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@ -164,7 +164,6 @@ Here is checklist what was done or should be done in the next PCB release.
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[x] Solder stop mask must go inbetween all SMD chip pads
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[x] External differential clock input at J1_33 +/-
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[x] physically sprinkle VCC blocator capacitors under BGA
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[ ] Values on silkscreen
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[x] Dedicated antenna pin
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[x] onboard 433 antenna
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[x] 433 remove GND and silkscreen test point
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@ -227,7 +226,6 @@ Here is checklist what was done or should be done in the next PCB release.
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[x] SDRAM raster back to 0.8 mm
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[x] connect SPI Flash Quad Mode (QSPI)
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[x] allow powering the board without powering FTDI chip
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[ ] reverse D9 at US2 to draw power from usb instead of provide it
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[x] micro USB extended pads for Handsoldering (already were extended)
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[x] move 25MHz oscillator away from USB connector for handsoldering
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[x] schematics gpio J..+- pins renamed to gp/gn for easier readability
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@ -241,7 +239,7 @@ Here is checklist what was done or should be done in the next PCB release.
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[x] clear silkscreen mess with Cx under FPGA
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[x] power decoupling capacitors for ESP32 and OLED
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[x] Connect switching power supply jumpers
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[ ] every 1-2 seconds there are clicks at analog audio output
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[x] every 1-2 seconds there are clicks at analog audio output, fixed in v2.1.2
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[x] 3.6V zener diodes must be on FPGA side
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[x] can esp32 second tx/rx port make serial communication with FPGA
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[x] Jumper to switch 2.5V/3.3V for left IO banks
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@ -257,7 +255,7 @@ Here is checklist what was done or should be done in the next PCB release.
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[x] RTC battery capacitor
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[x] battery + pad clearance
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[x] PCB v1.8.1 redesigned to fit HDMI 649-10029449-111RLF (the cheapest)
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[ ] use cheaper diodes 583-MM4148-T in SOD-80C package
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[x] use cheaper diodes 1N914
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[x] fix copper layer after using non-handsoldering resistor footprints
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[x] DIP switch must be pulled up at 2.5/3.3V or 2.5V line, not 3.3V
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[x] RTC time loss at power down fixed with 1k+22uF - see page 54 of datasheet
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