"DFA checks of your files show a footprint mismatch of components U9 (line item# 41) [MPN: ESP32-WROOM-32] in GERBER files w.r.t. mechanical dimensions as per datasheet. As shown in image, solder paste is missing for thermal pad component please review and advise."
ProtoExpress IST137568:
"DFA checks of your files show a footprint mismatch of components U9 (line item# 41) [MPN: ESP32-WROOM-32] in GERBER files w.r.t. mechanical dimensions as per datasheet. As shown in image, solder paste is missing for thermal pad component please review and advise."
Mask is opened in this place for te thermal purposes. Some paste could be dispensed at the center for the better contact. At the worst it could be leaved as it is
Mask is opened in this place for te thermal purposes. Some paste could be dispensed at the center for the better contact. At the worst it could be leaved as it is
ProtoExpress IST137568:
"DFA checks of your files show a footprint mismatch of components U9 (line item# 41) [MPN: ESP32-WROOM-32] in GERBER files w.r.t. mechanical dimensions as per datasheet. As shown in image, solder paste is missing for thermal pad component please review and advise."
Mask is opened in this place for te thermal purposes. Some paste could be dispensed at the center for the better contact. At the worst it could be leaved as it is
Sent to ProtoExpress.
ESP32-WROOM-32 footprintto ESP32-WROOM-32 footprint IST137568 5 years ago@ivan_o ProtoExpress asks:
Please advise if we should create paste opening for thermal pad as per signal pad.
Yes, It would be better to do it
Sent to ProtoExpress.
ProtoExpress:
"
We will provide the paste opening for thermal pad as per signal layer.
"