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@ -1,15 +1,15 @@
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(kicad_pcb (version 4) (host pcbnew 4.0.5+dfsg1-4)
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(general
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(links 328)
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(no_connects 328)
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(links 343)
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(no_connects 343)
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(area 93.949999 61.269999 178.070001 109.830001)
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(thickness 1.6)
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(drawings 20)
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(tracks 1)
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(zones 0)
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(modules 57)
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(nets 91)
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(nets 92)
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)
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(page A4)
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@ -184,6 +184,7 @@
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(net 88 /power/FB2)
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(net 89 /usb/USB5V)
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(net 90 "Net-(D9-Pad1)")
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(net 91 "Net-(U6-Pad57)")
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(net_class Default "This is the default net class."
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(clearance 0.2)
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@ -279,6 +280,7 @@
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(add_net "Net-(L1-Pad1)")
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(add_net "Net-(L2-Pad1)")
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(add_net "Net-(L3-Pad1)")
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(add_net "Net-(U6-Pad57)")
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(add_net "Net-(US1-Pad6)")
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(add_net "Net-(US2-Pad6)")
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)
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@ -3334,135 +3336,122 @@
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)
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)
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(module Housings_DFN_QFN:QFN-64-1EP_9x9mm_Pitch0.5mm (layer B.Cu) (tedit 54130A77) (tstamp 58D6D289)
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(module Housings_DFN_QFN:QFN-56-1EP_7x7mm_Pitch0.4mm (layer B.Cu) (tedit 57BCC773) (tstamp 58D6CBEA)
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(at 160.14 74.755)
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(descr "64-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
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(tags "QFN 0.5")
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(descr "56-Lead Plastic Ultra Thin Quad Flat, No Lead Package (MV) - 7x7x0.4 mm Body [UQFN]; (see Cypress Package Package Output Drawing 001-58740)")
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(tags "QFN 0.4")
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(path /58D6BF46/58D6FD91)
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(attr smd)
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(fp_text reference U6 (at 0 5.875) (layer B.SilkS)
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(fp_text reference U6 (at 0.3 4.75) (layer B.SilkS)
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(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
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)
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(fp_text value FT2232H (at 0 -5.875) (layer B.Fab)
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(fp_text value FT2232H (at 0 -5.5) (layer B.Fab)
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(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
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)
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(fp_line (start -3.5 4.5) (end 4.5 4.5) (layer B.Fab) (width 0.15))
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(fp_line (start 4.5 4.5) (end 4.5 -4.5) (layer B.Fab) (width 0.15))
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(fp_line (start 4.5 -4.5) (end -4.5 -4.5) (layer B.Fab) (width 0.15))
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(fp_line (start -4.5 -4.5) (end -4.5 3.5) (layer B.Fab) (width 0.15))
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(fp_line (start -4.5 3.5) (end -3.5 4.5) (layer B.Fab) (width 0.15))
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(fp_line (start -5.15 5.15) (end -5.15 -5.15) (layer B.CrtYd) (width 0.05))
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(fp_line (start 5.15 5.15) (end 5.15 -5.15) (layer B.CrtYd) (width 0.05))
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(fp_line (start -5.15 5.15) (end 5.15 5.15) (layer B.CrtYd) (width 0.05))
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(fp_line (start -5.15 -5.15) (end 5.15 -5.15) (layer B.CrtYd) (width 0.05))
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(fp_line (start 4.7 4.7) (end 4.7 4.125) (layer B.SilkS) (width 0.15))
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(fp_line (start -4.7 -4.7) (end -4.7 -4.125) (layer B.SilkS) (width 0.15))
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(fp_line (start 4.7 -4.7) (end 4.7 -4.125) (layer B.SilkS) (width 0.15))
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(fp_line (start -4.7 4.7) (end -4.125 4.7) (layer B.SilkS) (width 0.15))
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(fp_line (start -4.7 -4.7) (end -4.125 -4.7) (layer B.SilkS) (width 0.15))
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(fp_line (start 4.7 -4.7) (end 4.125 -4.7) (layer B.SilkS) (width 0.15))
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(fp_line (start 4.7 4.7) (end 4.125 4.7) (layer B.SilkS) (width 0.15))
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(pad 1 smd rect (at -4.45 3.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 2 smd rect (at -4.45 3.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 3 smd rect (at -4.45 2.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 4 smd rect (at -4.45 2.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 5 smd rect (at -4.45 1.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 6 smd rect (at -4.45 1.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 7 smd rect (at -4.45 0.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 8 smd rect (at -4.45 0.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 9 smd rect (at -4.45 -0.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 10 smd rect (at -4.45 -0.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 11 smd rect (at -4.45 -1.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 12 smd rect (at -4.45 -1.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 13 smd rect (at -4.45 -2.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 14 smd rect (at -4.45 -2.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 15 smd rect (at -4.45 -3.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 16 smd rect (at -4.45 -3.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 17 smd rect (at -3.75 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 18 smd rect (at -3.25 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 19 smd rect (at -2.75 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 20 smd rect (at -2.25 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 21 smd rect (at -1.75 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 22 smd rect (at -1.25 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 23 smd rect (at -0.75 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 24 smd rect (at -0.25 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 25 smd rect (at 0.25 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 26 smd rect (at 0.75 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 27 smd rect (at 1.25 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 28 smd rect (at 1.75 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 29 smd rect (at 2.25 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 30 smd rect (at 2.75 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 31 smd rect (at 3.25 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 32 smd rect (at 3.75 -4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 33 smd rect (at 4.45 -3.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 34 smd rect (at 4.45 -3.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 35 smd rect (at 4.45 -2.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 36 smd rect (at 4.45 -2.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 37 smd rect (at 4.45 -1.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 38 smd rect (at 4.45 -1.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 39 smd rect (at 4.45 -0.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 40 smd rect (at 4.45 -0.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 41 smd rect (at 4.45 0.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 42 smd rect (at 4.45 0.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 43 smd rect (at 4.45 1.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 44 smd rect (at 4.45 1.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 45 smd rect (at 4.45 2.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 46 smd rect (at 4.45 2.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 47 smd rect (at 4.45 3.25) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 48 smd rect (at 4.45 3.75) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 49 smd rect (at 3.75 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 50 smd rect (at 3.25 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 51 smd rect (at 2.75 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 52 smd rect (at 2.25 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 53 smd rect (at 1.75 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 54 smd rect (at 1.25 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 55 smd rect (at 0.75 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 56 smd rect (at 0.25 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 57 smd rect (at -0.25 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 58 smd rect (at -0.75 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 59 smd rect (at -1.25 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 60 smd rect (at -1.75 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 61 smd rect (at -2.25 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 62 smd rect (at -2.75 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 63 smd rect (at -3.25 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 64 smd rect (at -3.75 4.45 270) (size 0.85 0.3) (layers B.Cu B.Paste B.Mask))
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(pad 65 smd rect (at 2.75625 -2.75625) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at 2.75625 -0.91875) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at 2.75625 0.91875) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at 2.75625 2.75625) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at 0.91875 -2.75625) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at 0.91875 -0.91875) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at 0.91875 0.91875) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at 0.91875 2.75625) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at -0.91875 -2.75625) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at -0.91875 -0.91875) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at -0.91875 0.91875) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at -0.91875 2.75625) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at -2.75625 -2.75625) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at -2.75625 -0.91875) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at -2.75625 0.91875) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(pad 65 smd rect (at -2.75625 2.75625) (size 1.8375 1.8375) (layers B.Cu B.Paste B.Mask)
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(solder_paste_margin_ratio -0.2))
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(model Housings_DFN_QFN.3dshapes/QFN-64-1EP_9x9mm_Pitch0.5mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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(fp_line (start -2.5 3.5) (end 3.5 3.5) (layer B.Fab) (width 0.15))
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(fp_line (start 3.5 3.5) (end 3.5 -3.5) (layer B.Fab) (width 0.15))
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(fp_line (start 3.5 -3.5) (end -3.5 -3.5) (layer B.Fab) (width 0.15))
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(fp_line (start -3.5 -3.5) (end -3.5 2.5) (layer B.Fab) (width 0.15))
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(fp_line (start -3.5 2.5) (end -2.5 3.5) (layer B.Fab) (width 0.15))
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(fp_line (start -4.15 4.15) (end -4.15 -4.15) (layer B.CrtYd) (width 0.05))
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(fp_line (start 4.15 4.15) (end 4.15 -4.15) (layer B.CrtYd) (width 0.05))
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(fp_line (start -4.15 4.15) (end 4.15 4.15) (layer B.CrtYd) (width 0.05))
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(fp_line (start -4.15 -4.15) (end 4.15 -4.15) (layer B.CrtYd) (width 0.05))
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(fp_line (start -3.65 -2.9) (end -3.65 -3.65) (layer B.SilkS) (width 0.15))
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(fp_line (start -3.5 3.65) (end -2.9 3.65) (layer B.SilkS) (width 0.15))
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(fp_line (start -3.65 -3.65) (end -2.9 -3.65) (layer B.SilkS) (width 0.15))
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(fp_line (start 3.65 -3.65) (end 2.95 -3.65) (layer B.SilkS) (width 0.15))
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(fp_line (start 3.65 3.65) (end 2.9 3.65) (layer B.SilkS) (width 0.15))
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(fp_line (start 3.65 -2.9) (end 3.65 -3.65) (layer B.SilkS) (width 0.15))
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(fp_line (start 3.65 3.65) (end 3.65 2.95) (layer B.SilkS) (width 0.15))
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(pad 1 smd rect (at -3.5 2.6) (size 0.8 0.2) (layers B.Cu B.Paste B.Mask))
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(pad 57 smd rect (at 0.7 0.7) (size 1.4 1.4) (layers B.Cu B.Paste B.Mask)
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(pad 57 smd rect (at -2.1 0.7) (size 1.4 1.4) (layers B.Cu B.Paste B.Mask)
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(pad 57 smd rect (at -0.7 0.7) (size 1.4 1.4) (layers B.Cu B.Paste B.Mask)
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(pad 57 smd rect (at 2.1 -0.7) (size 1.4 1.4) (layers B.Cu B.Paste B.Mask)
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(pad 57 smd rect (at 0.7 -0.7) (size 1.4 1.4) (layers B.Cu B.Paste B.Mask)
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(pad 57 smd rect (at -2.1 -0.7) (size 1.4 1.4) (layers B.Cu B.Paste B.Mask)
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(pad 57 smd rect (at -0.7 -0.7) (size 1.4 1.4) (layers B.Cu B.Paste B.Mask)
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(pad 57 smd rect (at 2.1 -2.1) (size 1.4 1.4) (layers B.Cu B.Paste B.Mask)
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(pad 57 smd rect (at 0.7 -2.1) (size 1.4 1.4) (layers B.Cu B.Paste B.Mask)
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(pad 57 smd rect (at -2.1 -2.1) (size 1.4 1.4) (layers B.Cu B.Paste B.Mask)
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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(pad 57 smd rect (at -0.7 -2.1) (size 1.4 1.4) (layers B.Cu B.Paste B.Mask)
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(net 91 "Net-(U6-Pad57)") (solder_paste_margin_ratio -0.2))
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)
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(gr_line (start 137.28 99.52) (end 137.28 63.96) (layer Eco2.User) (width 0.2))
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