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@ -277,8 +277,8 @@ Here is checklist what was done or should be done in the next PCB release.
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[x] no paste on SW1 pads
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[x] diode for BTN0 to PROGRAMN
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[x] capacitor for BTN0 debounce
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[ ] BGA pad=0.4mm mask=0.5mm paste=0.35mm
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[ ] VIA align to 0.4mm raster
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[ ] min VIA enlarge 0.4 mm -> 0.419 mm
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[x] BGA pad=0.4mm mask=0.5mm paste=0.35mm
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[x] VIA align to 0.4mm raster
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[x] min VIA enlarge 0.4 mm -> 0.419 mm
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