diff --git a/HOWTO/smt-component-removal-HOWTO.md b/HOWTO/smt-component-removal-HOWTO.md
new file mode 100644
index 0000000..487ac67
--- /dev/null
+++ b/HOWTO/smt-component-removal-HOWTO.md
@@ -0,0 +1,43 @@
+# SMT Component Removal HOWTO
+
+## Items needed
+
+* PCB with components
+* PCB cradle
+* ZT-1 Airbath
+* ZT-3 Airpick
+* Anti-static brush
+* No clean flux
+* De-solder wire
+* 2x foam swabs
+* Solder vacuum
+* Non-flammable flux remover
+
+## Procedure
+
+1.  Secure the PCB in the cradle above the ZT-1 airbath.
+
+1.  Use an anti-static brush and the no clean flux to apply the flux onto the contact leads of the component.
+
+1.  Turn on the airbath to warm.  It will slowly heat up to 150 C.
+
+1. Take a strand of de-solder wire and melt it directly onto the leads of the component. Can be liberal and use as much as needed to cover all the leads.
+
+1.  After a couple seconds, the de-solder will fully melt onto the leads.
+
+1.  Pick up the ZT-3 Airpick.  Place a finger over the hole to create a vacuum.
+
+1.  Use the airpick to pick up the component.  Release your finger to drop the component.
+
+1.  Use a foam swab and the no clean flux.  Gently use the swab to push the de-solder blobs into one bubble.
+
+1.  Use a vacuum to suck up the bubble of de-solder.
+
+1.  Use the foam swab and no clean flux to apply a light coat of flux to the area.
+
+1.  Switch the airbath to cool.
+
+1.  Use a foam swab and the non-flammable flux remover to apply the remover to area.  It is recommended to apply a second coat.
+
+1.  Turn off the airbath and remove the PCB.
+
diff --git a/HOWTO/smt-component-removal.odt b/HOWTO/smt-component-removal.odt
deleted file mode 100644
index b1a847e..0000000
Binary files a/HOWTO/smt-component-removal.odt and /dev/null differ
diff --git a/HOWTO/solder-pot-HOWTO.md b/HOWTO/solder-pot-HOWTO.md
new file mode 100644
index 0000000..636bd70
--- /dev/null
+++ b/HOWTO/solder-pot-HOWTO.md
@@ -0,0 +1,28 @@
+# Solder Pot HOWTO
+
+## Items needed
+
+* Solder pot
+* Lead-free solder, cut into small enough pieces to fit in the solder pot.
+* Dross Skimmer
+* Tweezers
+* Component(s)
+
+## Procedure
+
+1.  Turn on the solder pot to its highest temp.
+
+1.  (First time) Add a piece of lead-free solder.
+
+1.  After initial use, the pot will melt the current solder in it from last use.  
+
+1.  As the first piece melts, add additional pieces of lead free solder until the melted level is near the top of the solder pot.
+
+1.  Use the skimmer to remove the top layer of residue from the melted solder.
+
+1.  Using tweezer, dip your component leads into the solder.  The only the leads should be put into the solder, avoid contact with component itself.
+
+1.  Repeat 4 and 5 for all components.
+
+1.  Turn the solder pot off.  The remaining solder will solidify and will be melted again in future use.
+
diff --git a/HOWTO/solder-pot-use.odt b/HOWTO/solder-pot-use.odt
deleted file mode 100644
index a51dd5a..0000000
Binary files a/HOWTO/solder-pot-use.odt and /dev/null differ
diff --git a/HOWTO/through-hole-component-removal-HOWTO.md b/HOWTO/through-hole-component-removal-HOWTO.md
new file mode 100644
index 0000000..110512f
--- /dev/null
+++ b/HOWTO/through-hole-component-removal-HOWTO.md
@@ -0,0 +1,34 @@
+# Through Hole Component Removal HOWTO
+
+## Items needed
+
+* PCB with component(s) to be removed
+* PCB cradle
+* No clean flux
+* 2 cotton swabs
+* Soldering Iron
+* De-solder wire
+* Solder vacuum
+* Tweezers
+* Flux remover
+
+1.  Secure the PCB into the cradle.
+
+1.  Swab the area with no clean flux.
+
+1.  Heat the soldering iron up to the melting temperature of the solder on the board.  For lead-free solder, this around 420 C.
+
+1.  Using a soldering iron, melt some de-solder wire onto the leads to be soldered.
+
+1.  Press the soldering iron against the lead.  The de-solder and solder should melt into a bubble.
+
+1.  Use a solder vacuum immediately after removing the soldering iron away from the lead.
+
+1.  Repeat 4-5 until enough solder has been removed so that the lead can freely move.  If this is not the case, add step 3 as well.
+
+1.  Repeat 4-5 for every lead.
+
+1.  The component should be able to be removed with tweezers.  Turn off the soldering iron.
+
+1.  Use a cotton swab and flux remover to clean the area.
+
diff --git a/HOWTO/through-hole-component-removal.odt b/HOWTO/through-hole-component-removal.odt
deleted file mode 100644
index 6653930..0000000
Binary files a/HOWTO/through-hole-component-removal.odt and /dev/null differ
diff --git a/README.md b/README.md
index 5285705..178177f 100644
--- a/README.md
+++ b/README.md
@@ -206,8 +206,8 @@ HOWTO Solder BGA components.
 ## Rework through hole components
 HOWTO Rework through hole components.
 
-* [Through Hole Component Removal]
-(through-hole-component-removal.odt)
+* [Through Hole Component Removal HOWTO]
+(HOWTO/through-hole-component-removal-HOWTO.md)
 
 ## Rework SMT components
 HOWTO Rework SMT components.
@@ -215,7 +215,7 @@ HOWTO Rework SMT components.
 Current Practice:
 
 * [SMT Component Removal HOWTO]
-(HOWTO/smt-component-removal.odt)
+(HOWTO/smt-component-removal-HOWTO.md)
 
 ## Rework BGA components
 HOWTO Rework BGA components.
@@ -240,8 +240,8 @@ HOWTO Apply solder paste with electronic syringe.
 ## Solder Pot
 HOWTO Use a solder pot.
 
-* [Solder Pot Usage]
-(HOWTO/solder-pot-use.odt) 
+* [Solder Pot HOWTO]
+(HOWTO/solder-pot-HOWTO.md) 
 
 # PCBA Testing
 Pins.