readme update

pull/3/head
Emard 6 years ago
parent ad02cb0817
commit c2035875d0

@ -277,8 +277,8 @@ Here is checklist what was done or should be done in the next PCB release.
[x] no paste on SW1 pads
[x] diode for BTN0 to PROGRAMN
[x] capacitor for BTN0 debounce
[ ] BGA pad=0.4mm mask=0.5mm paste=0.35mm
[ ] VIA align to 0.4mm raster
[ ] min VIA enlarge 0.4 mm -> 0.419 mm
[x] BGA pad=0.4mm mask=0.5mm paste=0.35mm
[x] VIA align to 0.4mm raster
[x] min VIA enlarge 0.4 mm -> 0.419 mm

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