Emard
|
aa58166786
|
PCB: move SW1 mark at Fab layer to more visible place
|
6 years ago |
|
Emard
|
9361e1b3b9
|
PCB v2.1.4: ADC footprint according to Maxim packaging information
|
6 years ago |
|
Emard
|
e67da73514
|
PCB: re-enabling ESP32 in 3D view
|
6 years ago |
|
Emard
|
4c76c26cae
|
PCB: copper fill keepout from USB pads, "skriptarnica.hr" written under ESP32
|
6 years ago |
|
Emard
|
7d9c40b7b8
|
footprints, PCB: dipswitch footprint moved to directory "footprints/dipswitch/dipswitch_smd.pretty"
|
6 years ago |
|
Emard
|
0f52e86c05
|
PCB: uncluttering Fab layers
|
6 years ago |
|
Emard
|
f46af906b7
|
PCB v2.1.3: mostly NOP changes going into next PCB release
|
6 years ago |
|
Emard
|
55bb335121
|
PCB: fixing Fab layers for assembly layout printed on paper sheet
|
6 years ago |
|
Emard
|
8c4d1cddc0
|
PCB: route GP14 thru nearest VIA and leave space to
balance 45deg routing to SDRAM.
|
6 years ago |
|
Emard
|
5936d9a722
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
7880718881
|
PCB: all copper traces under BGA 0.127 mm width
|
6 years ago |
|
Emard
|
08bffeb7e3
|
PCB: re-run DRC after schematics v2.1.2 to make sure for NOP change
|
6 years ago |
|
Emard
|
95f06be717
|
partially fixed fab layer (need to fix many footprints too)
|
6 years ago |
|
Emard
|
432ada4878
|
PCB: copper fill keepout area around GPDI and ADC,
thicker trace 0.127->0.19 for 2.5V under BGA
|
6 years ago |
|
Emard
|
7286403ff3
|
PCB v2.1.2: trac cosmetix under BGA
|
6 years ago |
|
Emard
|
7a31fc77a4
|
PCB: connecting each BGA pad with max 1 track (thermal relief)
|
6 years ago |
|
Emard
|
be4d757c29
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
96c3dfe16f
|
PCB v2.1.1: copper fill cosmetix
|
6 years ago |
|
Emard
|
6ebd1367f2
|
PCB: grid origin to lower left edge of PCB
|
6 years ago |
|
Emard
|
6138a03c05
|
PCB: in2.Cu fill minimal width increased 0.1->0.126 mm
More than this >=0.127 mm DRC will not pass
|
6 years ago |
|
Emard
|
cf0c54059c
|
PCB v2.1
|
6 years ago |
|
Emard
|
b7fd68a25f
|
PCB: more GND VIAs
|
6 years ago |
|
Emard
|
6e2b08c1e3
|
PCB: solder paste to copper clearance -0.025 mm from each edge
|
6 years ago |
|
Emard
|
1f7c73ee9c
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
ea9638730e
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
e43e4c3452
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
3d1d25b4f8
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
2af23a8cfc
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
4bd061b9f5
|
PCB v2.0.10: trac & via cosmetix
|
6 years ago |
|
Emard
|
797d383599
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
807be26e47
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
28caee6000
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
acb0a3d0ab
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
6a0c0ab47f
|
PCB: silkscreen block for handwritten notes
|
6 years ago |
|
Emard
|
3021028ff5
|
PCB: trac cosmetix, routing BTN_R around to allow more BGA GND VIAs
|
6 years ago |
|
Emard
|
6d07a69129
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
893f23e27c
|
PCB: add more VIAs under BGA
|
6 years ago |
|
Emard
|
854f71bdda
|
PCB: FPGA again set as visible in 3D view
|
6 years ago |
|
Emard
|
676837ef3d
|
PCB v2.0.9: trac/via cosmetix
|
6 years ago |
|
Emard
|
91b435bdfa
|
PCB v2.0.8: removing fill GND top layer under BGA, trac cosmetix
|
6 years ago |
|
Emard
|
ca91d6bb34
|
PCB: reducing copper traces on top layer under BGA to 0.127 mm
|
6 years ago |
|
Emard
|
26ea73e434
|
PCB: trac cosmetix
|
6 years ago |
|
Emard
|
3aa8344fe6
|
PCB v2.0.7
|
6 years ago |
|
Emard
|
6c4868a752
|
PCB: thicker under SD card 0.127 -> 0.19 mm
|
6 years ago |
|
Emard
|
f18467c4a7
|
PCB: thicker USB_FPGA 0.127 -> 0.19 mm
|
6 years ago |
|
Emard
|
89a8f56097
|
PCB: thicker GPN0-27 0.127 -> 0.19 mm
|
6 years ago |
|
Emard
|
d6ccd6d60c
|
PCB: thicker to LEDs 0.127 -> 0.19 mm
|
6 years ago |
|
Emard
|
2709e5df41
|
PCB: thicker traces (0.5 mm) to 2.54 mm connectors J1, J2, SDRAM 0.127 -> 0.19 mm
|
6 years ago |
|
Emard
|
f3cd6335a2
|
PCB: enlarging BGA vias to 0.419 mm, DRC passed, need trac cosmetix
|
6 years ago |
|
Emard
|
c98ea8dcdc
|
PCB: net class enlarged VIA diameter 0.4 -> 0.419 mm
|
6 years ago |
