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PCB: ADC silkscreen dot update

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pull/3/head
Emard 6 years ago
parent c322f6029d
commit 9099c7f928
2 changed files with 104 additions and 104 deletions
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206
ulx3s.kicad_pcb
Unescape View File

@ -664,6 +664,109 @@
(add_net 2V5_3V3)
)
(module max1112x-tqfn28:MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm (layer F.Cu) (tedit 5B9AA36A) (tstamp 5BA5A627)
(at 177.285 100.155 180)
(descr "28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN or VQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "TQFN 0.5")
(path /58D82BD0/595A6DC1)
(attr smd)
(fp_text reference U8 (at 0 -3.875 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MAX11125 (at 0 3.875 180) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.625 -1.875) (end -1.875 -2.625) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 2.625 -2.625) (end 1.875 -2.625) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.625) (end 1.875 2.625) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.625) (end -1.875 2.625) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 -2.625) (end -2.625 -1.875) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.625) (end 2.625 1.875) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.625) (end -2.625 1.875) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 -2.625) (end 2.625 -1.875) (layer F.SilkS) (width 0.15))
(fp_line (start -3.15 3.15) (end 3.15 3.15) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 -3.15) (end 3.15 -3.15) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.15 -3.15) (end 3.15 3.15) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 -3.15) (end -3.15 3.15) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.5 -1.5) (end -1.5 -2.5) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 2.5) (end -2.5 -1.5) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 2.5) (end -2.5 2.5) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 -2.5) (end 2.5 2.5) (layer F.Fab) (width 0.15))
(fp_line (start -1.5 -2.5) (end 2.5 -2.5) (layer F.Fab) (width 0.15))
(fp_line (start -2.625 -2.625) (end -1.875 -2.625) (layer F.SilkS) (width 0.15))
(fp_circle (center -3.048 -2.032) (end -2.9464 -2.032) (layer F.SilkS) (width 0.15))
(pad 29 smd rect (at -0.8125 -0.8125 180) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(net 1 GND) (solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at -0.8125 0.8125 180) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(net 1 GND) (solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at 0.8125 -0.8125 180) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(net 1 GND) (solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at 0.8125 0.8125 180) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(net 1 GND) (solder_paste_margin_ratio -0.2))
(pad 28 smd oval (at -1.5 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 190 GN15))
(pad 27 smd oval (at -1 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 189 GP14))
(pad 26 smd oval (at -0.5 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 188 GN14))
(pad 25 smd oval (at 0 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 24 smd oval (at 0.5 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 142 ADC_MISO))
(pad 23 smd oval (at 1 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 269 /analog/ADC3V3))
(pad 22 smd oval (at 1.5 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 21 smd oval (at 2.34 -1.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 143 ADC_MOSI))
(pad 20 smd oval (at 2.34 -1 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 144 ADC_CSn))
(pad 19 smd oval (at 2.34 -0.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 145 ADC_SCLK))
(pad 18 smd oval (at 2.34 0 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 269 /analog/ADC3V3))
(pad 17 smd oval (at 2.34 0.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 269 /analog/ADC3V3))
(pad 16 smd oval (at 2.34 1 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 15 smd oval (at 2.34 1.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 269 /analog/ADC3V3))
(pad 14 smd oval (at 1.5 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 13 smd oval (at 1 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 12 smd oval (at 0.5 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd oval (at 0 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 10 smd oval (at -0.5 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 9 smd oval (at -1 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 8 smd oval (at -1.5 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 7 smd oval (at -2.34 1.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 6 smd oval (at -2.34 1 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 5 smd oval (at -2.34 0.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 195 GP17))
(pad 4 smd oval (at -2.34 0 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 194 GN17))
(pad 3 smd oval (at -2.34 -0.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 193 GP16))
(pad 2 smd oval (at -2.34 -1 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 192 GN16))
(pad 1 smd rect (at -2.34 -1.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 191 GP15))
(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 5B9966E3) (tstamp 5B2637EB)
(at 132.835 107.14 180)
(descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
@ -7041,109 +7144,6 @@
)
)
(module max1112x-tqfn28:MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm (layer F.Cu) (tedit 5B93928F) (tstamp 5BA5A627)
(at 177.285 100.155 180)
(descr "28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN or VQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "TQFN 0.5")
(path /58D82BD0/595A6DC1)
(attr smd)
(fp_text reference U8 (at 0 -3.875 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MAX11125 (at 0 3.875 180) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.625 -1.875) (end -1.875 -2.625) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 2.625 -2.625) (end 1.875 -2.625) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.625) (end 1.875 2.625) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.625) (end -1.875 2.625) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 -2.625) (end -2.625 -1.875) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.625) (end 2.625 1.875) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.625) (end -2.625 1.875) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 -2.625) (end 2.625 -1.875) (layer F.SilkS) (width 0.15))
(fp_line (start -3.15 3.15) (end 3.15 3.15) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 -3.15) (end 3.15 -3.15) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.15 -3.15) (end 3.15 3.15) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 -3.15) (end -3.15 3.15) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.5 -1.5) (end -1.5 -2.5) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 2.5) (end -2.5 -1.5) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 2.5) (end -2.5 2.5) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 -2.5) (end 2.5 2.5) (layer F.Fab) (width 0.15))
(fp_line (start -1.5 -2.5) (end 2.5 -2.5) (layer F.Fab) (width 0.15))
(fp_line (start -2.625 -2.625) (end -1.875 -2.625) (layer F.SilkS) (width 0.15))
(fp_circle (center -3.048 -2.286) (end -2.9464 -2.286) (layer F.SilkS) (width 0.15))
(pad 29 smd rect (at -0.8125 -0.8125 180) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(net 1 GND) (solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at -0.8125 0.8125 180) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(net 1 GND) (solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at 0.8125 -0.8125 180) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(net 1 GND) (solder_paste_margin_ratio -0.2))
(pad 29 smd rect (at 0.8125 0.8125 180) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask)
(net 1 GND) (solder_paste_margin_ratio -0.2))
(pad 28 smd oval (at -1.5 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 190 GN15))
(pad 27 smd oval (at -1 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 189 GP14))
(pad 26 smd oval (at -0.5 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 188 GN14))
(pad 25 smd oval (at 0 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 24 smd oval (at 0.5 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 142 ADC_MISO))
(pad 23 smd oval (at 1 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 269 /analog/ADC3V3))
(pad 22 smd oval (at 1.5 -2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 21 smd oval (at 2.34 -1.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 143 ADC_MOSI))
(pad 20 smd oval (at 2.34 -1 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 144 ADC_CSn))
(pad 19 smd oval (at 2.34 -0.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 145 ADC_SCLK))
(pad 18 smd oval (at 2.34 0 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 269 /analog/ADC3V3))
(pad 17 smd oval (at 2.34 0.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 269 /analog/ADC3V3))
(pad 16 smd oval (at 2.34 1 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 15 smd oval (at 2.34 1.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 269 /analog/ADC3V3))
(pad 14 smd oval (at 1.5 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 13 smd oval (at 1 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 12 smd oval (at 0.5 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd oval (at 0 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 10 smd oval (at -0.5 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 9 smd oval (at -1 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 8 smd oval (at -1.5 2.34 270) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 7 smd oval (at -2.34 1.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 6 smd oval (at -2.34 1 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 5 smd oval (at -2.34 0.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 195 GP17))
(pad 4 smd oval (at -2.34 0 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 194 GN17))
(pad 3 smd oval (at -2.34 -0.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 193 GP16))
(pad 2 smd oval (at -2.34 -1 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 192 GN16))
(pad 1 smd rect (at -2.34 -1.5 180) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)
(net 191 GP15))
(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module dipswitch:SW_DIP_x4_W8.61mm_Slide_LowProfile (layer F.Cu) (tedit 5B938F22) (tstamp 5B542784)
(at 160.14 74.12 90)
(descr "4x-dip-switch, Slide, row spacing 8.61 mm (338 mils), SMD, LowProfile")

2
ulx3s.kicad_pcb-bak
Unescape View File

@ -10646,7 +10646,7 @@
(gr_text +- (at 104.26 100.79) (layer F.SilkS) (tstamp 5A8F5288)
(effects (font (size 1.5 1.5) (thickness 0.3)))
)
(gr_text v2.1.7 (at 169.807 101.443) (layer F.SilkS) (tstamp 5B2583F8)
(gr_text v2.1.8 (at 169.807 101.443) (layer F.SilkS) (tstamp 5B2583F8)
(effects (font (size 1.5 1.5) (thickness 0.3)))
)
(gr_text "KEYSTONE\n3000" (at 164.585 99) (layer B.SilkS) (tstamp 5AF93C9B)

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