Emard
|
cdf9e06d06
|
PCB: I2C SM8 package used with proper 3D orientation
|
7 years ago |
|
Emard
|
d0802747ac
|
PCB: NXP RTC footprint changed to SOT96-1 properly oriented
|
7 years ago |
|
Emard
|
ebfbe5a298
|
PCB: re-run DRC
|
7 years ago |
|
Emard
|
9b3494741b
|
PCB: some parts were not enabled for insertion
(Normal+Insert) must be checked to appear on centroid list
|
7 years ago |
|
Emard
|
483906c052
|
PCB: change according to schematics 1.2V->1.1V
|
7 years ago |
|
Emard
|
f3c834cf54
|
PCB: SD card slot part name and esp-32 3D shape
|
7 years ago |
|
davor
|
9692fea61d
|
cosmetix: LED D22 moved a bit left to be symmetrical
|
7 years ago |
|
Emard
|
1c498602ad
|
silkscreen "+-" markings
|
7 years ago |
|
Emard
|
ef5f8c5100
|
Labels on J1/J2 connectors
|
7 years ago |
|
Emard
|
66459da5c7
|
WIFI VSPI connected on PCB
|
7 years ago |
|
Emard
|
c8084d5419
|
updating LED symbols on PCB
trac cosmetix
|
7 years ago |
|
Emard
|
c75a671e06
|
WIFI LED on PCB
|
7 years ago |
|
Emard
|
b0a41af38f
|
trac cosmetix
|
7 years ago |
|
Emard
|
fea181ae72
|
CEC resistor on PCB
|
7 years ago |
|
Emard
|
ca9fcf4df4
|
connecting missing SD card pins on PCB
|
7 years ago |
|
Emard
|
68299246cf
|
trac cosmetix
|
7 years ago |
|
Emard
|
da5b2c9c59
|
trac cosmetiscs: optimizing +5V to closest point
thickening 3.3V and GND on 2.54 mm header
|
7 years ago |
|
Emard
|
d68058d1ae
|
PCB properly set true-complenet A9-B10
|
7 years ago |
|
Emard
|
cae3c0a488
|
trac cosmetix
|
7 years ago |
|
Emard
|
35b3a8b3dd
|
changing to 45F which is production device now
schem symbol 45F fixed typo T8->T7 (GND) and SERDES
|
7 years ago |
|
davor
|
8e94190676
|
power up note and small cosmetics
|
7 years ago |
|
davor
|
050a70079a
|
move one audio-v pin from bank0 to bank7 so
now all audio jack pins are on bank7
|
7 years ago |
|
davor
|
5769ed05ae
|
trac cosmetix
|
7 years ago |
|
davor
|
f5688676a5
|
trac cosmetix
|
7 years ago |
|
davor
|
0d71e508ae
|
analog: audio ring2 resistor DAC network connected to FPGA
copper infill is getting thin, so minimal-thickness traces
are used 0.127 mm
|
7 years ago |
|
davor
|
f843d3169a
|
gpdi sheet, i2c voltage shifter, VREF filtering with C18 100nF->470nF
|
7 years ago |
|
davor
|
6d74bb29fc
|
PCB v1.7 fix wrong audio jack connection
|
7 years ago |
|
Emard
|
9672d92e12
|
small trace/via thickening and cosmetic edits
|
7 years ago |
|
Emard
|
ea7fc52d1e
|
small track cosmetics
|
7 years ago |
|
Emard
|
ba4c8e8d22
|
PCB v1.6 SDRAM fully reworked
|
7 years ago |
|
Emard
|
eca6978391
|
HDMI fixed wrong wiring PCB v1.5
and improving copper fill areas
|
7 years ago |
|
davor
|
330e7bc0fc
|
removing silkscreen square and writing around 433 pad
|
7 years ago |
|
davor
|
9d8be27731
|
logo "HRVATSKI PROIZVOD" enlarged and moved towards audio connector
|
7 years ago |
|
davor
|
bc41b3052d
|
move WIFI disable jumper closer to BTN1
|
7 years ago |
|
davor
|
ee87635b6d
|
moving copper infill area to expose 433 antenna
|
7 years ago |
|
davor
|
220f575442
|
schematic "power" sheet and footprint cosmetics
|
7 years ago |
|
davor
|
1ea88bda53
|
Adding pins to schematic symbols for all chips in unit "H" (SERDES)
Non-serdes chips need GND connection on unit "H".
"power" sheet now connects GND's at unit "H".
|
7 years ago |
|
Emard
|
d57b16519c
|
update (I hope) all chip units to 85F
add more GND vias
|
7 years ago |
|
davor
|
fffde2cf88
|
Additional GND for 85F chips
|
7 years ago |
|
davor
|
e4fc99887e
|
moving GND and VCC on schematics symbols to
common locations for planned PCB which
supports upgrade path for example
12F->25F->45F->85F and if possible ECP5U->ECP5UM
|
7 years ago |
|
Emard
|
07de158d38
|
R56 for FT231X rev A,B,C workaround from TN140_FT231X Errata
|
7 years ago |
|
Emard
|
ed1d52ada8
|
BAT1 reference moved near CR1225
|
7 years ago |
|
Emard
|
1773cd14fa
|
iproving differential routing (purple layer)
|
7 years ago |
|
Emard
|
06a8d751d9
|
Jumpers (default OFF) for 3 switcher voltages
|
7 years ago |
|
davor
|
1cdad1e4d0
|
all diodes SOD-323 and SOD-323F packages changed to handsoldering
(bigger pads, more reworkable)
silkscreen moving references GPDI1 and SW1 for readability
|
7 years ago |
|
davor
|
77b35c7bd2
|
battery, remove silkscreen printing from the pad
and other small silkscreen updates
|
7 years ago |
|
Emard
|
b6f388d228
|
ESP-32S footprint changed to avoid
silkscreen writing over the pads,
small cosmetics around
|
7 years ago |
|
Emard
|
a7a1424ef2
|
Silkscren: RIZ logo removed (Marko requested),
Written Battery clip name and battery type,
Cleaned up some markings mess
|
7 years ago |
|
Emard
|
cf8da0d984
|
Logos EMARD, RADIONA, RIZ, FER, HRVATSKI PROIZVOD
Gerbers update
|
7 years ago |
|
Emard
|
a913ffb675
|
Micro SD outline moved to correct layer (b.mask->f.fab)
|
7 years ago |
