ESP32-WROOM-32 footprint IST137568 #7

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opened 5 years ago by jebba · 6 comments
jebba commented 5 years ago
Owner

ProtoExpress IST137568:

"DFA checks of your files show a footprint mismatch of components U9 (line item# 41) [MPN: ESP32-WROOM-32] in GERBER files w.r.t. mechanical dimensions as per datasheet. As shown in image, solder paste is missing for thermal pad component please review and advise."

ProtoExpress IST137568: "DFA checks of your files show a footprint mismatch of components U9 (line item# 41) [MPN: ESP32-WROOM-32] in GERBER files w.r.t. mechanical dimensions as per datasheet. As shown in image, solder paste is missing for thermal pad component please review and advise."
101 KiB
ivan_o was assigned by jebba 5 years ago
jebba added the Manufacturing label 5 years ago
jebba added a new dependency 5 years ago
ivan_o commented 5 years ago
Collaborator

Mask is opened in this place for te thermal purposes. Some paste could be dispensed at the center for the better contact. At the worst it could be leaved as it is

Mask is opened in this place for te thermal purposes. Some paste could be dispensed at the center for the better contact. At the worst it could be leaved as it is
jebba commented 5 years ago
Poster
Owner

Sent to ProtoExpress.

Sent to ProtoExpress.
jebba changed title from ESP32-WROOM-32 footprint to ESP32-WROOM-32 footprint IST137568 5 years ago
jebba commented 5 years ago
Poster
Owner

@ivan_o ProtoExpress asks:

Please advise if we should create paste opening for thermal pad as per signal pad.

@ivan_o ProtoExpress asks: Please advise if we should create paste opening for thermal pad as per signal pad.
23 KiB
jebba removed a dependency 5 years ago
ivan_o commented 5 years ago
Collaborator

Yes, It would be better to do it

Yes, It would be better to do it
jebba commented 5 years ago
Poster
Owner

Sent to ProtoExpress.

Sent to ProtoExpress.
jebba commented 5 years ago
Poster
Owner

ProtoExpress:

"

We will provide the paste opening for thermal pad as per signal layer.

"

ProtoExpress: " We will provide the paste opening for thermal pad as per signal layer. "
jebba closed this issue 5 years ago
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Reference: forksand/fs-ulx3s#7
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