forksand 2 years ago
parent bbdf92dbac
commit 5600b8a56b

Binary file not shown.

@ -8,7 +8,7 @@
(title_block
(title "gammaray2usb")
(date "2021-12-27")
(rev "0.2x")
(rev "0.3x")
(company "Fort Sand, Inc.")
)
@ -45,6 +45,19 @@
)
(setup
(stackup
(layer "F.SilkS" (type "Top Silk Screen"))
(layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
(layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
(layer "B.Paste" (type "Bottom Solder Paste"))
(layer "B.SilkS" (type "Bottom Silk Screen"))
(copper_finish "None")
(dielectric_constraints no)
)
(pad_to_mask_clearance 0)
(pcbplotparams
(layerselection 0x00010fc_ffffffff)

@ -48,7 +48,13 @@
"min_clearance": 0.508
}
},
"diff_pair_dimensions": [],
"diff_pair_dimensions": [
{
"gap": 0.0,
"via_gap": 0.0,
"width": 0.0
}
],
"drc_exclusions": [],
"meta": {
"version": 2
@ -103,17 +109,24 @@
"min_hole_to_hole": 0.25,
"min_microvia_diameter": 0.19999999999999998,
"min_microvia_drill": 0.09999999999999999,
"min_silk_clearance": 0.0,
"min_silk_clearance": 1.0,
"min_through_hole_diameter": 0.3,
"min_track_width": 0.19999999999999998,
"min_track_width": 0.25,
"min_via_annular_width": 0.049999999999999996,
"min_via_diameter": 0.39999999999999997,
"solder_mask_clearance": 0.0,
"solder_mask_min_width": 0.0,
"use_height_for_length_calcs": true
},
"track_widths": [],
"via_dimensions": [],
"track_widths": [
0.0
],
"via_dimensions": [
{
"diameter": 0.0,
"drill": 0.0
}
],
"zones_allow_external_fillets": false,
"zones_use_no_outline": true
},

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