footprints: solder paste removed from PCB jumpers and added to THT holes of GPDI1 connector

pull/3/head
davor 6 years ago
parent bd3cab0ab8
commit e2f6b0c00f

@ -1,43 +1,44 @@
(module CONN-10029449-111RLF (layer F.Cu) (tedit 587FBB74)
(fp_text reference REF** (at 0 0) (layer F.SilkS)
(module conn-fci:CONN-10029449-111RLF (layer F.Cu) (tedit 5B3F4594)
(attr smd)
(fp_text reference GPDI1 (at 0 -3.1115) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value CONN-10029449-111RLF (at 0 0) (layer F.Fab)
(fp_text value GPDI-D (at 0 0) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -9.1 7.5) (end -9.1 -2.2) (layer F.CrtYd) (width 0.35))
(fp_line (start -9.1 -2.2) (end 9.1 -2.2) (layer F.CrtYd) (width 0.35))
(fp_line (start 9.1 -2.2) (end 9.1 7.5) (layer F.CrtYd) (width 0.35))
(fp_line (start 9.1 7.5) (end -9.1 7.5) (layer F.CrtYd) (width 0.35))
(fp_line (start -5 -1.75) (end -4.75 -1.5) (layer B.Paste) (width 0.35))
(fp_line (start -4.75 -1.5) (end -5 -1.25) (layer B.Paste) (width 0.35))
(fp_line (start -5 -1.25) (end -5 -1.75) (layer B.Paste) (width 0.35))
(pad 19 smd rect (at -4.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at -3.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at -3.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -2.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at -2.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at -1.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at -1.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at -0.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at -0.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 0.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 1.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at 1.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 2.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at 3.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at 3.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at 4.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(fp_line (start -4.75 -1.5) (end -5 -1.25) (layer B.Paste) (width 0.35))
(fp_line (start -5 -1.75) (end -4.75 -1.5) (layer B.Paste) (width 0.35))
(fp_line (start 9.1 7.5) (end -9.1 7.5) (layer F.CrtYd) (width 0.35))
(fp_line (start 9.1 -2.2) (end 9.1 7.5) (layer F.CrtYd) (width 0.35))
(fp_line (start -9.1 -2.2) (end 9.1 -2.2) (layer F.CrtYd) (width 0.35))
(fp_line (start -9.1 7.5) (end -9.1 -2.2) (layer F.CrtYd) (width 0.35))
(pad 0 thru_hole circle (at 7.85 4.9) (size 2 2) (drill 1.3) (layers *.Cu *.Paste *.Mask))
(pad 0 thru_hole circle (at -7.85 4.9) (size 2 2) (drill 1.3) (layers *.Cu *.Paste *.Mask))
(pad 0 thru_hole circle (at 7.25 0) (size 2 2) (drill 1.3) (layers *.Cu *.Paste *.Mask))
(pad 0 thru_hole circle (at -7.25 0) (size 2 2) (drill 1.3) (layers *.Cu *.Paste *.Mask))
(pad 1 smd rect (at 4.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 0 thru_hole circle (at -7.25 0) (size 2 2) (drill 1.3) (layers *.Cu *.Mask))
(pad 0 thru_hole circle (at 7.25 0) (size 2 2) (drill 1.3) (layers *.Cu *.Mask))
(pad 0 thru_hole circle (at -7.85 4.9) (size 2 2) (drill 1.3) (layers *.Cu *.Mask))
(pad 0 thru_hole circle (at 7.85 4.9) (size 2 2) (drill 1.3) (layers *.Cu *.Mask))
(model ${KISYS3DMOD}/fci-10029449.step
(at (xyz 0 -0.007874015748031498 0.1299212598425197))
(scale (xyz 1 1 1))
(rotate (xyz -90 0 0))
(pad 2 smd rect (at 4.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at 3.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at 3.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 2.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at 1.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 1.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 0.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at -0.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at -0.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at -1.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at -1.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at -2.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -2.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at -3.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at -3.75 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at -4.25 -1) (size 0.3 1.9) (layers F.Cu F.Paste F.Mask))
(model ${KIPRJMOD}/footprints/hdmi-d/hdmi-d.3dshapes/10029449-111RLF.wrl
(offset (xyz 0 -1.6 3.3))
(scale (xyz 0.3937 0.3937 0.3937))
(rotate (xyz 180 0 0))
)
)

@ -1,8 +1,8 @@
(module jumper:D_SMA_Jumper_NC (layer F.Cu) (tedit 5B3E88D2)
(module jumper:D_SMA_Jumper_NC (layer F.Cu) (tedit 5B3F4472)
(descr "Diode SMA (DO-214AC)")
(tags "Diode SMA (DO-214AC)")
(attr smd)
(fp_text reference RD9 (at -4.699 -2.286) (layer F.SilkS)
(attr virtual)
(fp_text reference RD51 (at 4.191 -0.127 -90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 0 (at 0 2.6) (layer F.Fab)
@ -30,9 +30,8 @@
(fp_line (start -3.4 -1.65) (end 2 -1.65) (layer F.SilkS) (width 0.12))
(fp_line (start -2 0) (end 2 0) (layer F.Cu) (width 1))
(fp_line (start -2 0) (end 2 0) (layer F.Mask) (width 1.2))
(fp_line (start -2 0) (end 2 0) (layer F.Paste) (width 0.9))
(pad 1 smd rect (at -2 0) (size 2.5 1.8) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at 2 0) (size 2.5 1.8) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -2 0) (size 2.5 1.8) (layers F.Cu F.Mask))
(pad 2 smd rect (at 2 0) (size 2.5 1.8) (layers F.Cu F.Mask))
(model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl_disabled
(at (xyz 0 0 0))
(scale (xyz 1 1 1))

@ -1,14 +1,13 @@
(module jumper:R_0805_2012Metric_Pad1.29x1.40mm_HandSolder_Jumper_NC (layer F.Cu) (tedit 5B3E8123)
(module jumper:R_0805_2012Metric_Pad1.29x1.40mm_HandSolder_Jumper_NC (layer F.Cu) (tedit 5B3F4516)
(descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags "resistor handsolder")
(attr smd)
(fp_text reference RP2 (at 0 -1.65) (layer F.SilkS)
(attr virtual)
(fp_text reference RP1 (at 0 -1.65) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 0 (at 0 1.65) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1 0) (end 1 0) (layer F.Paste) (width 0.9))
(fp_line (start -1 0.6) (end -1 -0.6) (layer F.Fab) (width 0.1))
(fp_line (start -1 -0.6) (end 1 -0.6) (layer F.Fab) (width 0.1))
(fp_line (start 1 -0.6) (end 1 0.6) (layer F.Fab) (width 0.1))
@ -22,8 +21,8 @@
)
(fp_line (start -1 0) (end 1 0) (layer F.Cu) (width 1))
(fp_line (start -1 0) (end 1 0) (layer F.Mask) (width 1.2))
(pad 1 smd rect (at -0.9675 0) (size 1.295 1.4) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at 0.9675 0) (size 1.295 1.4) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -0.9675 0) (size 1.295 1.4) (layers F.Cu F.Mask))
(pad 2 smd rect (at 0.9675 0) (size 1.295 1.4) (layers F.Cu F.Mask))
(model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl_disabled
(at (xyz 0 0 0))
(scale (xyz 1 1 1))

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