Emard
|
07de158d38
|
R56 for FT231X rev A,B,C workaround from TN140_FT231X Errata
|
7 years ago |
Emard
|
ed1d52ada8
|
BAT1 reference moved near CR1225
|
7 years ago |
Emard
|
1773cd14fa
|
iproving differential routing (purple layer)
|
7 years ago |
Emard
|
06a8d751d9
|
Jumpers (default OFF) for 3 switcher voltages
|
7 years ago |
davor
|
1cdad1e4d0
|
all diodes SOD-323 and SOD-323F packages changed to handsoldering
(bigger pads, more reworkable)
silkscreen moving references GPDI1 and SW1 for readability
|
7 years ago |
davor
|
77b35c7bd2
|
battery, remove silkscreen printing from the pad
and other small silkscreen updates
|
7 years ago |
Emard
|
b6f388d228
|
ESP-32S footprint changed to avoid
silkscreen writing over the pads,
small cosmetics around
|
7 years ago |
Emard
|
a7a1424ef2
|
Silkscren: RIZ logo removed (Marko requested),
Written Battery clip name and battery type,
Cleaned up some markings mess
|
7 years ago |
Emard
|
cf8da0d984
|
Logos EMARD, RADIONA, RIZ, FER, HRVATSKI PROIZVOD
Gerbers update
|
7 years ago |
Emard
|
a913ffb675
|
Micro SD outline moved to correct layer (b.mask->f.fab)
|
7 years ago |
Emard
|
ae1aee7f5e
|
Micro SD contacts were OK for SCHD3A100.
Readme update.
Silkscreen outline drawn.
|
7 years ago |
davor
|
bc4b88ee58
|
Micro SD: using SCHD3A0100
|
7 years ago |
davor
|
c42c90ae37
|
FPGA_DONE connected to ESP32 over a resistors,
Other resistors moved away to allow routing thru the mess.
ESP-32 connected missing GND pin
|
7 years ago |
davor
|
f3d84dbfdc
|
LED D19 was oriented wrong, now correct
|
7 years ago |
Emard
|
bcc8afbf16
|
unclutter values on Fab layers
|
7 years ago |
Emard
|
f8b5dc97eb
|
update SD card power supply and gerbers
|
7 years ago |
Emard
|
ca7dcfa0ca
|
sligtly detach R54 in 3D view (move up Z axis)
to indicate it should not be placed by default
|
7 years ago |
Emard
|
bab7ee607e
|
placeholder for 1.5k pullup for usb 1.0
|
7 years ago |
Emard
|
9cc436ce8c
|
Additional VCC 2.2uF blocking capacitors near the switching
power supply to form PI-filter with another 2.2uF near BGA
|
7 years ago |
Emard
|
2be19bd4a3
|
aligning capacitors under BGA (cosmetics and visual effects)
|
7 years ago |
davor
|
2963509427
|
text labes with voltages 1.2V, 2.5V, 3.3V near capacitors under BGA
|
7 years ago |
davor
|
7e2a91f295
|
VCC blocker capacitors 2.2uF sprinkled under BGA
|
7 years ago |
davor
|
62165f1ddb
|
BGA silkscreen and minor traces adjustment
|
7 years ago |
davor
|
f99179bc88
|
gerbers update
|
7 years ago |
davor
|
d957c8521b
|
3D models of resistors 0603
|
7 years ago |
Emard
|
91ac1cc478
|
D8,D9,D51,D52: SMA package 2A low drop low profile
|
7 years ago |
davor
|
68a23c127c
|
set package SOD323 to all small diodes
|
7 years ago |
davor
|
aef23559d2
|
3D models for capacitors inductors transistors and some resistors
|
7 years ago |
davor
|
f32ace3adf
|
D15 schottky diode BAT54W package SOD323F
|
7 years ago |
davor
|
4347a2b7bf
|
JTAG, FTDI and serial LEDs moved left, away from buttons
|
7 years ago |
Emard
|
d0cf4eaeaf
|
DIP switch correct footprint
|
7 years ago |
Emard
|
9cdf0c04ed
|
USB move 0.635 mm up
|
7 years ago |
Emard
|
d463d17f18
|
32768Hz crystal ABS25 footprint now correct
|
7 years ago |
Emard
|
bcf94bafab
|
buttons footprints correct now
|
7 years ago |
Emard
|
e3080fafa6
|
moving text (references) out of pads
|
7 years ago |
Emard
|
cc4c1dd6ee
|
aligning BTN's and DIP SW
|
7 years ago |
Emard
|
6c38aabb74
|
moving "UP" button 1.27 mm up
3D models for dipswitch
|
7 years ago |
davor
|
eaf4c2402a
|
Fab layer, moving values to avoid overlap writings
GPDI footprint edited to remove some unneeded lines
Gerbers update
|
7 years ago |
davor
|
201cb628b1
|
removing transistor SOT-23 3D models (wrong orientation)
moving some capacitor reference for readability
|
7 years ago |
davor
|
52047f93d8
|
moving 5V IN/OUT routing diode to bottom side
|
7 years ago |
davor
|
fba16cd43e
|
Silkscreen JTAG tidying up
|
7 years ago |
davor
|
8c0f769536
|
Silkscreen writings FPGA, 32MB, ULX3S v1.0, ADC, RTC, 25 MHz
|
7 years ago |
davor
|
52fc46899e
|
silkscreen on bottom layer: avoiding writing on solder pads
|
7 years ago |
davor
|
53ea44f214
|
Silkscreen JTAG header signal names
readme update
|
7 years ago |
davor
|
5a2eb8220f
|
silkscreen on top layer: avoiding writing on solder pads
|
7 years ago |
Emard
|
407177a486
|
Move HDMI a bit closer to OLED
|
7 years ago |
Emard
|
e15ab7d84f
|
removing battery circle from the sikscreen
(changing footprint)
|
7 years ago |
Emard
|
e3a535e842
|
move 25MHz clock generator Y1 away from heat and EM noise
|
7 years ago |
Emard
|
7569433437
|
removing OLED outline from the silkscreen
(footprint changed)
|
7 years ago |
Emard
|
0312d80fa3
|
reducing default solder mask clearance to 0.05 mm
it will help preventing shortcuts coming from solder
overflow
|
7 years ago |