Emard
|
b92a15489b
|
footprints: BGA rename fiducial pads 0->X (as 0 is usually gnd)
|
7 years ago |
|
Emard
|
18379d51a8
|
footprints: BGA with fiducial pads for chip alignment
|
7 years ago |
|
Emard
|
10ad82899b
|
footprints: fixing for Fab layer
|
7 years ago |
|
Emard
|
0bc3844449
|
footprints: fixing fab layer for assembly layout printed on paper sheet
|
7 years ago |
|
Emard
|
87c896a0bb
|
footprints: BGA pads 0.4mm copper, 0.5mm soldermask, 0.35mm paste=stencil
|
7 years ago |
|
Emard
|
186c9793f8
|
BGA footprint with design rules according to Lattice Recommendations
|
7 years ago |
|
davor
|
732323094c
|
BGA footprint: silkscreen ticks for verification
of relative alignment between BGA silkscreen and the pads
|
8 years ago |
|
davor
|
6b9a07a7ab
|
BGA footprint with double squares for manual alignment
|
8 years ago |
|
davor
|
09c209e137
|
BGA reducing solder mask clearance
|
8 years ago |
|
davor
|
d64741e825
|
BGA pads smaller 0.4->0.35 mm
|
8 years ago |
|
davor
|
3f8b5009a9
|
Uploading initial kicad project for ULX3S
|
10 years ago |
