|  davor | c42c90ae37 | FPGA_DONE connected to ESP32 over a resistors, Other resistors moved away to allow routing thru the mess.
ESP-32 connected missing GND pin | 8 years ago | 
				
					
						|  davor | f3d84dbfdc | LED D19 was oriented wrong, now correct | 8 years ago | 
				
					
						|  Emard | bcc8afbf16 | unclutter values on Fab layers | 8 years ago | 
				
					
						|  Emard | f8b5dc97eb | update SD card power supply and gerbers | 8 years ago | 
				
					
						|  Emard | ca7dcfa0ca | sligtly detach R54 in 3D view (move up Z axis) to indicate it should not be placed by default | 8 years ago | 
				
					
						|  Emard | bab7ee607e | placeholder for 1.5k pullup for usb 1.0 | 8 years ago | 
				
					
						|  Emard | 9cc436ce8c | Additional VCC 2.2uF blocking capacitors near the switching power supply to form PI-filter with another 2.2uF near BGA | 8 years ago | 
				
					
						|  Emard | 2be19bd4a3 | aligning capacitors under BGA (cosmetics and visual effects) | 8 years ago | 
				
					
						|  davor | 2963509427 | text labes with voltages 1.2V, 2.5V, 3.3V  near capacitors under BGA | 8 years ago | 
				
					
						|  davor | 7e2a91f295 | VCC blocker capacitors 2.2uF sprinkled under BGA | 8 years ago | 
				
					
						|  davor | 62165f1ddb | BGA silkscreen and minor traces adjustment | 8 years ago | 
				
					
						|  davor | f99179bc88 | gerbers update | 8 years ago | 
				
					
						|  davor | d957c8521b | 3D models of resistors 0603 | 8 years ago | 
				
					
						|  Emard | 91ac1cc478 | D8,D9,D51,D52: SMA package 2A low drop low profile | 8 years ago | 
				
					
						|  davor | 68a23c127c | set package SOD323 to all small diodes | 8 years ago | 
				
					
						|  davor | aef23559d2 | 3D models for capacitors inductors transistors and some resistors | 8 years ago | 
				
					
						|  davor | f32ace3adf | D15 schottky diode BAT54W package SOD323F | 8 years ago | 
				
					
						|  davor | 4347a2b7bf | JTAG, FTDI and serial LEDs moved left, away from buttons | 8 years ago | 
				
					
						|  Emard | d0cf4eaeaf | DIP switch correct footprint | 8 years ago | 
				
					
						|  Emard | 9cdf0c04ed | USB move 0.635 mm up | 8 years ago | 
				
					
						|  Emard | d463d17f18 | 32768Hz crystal ABS25 footprint now correct | 8 years ago | 
				
					
						|  Emard | bcf94bafab | buttons footprints correct now | 8 years ago | 
				
					
						|  Emard | e3080fafa6 | moving text (references) out of pads | 8 years ago | 
				
					
						|  Emard | cc4c1dd6ee | aligning BTN's and DIP SW | 8 years ago | 
				
					
						|  Emard | 6c38aabb74 | moving "UP" button 1.27 mm up 3D models for dipswitch | 8 years ago | 
				
					
						|  davor | eaf4c2402a | Fab layer, moving values to avoid overlap writings GPDI footprint edited to remove some unneeded lines
Gerbers update | 8 years ago | 
				
					
						|  davor | 201cb628b1 | removing transistor SOT-23 3D models (wrong orientation) moving some capacitor reference for readability | 8 years ago | 
				
					
						|  davor | 52047f93d8 | moving 5V IN/OUT routing diode to bottom side | 8 years ago | 
				
					
						|  davor | fba16cd43e | Silkscreen JTAG tidying up | 8 years ago | 
				
					
						|  davor | 8c0f769536 | Silkscreen writings FPGA, 32MB, ULX3S v1.0, ADC, RTC, 25 MHz | 8 years ago | 
				
					
						|  davor | 52fc46899e | silkscreen on bottom layer: avoiding writing on solder pads | 8 years ago | 
				
					
						|  davor | 53ea44f214 | Silkscreen JTAG header signal names readme update | 8 years ago | 
				
					
						|  davor | 5a2eb8220f | silkscreen on top layer: avoiding writing on solder pads | 8 years ago | 
				
					
						|  Emard | 407177a486 | Move HDMI a bit closer to OLED | 8 years ago | 
				
					
						|  Emard | e15ab7d84f | removing battery circle from the sikscreen (changing footprint) | 8 years ago | 
				
					
						|  Emard | e3a535e842 | move 25MHz clock generator Y1 away from heat and EM noise | 8 years ago | 
				
					
						|  Emard | 7569433437 | removing OLED outline from the silkscreen (footprint changed) | 8 years ago | 
				
					
						|  Emard | 0312d80fa3 | reducing default solder mask clearance to 0.05 mm it will help preventing shortcuts coming from solder
overflow | 8 years ago | 
				
					
						|  Emard | 64f70e4998 | routing 5V using shorter path between 2 USB connectors | 8 years ago | 
				
					
						|  davor | f120d212d9 | 433 MHz onboard antenna (need to uncover copper infill layers) | 8 years ago | 
				
					
						|  Emard | 46218e383e | yellow layer cleanup - removing part of trace leading nowhere | 8 years ago | 
				
					
						|  Emard | e76db02634 | small changes, moving the traces | 8 years ago | 
				
					
						|  davor | 9f6eae914c | connecting almost all free pins from ESP32 to FPGA (only 4 left unconnected) | 8 years ago | 
				
					
						|  Emard | 1588776a9d | top layer GND infill | 8 years ago | 
				
					
						|  Emard | 7768508f33 | moving battery to allow clearance from VBAT pad and screw hole (GND) | 8 years ago | 
				
					
						|  davor | 68db94dacd | small cleanup of traces/vias | 8 years ago | 
				
					
						|  davor | d462ffc350 | Connecting more ESP32 WIFI pins, sharing them with external 2.54 mm header
to access ADC and HSPI | 8 years ago | 
				
					
						|  davor | 600c4478fd | esp32: avoid connection to NC pin for JTAG_TDO | 8 years ago | 
				
					
						|  davor | 0229a768ad | FPGA direct-to-pin Hackish USB transciver 27 ohm + 3.6 V zener | 8 years ago | 
				
					
						|  davor | 00c73747b3 | thicker USB GND traces, vias and small cleanup on nearby traces | 8 years ago |