d581ae364c
footprints: return of the audio jack
8 years ago
a445fe7a35
footprint: SD card footprint dissapeared, this kicad library
...
editor is either crap or I'll never learn how to use it properly
or both
8 years ago
07f62a2420
footprint: SDRAM TSOP-54 footprint made more wide
8 years ago
053bf2d90c
footprint: sdram TSOP-54 pitch now 0.808 mm
8 years ago
ac07b63744
footprint sdram pin pitch increased 0.8 mm -> 0.8077 mm
...
Physical chips have total pin center spacing of 21 mm while
at 0.8 mm pitch it would be 20.8 mm, 0.2 mm different at the side.
8 years ago
9fff92f938
footprint: SOA008 SPI flash, cypress version of SOIC-8 150mil
8 years ago
e7fc939612
footprint: I2C SM8 updated, pin1 marked rectangular others oval
8 years ago
53358189b8
footprint SOT96-1, updated with precise pads location and
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pad1 rectangular, other pads oval
8 years ago
05306dbed2
footprint SD card: proper rotation about exact 0,0 origin
8 years ago
3ea8206f48
Revert "footprint: SD card slot oriented according to physical tape and reel appearance."
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This reverts commit 8df4be2ab6
8 years ago
bae399b4ca
hdmi oriented according to tape and reel
8 years ago
8df4be2ab6
footprint: SD card slot oriented according to physical tape and reel appearance.
8 years ago
00e0f7da15
footprint audio jack dimensions and orientation adjusted
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according to datasheet. Center position not sure, tape and reel
information not found.
8 years ago
55f4a44ee5
I2C SM8 footprint properly oriented from TI tape and reel datasheet
8 years ago
820064c65e
NXP RTC SOT96-1 package, same as SOIC-8 but oriented with pin 1
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in upper left quadrant, according to NXP SOT96-1 tape and reel datasheet
8 years ago
afa3ace80b
esp-32 3D model
8 years ago
702be2aa9e
FPGA chip bank 0: swap sides A9<->B10 (true-complement was wrong)
8 years ago
35b3a8b3dd
changing to 45F which is production device now
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schem symbol 45F fixed typo T8->T7 (GND) and SERDES
8 years ago
ba4c8e8d22
PCB v1.6 SDRAM fully reworked
8 years ago
9d8be27731
logo "HRVATSKI PROIZVOD" enlarged and moved towards audio connector
8 years ago
220f575442
schematic "power" sheet and footprint cosmetics
8 years ago
1ea88bda53
Adding pins to schematic symbols for all chips in unit "H" (SERDES)
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Non-serdes chips need GND connection on unit "H".
"power" sheet now connects GND's at unit "H".
8 years ago
8f452e4d43
filling up serdes block 50,51 for UM85F, halway done.
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VCC are also planned to be moved to that block
8 years ago
fffde2cf88
Additional GND for 85F chips
8 years ago
6c23919a2d
Schematic symbol for 12F. Currently just a copy of 25F
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and checked bank0 pinout, and randomly power bank seems to fit
at first glance.
8 years ago
e4fc99887e
moving GND and VCC on schematics symbols to
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common locations for planned PCB which
supports upgrade path for example
12F->25F->45F->85F and if possible ECP5U->ECP5UM
8 years ago
151cf46186
added missing jumper footprint
8 years ago
77b35c7bd2
battery, remove silkscreen printing from the pad
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and other small silkscreen updates
8 years ago
b6f388d228
ESP-32S footprint changed to avoid
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silkscreen writing over the pads,
small cosmetics around
8 years ago
cf8da0d984
Logos EMARD, RADIONA, RIZ, FER, HRVATSKI PROIZVOD
...
Gerbers update
8 years ago
a913ffb675
Micro SD outline moved to correct layer (b.mask->f.fab)
8 years ago
ae1aee7f5e
Micro SD contacts were OK for SCHD3A100.
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Readme update.
Silkscreen outline drawn.
8 years ago
52c02d540c
Footprint ALPS SCHD3A0100 (obsolete but traditionally good)
8 years ago
cb69b2cc9a
ECP5 85E schematic footprint
8 years ago
3aac13deb4
footprint for ECP5:
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fix 25E device, small pin naming swapping BANK0 one pin A/B
new 45E device, modified pin names to fit (needs more review)
new 85E device but pin names are wrong (need more work)
8 years ago
732323094c
BGA footprint: silkscreen ticks for verification
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of relative alignment between BGA silkscreen and the pads
8 years ago
d463d17f18
32768Hz crystal ABS25 footprint now correct
8 years ago
eaf4c2402a
Fab layer, moving values to avoid overlap writings
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GPDI footprint edited to remove some unneeded lines
Gerbers update
8 years ago
5a2eb8220f
silkscreen on top layer: avoiding writing on solder pads
8 years ago
e15ab7d84f
removing battery circle from the sikscreen
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(changing footprint)
8 years ago
7569433437
removing OLED outline from the silkscreen
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(footprint changed)
8 years ago
6b9a07a7ab
BGA footprint with double squares for manual alignment
8 years ago
ee20b46f6d
connecting ADC substrate pad to GND
8 years ago
2153a220a0
schematic symbol for ADC MAX11123
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small PCB traces cleanup
ADC chip placed on PCB but connected only to GND
8 years ago
eb3fc2ec70
connecting some GNDs and GNDing unnamed shield pads on USB connectors
9 years ago
a4b74230d3
fixing errors in schem symbol BANK6
9 years ago
af58a36fbd
delete old FPGA schem. symbol component from the library
9 years ago
e5f97e1897
schematic symbol FPGA: mark bank physical location
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on the floorplan
9 years ago
4a26254f9a
correcting schematic symbol of FPGA
9 years ago
01d1cad2ec
add missing pins in schematic symbol for BANK3
9 years ago
Emard