diff --git a/footprints/adc/max1112x-tqfn28.pretty/MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm.kicad_mod b/footprints/adc/max1112x-tqfn28.pretty/MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm.kicad_mod index ec2ad1e..7f3e74d 100644 --- a/footprints/adc/max1112x-tqfn28.pretty/MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm.kicad_mod +++ b/footprints/adc/max1112x-tqfn28.pretty/MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm.kicad_mod @@ -1,4 +1,4 @@ -(module max1112x-tqfn28:MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm (layer F.Cu) (tedit 5B925511) +(module max1112x-tqfn28:MAX1112x-TQFN-28-1EP_5x5mm_Pitch0.5mm (layer F.Cu) (tedit 5B937794) (descr "28-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN or VQFN]; (see Microchip Packaging Specification 00000049BS.pdf)") (tags "TQFN 0.5") (attr smd) @@ -30,33 +30,33 @@ (fp_circle (center -2.3 -3.1496) (end -2.2 -3.1496) (layer F.SilkS) (width 0.15)) (fp_line (start -2.625 -2.625) (end -2.9 -2.9) (layer F.SilkS) (width 0.15)) (pad 1 smd rect (at -2.34 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 2 smd rect (at -2.34 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 3 smd rect (at -2.34 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 4 smd rect (at -2.34 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 5 smd rect (at -2.34 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 6 smd rect (at -2.34 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 7 smd rect (at -2.34 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 8 smd rect (at -1.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 9 smd rect (at -1 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 10 smd rect (at -0.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 11 smd rect (at 0 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 12 smd rect (at 0.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 13 smd rect (at 1 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 14 smd rect (at 1.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 15 smd rect (at 2.34 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 16 smd rect (at 2.34 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 17 smd rect (at 2.34 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 18 smd rect (at 2.34 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 19 smd rect (at 2.34 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 20 smd rect (at 2.34 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 21 smd rect (at 2.34 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 22 smd rect (at 1.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 23 smd rect (at 1 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 24 smd rect (at 0.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 25 smd rect (at 0 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 26 smd rect (at -0.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 27 smd rect (at -1 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) - (pad 28 smd rect (at -1.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 2 smd oval (at -2.34 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 3 smd oval (at -2.34 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 4 smd oval (at -2.34 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 5 smd oval (at -2.34 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 6 smd oval (at -2.34 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 7 smd oval (at -2.34 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 8 smd oval (at -1.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 9 smd oval (at -1 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 10 smd oval (at -0.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 11 smd oval (at 0 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 12 smd oval (at 0.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 13 smd oval (at 1 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 14 smd oval (at 1.5 2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 15 smd oval (at 2.34 1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 16 smd oval (at 2.34 1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 17 smd oval (at 2.34 0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 18 smd oval (at 2.34 0) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 19 smd oval (at 2.34 -0.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 20 smd oval (at 2.34 -1) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 21 smd oval (at 2.34 -1.5) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 22 smd oval (at 1.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 23 smd oval (at 1 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 24 smd oval (at 0.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 25 smd oval (at 0 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 26 smd oval (at -0.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 27 smd oval (at -1 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) + (pad 28 smd oval (at -1.5 -2.34 90) (size 0.95 0.3) (layers F.Cu F.Paste F.Mask)) (pad 29 smd rect (at 0.8125 0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask) (solder_paste_margin_ratio -0.2)) (pad 29 smd rect (at 0.8125 -0.8125) (size 1.625 1.625) (layers F.Cu F.Paste F.Mask) diff --git a/footprints/usbserial/ft231x.pretty/FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm.kicad_mod b/footprints/usbserial/ft231x.pretty/FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm.kicad_mod index 8423c65..350609c 100644 --- a/footprints/usbserial/ft231x.pretty/FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm.kicad_mod +++ b/footprints/usbserial/ft231x.pretty/FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm.kicad_mod @@ -1,11 +1,11 @@ -(module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer F.Cu) (tedit 5B852359) +(module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer F.Cu) (tedit 5B937E1E) (descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)") (tags "FT231X SSOP 0.65") (attr smd) (fp_text reference U6 (at -3.556 -4.318) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text value FT231XS (at -0.045 4.86) (layer F.Fab) + (fp_text value FT231XS (at -0.045 4.86) (layer F.Fab) hide (effects (font (size 1 1) (thickness 0.15))) ) (fp_text user %R (at 0 0) (layer F.Fab) @@ -29,26 +29,26 @@ (fp_line (start -2.286 3.429) (end -2.286 3.81) (layer F.SilkS) (width 0.15)) (fp_line (start -2.286 3.81) (end 2.286 3.81) (layer F.SilkS) (width 0.15)) (fp_line (start 2.286 3.81) (end 2.286 3.429) (layer F.SilkS) (width 0.15)) - (pad 1 smd rect (at -2.9 -2.925) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 2 smd rect (at -2.9 -2.275) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 3 smd rect (at -2.9 -1.625) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 4 smd rect (at -2.9 -0.975) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 5 smd rect (at -2.9 -0.325) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 6 smd rect (at -2.9 0.325) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 7 smd rect (at -2.9 0.975) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 8 smd rect (at -2.9 1.625) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 9 smd rect (at -2.9 2.275) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 10 smd rect (at -2.9 2.925) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 11 smd rect (at 2.9 2.925) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 12 smd rect (at 2.9 2.275) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 13 smd rect (at 2.9 1.625) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 14 smd rect (at 2.9 0.975) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 15 smd rect (at 2.9 0.325) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 16 smd rect (at 2.9 -0.325) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 17 smd rect (at 2.9 -0.975) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 18 smd rect (at 2.9 -1.625) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 19 smd rect (at 2.9 -2.275) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 20 smd rect (at 2.9 -2.925) (size 1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 1 smd rect (at -2.85 -2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 2 smd oval (at -2.85 -2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 3 smd oval (at -2.85 -1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 4 smd oval (at -2.85 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 5 smd oval (at -2.85 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 6 smd oval (at -2.85 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 7 smd oval (at -2.85 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 8 smd oval (at -2.85 1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 9 smd oval (at -2.85 2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 10 smd oval (at -2.85 2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 11 smd oval (at 2.85 2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 12 smd oval (at 2.85 2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 13 smd oval (at 2.85 1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 14 smd oval (at 2.85 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 15 smd oval (at 2.85 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 16 smd oval (at 2.85 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 17 smd oval (at 2.85 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 18 smd oval (at 2.85 -1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 19 smd oval (at 2.85 -2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 20 smd oval (at 2.85 -2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)) (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl (at (xyz 0 0 0)) (scale (xyz 1 1 1))