davor
|
0d71e508ae
|
analog: audio ring2 resistor DAC network connected to FPGA
copper infill is getting thin, so minimal-thickness traces
are used 0.127 mm
|
7 years ago |
|
davor
|
f843d3169a
|
gpdi sheet, i2c voltage shifter, VREF filtering with C18 100nF->470nF
|
7 years ago |
|
davor
|
6d74bb29fc
|
PCB v1.7 fix wrong audio jack connection
|
7 years ago |
|
Emard
|
9672d92e12
|
small trace/via thickening and cosmetic edits
|
7 years ago |
|
Emard
|
ea7fc52d1e
|
small track cosmetics
|
7 years ago |
|
Emard
|
ba4c8e8d22
|
PCB v1.6 SDRAM fully reworked
|
7 years ago |
|
Emard
|
eca6978391
|
HDMI fixed wrong wiring PCB v1.5
and improving copper fill areas
|
7 years ago |
|
davor
|
330e7bc0fc
|
removing silkscreen square and writing around 433 pad
|
7 years ago |
|
davor
|
9d8be27731
|
logo "HRVATSKI PROIZVOD" enlarged and moved towards audio connector
|
7 years ago |
|
davor
|
bc41b3052d
|
move WIFI disable jumper closer to BTN1
|
7 years ago |
|
davor
|
ee87635b6d
|
moving copper infill area to expose 433 antenna
|
7 years ago |
|
davor
|
220f575442
|
schematic "power" sheet and footprint cosmetics
|
7 years ago |
|
davor
|
1ea88bda53
|
Adding pins to schematic symbols for all chips in unit "H" (SERDES)
Non-serdes chips need GND connection on unit "H".
"power" sheet now connects GND's at unit "H".
|
7 years ago |
|
Emard
|
d57b16519c
|
update (I hope) all chip units to 85F
add more GND vias
|
7 years ago |
|
davor
|
fffde2cf88
|
Additional GND for 85F chips
|
7 years ago |
|
davor
|
e4fc99887e
|
moving GND and VCC on schematics symbols to
common locations for planned PCB which
supports upgrade path for example
12F->25F->45F->85F and if possible ECP5U->ECP5UM
|
7 years ago |
|
Emard
|
07de158d38
|
R56 for FT231X rev A,B,C workaround from TN140_FT231X Errata
|
7 years ago |
|
Emard
|
ed1d52ada8
|
BAT1 reference moved near CR1225
|
7 years ago |
|
Emard
|
1773cd14fa
|
iproving differential routing (purple layer)
|
7 years ago |
|
Emard
|
06a8d751d9
|
Jumpers (default OFF) for 3 switcher voltages
|
7 years ago |
|
davor
|
1cdad1e4d0
|
all diodes SOD-323 and SOD-323F packages changed to handsoldering
(bigger pads, more reworkable)
silkscreen moving references GPDI1 and SW1 for readability
|
7 years ago |
|
davor
|
77b35c7bd2
|
battery, remove silkscreen printing from the pad
and other small silkscreen updates
|
7 years ago |
|
Emard
|
b6f388d228
|
ESP-32S footprint changed to avoid
silkscreen writing over the pads,
small cosmetics around
|
7 years ago |
|
Emard
|
a7a1424ef2
|
Silkscren: RIZ logo removed (Marko requested),
Written Battery clip name and battery type,
Cleaned up some markings mess
|
7 years ago |
|
Emard
|
cf8da0d984
|
Logos EMARD, RADIONA, RIZ, FER, HRVATSKI PROIZVOD
Gerbers update
|
7 years ago |
|
Emard
|
a913ffb675
|
Micro SD outline moved to correct layer (b.mask->f.fab)
|
7 years ago |
|
Emard
|
ae1aee7f5e
|
Micro SD contacts were OK for SCHD3A100.
Readme update.
Silkscreen outline drawn.
|
7 years ago |
|
davor
|
bc4b88ee58
|
Micro SD: using SCHD3A0100
|
7 years ago |
|
davor
|
c42c90ae37
|
FPGA_DONE connected to ESP32 over a resistors,
Other resistors moved away to allow routing thru the mess.
ESP-32 connected missing GND pin
|
7 years ago |
|
davor
|
f3d84dbfdc
|
LED D19 was oriented wrong, now correct
|
7 years ago |
|
Emard
|
bcc8afbf16
|
unclutter values on Fab layers
|
7 years ago |
|
Emard
|
f8b5dc97eb
|
update SD card power supply and gerbers
|
7 years ago |
|
Emard
|
ca7dcfa0ca
|
sligtly detach R54 in 3D view (move up Z axis)
to indicate it should not be placed by default
|
7 years ago |
|
Emard
|
bab7ee607e
|
placeholder for 1.5k pullup for usb 1.0
|
7 years ago |
|
Emard
|
9cc436ce8c
|
Additional VCC 2.2uF blocking capacitors near the switching
power supply to form PI-filter with another 2.2uF near BGA
|
7 years ago |
|
Emard
|
2be19bd4a3
|
aligning capacitors under BGA (cosmetics and visual effects)
|
7 years ago |
|
davor
|
2963509427
|
text labes with voltages 1.2V, 2.5V, 3.3V near capacitors under BGA
|
7 years ago |
|
davor
|
7e2a91f295
|
VCC blocker capacitors 2.2uF sprinkled under BGA
|
7 years ago |
|
davor
|
62165f1ddb
|
BGA silkscreen and minor traces adjustment
|
7 years ago |
|
davor
|
f99179bc88
|
gerbers update
|
7 years ago |
|
davor
|
d957c8521b
|
3D models of resistors 0603
|
7 years ago |
|
Emard
|
91ac1cc478
|
D8,D9,D51,D52: SMA package 2A low drop low profile
|
7 years ago |
|
davor
|
68a23c127c
|
set package SOD323 to all small diodes
|
7 years ago |
|
davor
|
aef23559d2
|
3D models for capacitors inductors transistors and some resistors
|
7 years ago |
|
davor
|
f32ace3adf
|
D15 schottky diode BAT54W package SOD323F
|
7 years ago |
|
davor
|
4347a2b7bf
|
JTAG, FTDI and serial LEDs moved left, away from buttons
|
7 years ago |
|
Emard
|
d0cf4eaeaf
|
DIP switch correct footprint
|
7 years ago |
|
Emard
|
9cdf0c04ed
|
USB move 0.635 mm up
|
7 years ago |
|
Emard
|
d463d17f18
|
32768Hz crystal ABS25 footprint now correct
|
7 years ago |
|
Emard
|
bcf94bafab
|
buttons footprints correct now
|
7 years ago |
