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9 lines
318 B
9 lines
318 B
for proper placing ground and power planes, see
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TN1074 - PCB Layout Recommendations for BGA Packages
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page 1: table 1: row 0.8 ball pitch, 756/554/381/400 caBGA
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Pad copper diameter: 0.4 mm
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Solder mask opening: 0.5 mm
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Solder land diameter: 0.35 mm (solder paste = stencil opening)
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page 32: example for BGA 381 ECP5
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