PCB: antenna as test point

pull/3/head
davor 6 years ago
parent bd6c927106
commit d3b1eb567c

@ -3,7 +3,7 @@
(general
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(drawings 483)
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(tracks 4805)
(zones 0)
(modules 206)
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@ -57,7 +57,7 @@
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(aux_axis_origin 94.1 112.22)
@ -972,21 +972,6 @@
)
)
(module SMD_Packages:1Pin (layer F.Cu) (tedit 59F891E7) (tstamp 59C3DCCD)
(at 182.67515 111.637626)
(descr "module 1 pin (ou trou mecanique de percage)")
(tags DEV)
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(pad 1 smd rect (at 0 0) (size 0.5 0.5) (layers B.Cu F.Paste F.Mask)
(net 157 /usb/ANT_433MHz))
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 590C5C33)
(at 103.498 98.758 90)
(descr "Resistor SMD 0603, hand soldering")
@ -9972,6 +9957,27 @@
)
)
(module TestPoint:TestPoint_Pad_D1.0mm (layer B.Cu) (tedit 5AF2DD22) (tstamp 5B1F6F6F)
(at 182.888 111.603)
(descr "SMD pad as test Point, diameter 1.0mm")
(tags "test point SMD pad")
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@ -57,7 +57,7 @@
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@ -972,21 +972,6 @@
)
)
(module SMD_Packages:1Pin (layer F.Cu) (tedit 59F891E7) (tstamp 59C3DCCD)
(at 182.67515 111.637626)
(descr "module 1 pin (ou trou mecanique de percage)")
(tags DEV)
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)
(pad 1 smd rect (at 0 0) (size 0.5 0.5) (layers B.Cu F.Paste F.Mask)
(net 157 /usb/ANT_433MHz))
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 590C5C33)
(at 103.498 98.758 90)
(descr "Resistor SMD 0603, hand soldering")
@ -1025,49 +1010,6 @@
)
)
(module Diodes_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 59D564F6) (tstamp 59D3C50D)
(at 155.695 66.5 90)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
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(at (xyz 0 0 0))
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)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 595B8F7A)
(at 156.33 72.85 180)
(descr "Resistor SMD 0603, hand soldering")
@ -3782,135 +3724,6 @@
)
)
(module Diodes_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 58643398) (tstamp 59D3C39C)
(at 112.261 69.802)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /58D6BF46/58D6C83A)
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(net 42 USB5V))
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(at (xyz 0 0 0))
(scale (xyz 1 1 1))
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)
(module Diodes_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 59D566C5) (tstamp 59D3C3A1)
(at 164.712 73.612 180)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /58D6BF46/58D6C83C)
(attr smd)
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)
(module Diodes_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 59D564E8) (tstamp 59D3C512)
(at 160.14 66.5 270)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /56AC389C/56AC4846)
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(net 4 /gpio/OUT5V))
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(at (xyz 0 0 0))
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)
)
(module lfe5bg381:BGA-381_pitch0.8mm_dia0.4mm (layer F.Cu) (tedit 59D4B869) (tstamp 58D8D57E)
(at 138.48 87.8)
(path /56AC389C/5A0783C9)
@ -9972,6 +9785,199 @@
)
)
(module Diode_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 58643398) (tstamp 5B1F957C)
(at 112.261 69.802)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /58D6BF46/58D6C83A)
(attr smd)
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(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
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)
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(fp_line (start -0.64944 0.79908) (end -0.64944 -0.80112) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.00102) (end 1.4994 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end -1.55114 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start -4.5 -1.75) (end -4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 -1.75) (end -4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 1.75) (end 4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -4.5 1.75) (end 4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 2.3 1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end 2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -2.3 -1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 -1.5) (end -2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -4.4 1.65) (end -4.4 -1.65) (layer B.SilkS) (width 0.12))
(fp_text user %R (at 0 2.5) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(pad 2 smd rect (at 2.5 0) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 42 USB5V))
(pad 1 smd rect (at -2.5 0) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Diode_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 58643398) (tstamp 5B1F9593)
(at 164.712 73.612 180)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /58D6BF46/58D6C83C)
(attr smd)
(fp_text reference D9 (at 0 -2.413 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value STPS2L30AF (at 0.762 -2.286 180) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user %R (at 0 2.5 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -4.4 1.65) (end -4.4 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start 2.3 -1.5) (end -2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -2.3 -1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end 2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start -4.5 1.75) (end 4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 1.75) (end 4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 -1.75) (end -4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -4.5 -1.75) (end -4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -0.64944 -0.00102) (end -1.55114 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.00102) (end 1.4994 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 0.79908) (end -0.64944 -0.80112) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.75032) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 -0.75032) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -4.4 -1.65) (end 2.5 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -4.4 1.65) (end 2.5 1.65) (layer B.SilkS) (width 0.12))
(pad 1 smd rect (at -2.5 0 180) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 17 "Net-(D9-Pad1)"))
(pad 2 smd rect (at 2.5 0 180) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Diode_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 58643398) (tstamp 5B1F95AA)
(at 155.695 66.5 90)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /56AC389C/56AC483B)
(attr smd)
(fp_text reference D51 (at 3.048 -2.159 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value STPS2L30AF (at 0 -2.6 90) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user %R (at 0 2.5 90) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -4.4 1.65) (end -4.4 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start 2.3 -1.5) (end -2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -2.3 -1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end 2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start -4.5 1.75) (end 4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 1.75) (end 4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 -1.75) (end -4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -4.5 -1.75) (end -4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -0.64944 -0.00102) (end -1.55114 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.00102) (end 1.4994 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 0.79908) (end -0.64944 -0.80112) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.75032) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 -0.75032) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -4.4 -1.65) (end 2.5 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -4.4 1.65) (end 2.5 1.65) (layer B.SilkS) (width 0.12))
(pad 1 smd rect (at -2.5 0 90) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 2 smd rect (at 2.5 0 90) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 3 /gpio/IN5V))
(model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module Diode_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 58643398) (tstamp 5B1F95C1)
(at 160.14 66.5 270)
(descr "Diode SMA (DO-214AC) Handsoldering")
(tags "Diode SMA (DO-214AC) Handsoldering")
(path /56AC389C/56AC4846)
(attr smd)
(fp_text reference D52 (at 2.921 1.778 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value STPS2L30AF (at 0 -2.6 270) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -4.4 1.65) (end 2.5 1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -4.4 -1.65) (end 2.5 -1.65) (layer B.SilkS) (width 0.12))
(fp_line (start -0.64944 -0.00102) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end 0.50118 -0.75032) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.75032) (end 0.50118 0.79908) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 0.79908) (end -0.64944 -0.80112) (layer B.Fab) (width 0.1))
(fp_line (start 0.50118 -0.00102) (end 1.4994 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start -0.64944 -0.00102) (end -1.55114 -0.00102) (layer B.Fab) (width 0.1))
(fp_line (start -4.5 -1.75) (end -4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 -1.75) (end -4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 4.5 1.75) (end 4.5 -1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start -4.5 1.75) (end 4.5 1.75) (layer B.CrtYd) (width 0.05))
(fp_line (start 2.3 1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 1.5) (end 2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -2.3 -1.5) (end -2.3 1.5) (layer B.Fab) (width 0.1))
(fp_line (start 2.3 -1.5) (end -2.3 -1.5) (layer B.Fab) (width 0.1))
(fp_line (start -4.4 1.65) (end -4.4 -1.65) (layer B.SilkS) (width 0.12))
(fp_text user %R (at 0 2.5 270) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(pad 2 smd rect (at 2.5 0 270) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 2 +5V))
(pad 1 smd rect (at -2.5 0 270) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
(net 4 /gpio/OUT5V))
(model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module TestPoint:TestPoint_Pad_D1.0mm (layer B.Cu) (tedit 5AF2DD22) (tstamp 5B1F6F6F)
(at 182.67515 111.637626)
(descr "SMD pad as test Point, diameter 1.0mm")
(tags "test point SMD pad")
(path /58D6BF46/59C3AE47)
(attr virtual)
(fp_text reference AE1 (at 0 1.448) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 433MHz (at 0 -1.55) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user %R (at 0 1.45) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_circle (center 0 0) (end 1 0) (layer B.CrtYd) (width 0.05))
(fp_circle (center 0 0) (end 0 -0.7) (layer B.SilkS) (width 0.12))
(pad 1 smd circle (at 0 0) (size 0.3 0.3) (layers B.Cu B.Mask)
(net 157 /usb/ANT_433MHz))
)
(gr_text 3.3V (at 133.739 64.359 270) (layer F.SilkS) (tstamp 5AB79336)
(effects (font (size 1.5 1.5) (thickness 0.3)))
)

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