readme update

README.md

@@ -288,7 +288,7 @@ Here is checklist what was done or should be done in the next PCB release.
     [x] ADC: footprint according to MAX1112x land pattern 90-0023
     [ ] fix tombstoning see https://www.tempoautomation.com/blog/surface-mount-tombstone-experiment/
     [ ] Avoid VIAs on the PADs
-    [ ] aligment marks for BGA footprint using exposed gold plated copper
+    [x] aligment marks for BGA footprint using exposed gold plated copper
     [ ] Order ADCs in reel (not bulk, not tube).
-    [ ] check increased distance of 2 pad rows for SDRAM
-    [ ] check increased distance of 2 pad rows for FT231X
+    [x] check increased distance of 2 pad rows of SDRAM
+    [x] check decreased distance of 2 pad rows of FT231X