diff --git a/README.md b/README.md index ba19e36..cdad18e 100644 --- a/README.md +++ b/README.md @@ -277,3 +277,8 @@ Here is checklist what was done or should be done in the next PCB release. [x] no paste on SW1 pads [x] diode for BTN0 to PROGRAMN [x] capacitor for BTN0 debounce + [ ] BGA pad=0.4mm mask=0.5mm paste=0.35mm + [ ] VIA align to 0.4mm raster + [ ] min VIA enlarge 0.4 mm -> 0.419 mm + +