BGA pads increased to 0.4mm but VIAs remain the same

ulx3s.kicad_pcb

@@ -43,7 +43,7 @@
     (trace_min 0.127)
     (segment_width 0.2)
     (edge_width 0.2)
-    (via_size 0.4)
+    (via_size 0.45)
     (via_drill 0.2)
     (via_min_size 0.4)
     (via_min_drill 0.2)
@@ -415,7 +415,7 @@
   (net_class Default "This is the default net class."
     (clearance 0.1)
     (trace_width 0.3)
-    (via_dia 0.4)
+    (via_dia 0.45)
     (via_drill 0.2)
     (uvia_dia 0.3)
     (uvia_drill 0.1)
@@ -547,7 +547,7 @@
   (net_class BGA ""
     (clearance 0.1)
     (trace_width 0.19)
-    (via_dia 0.4)
+    (via_dia 0.45)
     (via_drill 0.2)
     (uvia_dia 0.3)
     (uvia_drill 0.1)
@@ -751,7 +751,7 @@
   (net_class Minimal ""
     (clearance 0.1)
     (trace_width 0.127)
-    (via_dia 0.4)
+    (via_dia 0.45)
     (via_drill 0.2)
     (uvia_dia 0.3)
     (uvia_drill 0.1)
@@ -16413,7 +16413,7 @@
   (segment (start 138.114991 92.859553) (end 138.114991 97.923001) (width 0.19) (layer In1.Cu) (net 318))
   (segment (start 138.197834 98.123) (end 137.914992 98.123) (width 0.19) (layer B.Cu) (net 318))
 
-  (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B633E26) (hatch edge 0.508)
+  (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B63FBF8) (hatch edge 0.508)
     (connect_pads (clearance 0.254))
     (min_thickness 0.254)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -18362,7 +18362,7 @@
       )
     )
   )
-  (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B633E23) (hatch edge 0.508)
+  (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B63FBF5) (hatch edge 0.508)
     (connect_pads (clearance 0.127))
     (min_thickness 0.254)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -18425,7 +18425,7 @@
       )
     )
   )
-  (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B633E20) (hatch edge 0.508)
+  (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B63FBF2) (hatch edge 0.508)
     (connect_pads (clearance 0.127))
     (min_thickness 0.1)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -19880,7 +19880,7 @@
       )
     )
   )
-  (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B633E1D) (hatch edge 0.508)
+  (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B63FBEF) (hatch edge 0.508)
     (connect_pads (clearance 0.254))
     (min_thickness 0.254)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -21332,7 +21332,7 @@
       )
     )
   )
-  (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B633E1A) (hatch edge 0.508)
+  (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B63FBEC) (hatch edge 0.508)
     (connect_pads (clearance 0.127))
     (min_thickness 0.127)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -21583,7 +21583,7 @@
       )
     )
   )
-  (zone (net 169) (net_name +1V1) (layer In1.Cu) (tstamp 5B633E17) (hatch edge 0.508)
+  (zone (net 169) (net_name +1V1) (layer In1.Cu) (tstamp 5B63FBE9) (hatch edge 0.508)
     (connect_pads (clearance 0.127))
     (min_thickness 0.254)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -21664,7 +21664,7 @@
       )
     )
   )
-  (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B633E14) (hatch edge 0.508)
+  (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B63FBE6) (hatch edge 0.508)
     (connect_pads (clearance 0.127))
     (min_thickness 0.127)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -21821,7 +21821,7 @@
       )
     )
   )
-  (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B633E11) (hatch edge 0.508)
+  (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B63FBE3) (hatch edge 0.508)
     (connect_pads (clearance 0.127))
     (min_thickness 0.127)
     (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))