From f65f243c927f9f0acdd9fdccb528ed32e456acc7 Mon Sep 17 00:00:00 2001 From: Emard Date: Thu, 13 Sep 2018 13:20:35 +0200 Subject: [PATCH] readme update --- README.md | 6 +++++- 1 file changed, 5 insertions(+), 1 deletion(-) diff --git a/README.md b/README.md index 1e2b0ed..b3d13e9 100644 --- a/README.md +++ b/README.md @@ -287,4 +287,8 @@ Here is checklist what was done or should be done in the next PCB release. [x] USB: copper fill keepout [x] ADC: footprint according to MAX1112x land pattern 90-0023 [ ] fix tombstoning see https://www.tempoautomation.com/blog/surface-mount-tombstone-experiment/ - + [ ] Avoid VIAs on the PADs + [ ] aligment marks for BGA footprint using exposed gold plated copper + [ ] Order ADCs in reel (not bulk, not tube). + [ ] check increased distance of 2 pad rows for SDRAM + [ ] check increased distance of 2 pad rows for FT231X