICRO-B-FCI-10118192-0001LF (layer F.Cu) (tedit 5B199111 ) (tstamp 5B24ABD3)
(module usb_otg:USB-MICRO-B-FCI-10118192-0001LF (layer F.Cu) (tedit 5B1AC2A8 ) (tstamp 5B24ABD3)
(at 111.88 63.325 180)
(path /58D6BF46/58D6C840)
(attr smd)
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(effects (font (size 0.7 0.7 ) (thickness 0.15)))
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(effects (font (size 1 1 ) (thickness 0.15)))
)
(fp_text value MICRO_USB (at 0 0 180) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
@ -10011,12 +9996,12 @@
)
)
(module usb_otg:USB-MICRO-B-FCI-10118192-0001LF (layer F.Cu) (tedit 5B19911 1) (tstamp 5B24ABF4)
(module usb_otg:USB-MICRO-B-FCI-10118192-0001LF (layer F.Cu) (tedit 5B1AC2F 1) (tstamp 5B24ABF4)
(at 170.3 63.325 180)
(path /58D6BF46/58D6C841)
(attr smd)
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(effects (font (size 1 1 ) (thickness 0.15)))
)
(fp_text value MICRO_USB (at 0 0 180) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
@ -10145,6 +10130,28 @@
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)
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(effects (font (size 1 1) (thickness 0.25)) (justify mirror))
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(gr_line (start 108.085 71.344) (end 105.037 71.344) (layer B.SilkS) (width 0.2) (tstamp 5B27D511))
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(gr_text 18 (at 182.126 95.728) (layer B.SilkS) (tstamp 5B0066BA)
(effects (font (size 1 1) (thickness 0.25)) (justify mirror))
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(segment (start 177.3 91.043) (end 178.998 91.043) (width 0.3) (layer B.Cu) (net 316))
(segment (start 178.998 91.043) (end 179.078 90.963) (width 0.3) (layer B.Cu) (net 316))
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@ -17619,7 +17624,7 @@
)
)
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(zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B28526F ) (hatch edge 0.508)
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(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -17685,7 +17690,7 @@
)
)
)
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(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B28526C ) (hatch edge 0.508)
(connect_pads (clearance 0.127))
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(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -18875,7 +18880,7 @@
)
)
)
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(connect_pads (clearance 0.254))
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)
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)
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@ -20486,7 +20491,7 @@
)
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(min_thickness 0.127)
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