diff --git a/HOWTO/laser-solder-paste-stencil-inkscape.md b/HOWTO/laser-solder-paste-stencil-inkscape.md index 12bad9b..36f526b 100644 --- a/HOWTO/laser-solder-paste-stencil-inkscape.md +++ b/HOWTO/laser-solder-paste-stencil-inkscape.md @@ -31,8 +31,24 @@ This process is for one or two layer boards. You could make stencils for more layers, but that is only useful if you have a process to assemble PCBs with more than two layers. + +J-Tech Photonics has some documentation about this process using +an ancient printer, Replicator G software (!), +and proprietary PCB software. See here: + + +https://jtechphotonics.com/?p=473 + + +Note, from that blog post: + +* "We will then need to shrink the pads and holes by about 2 mills to allow for the spot size of the laser beam on the stencil material when processing." +This step is not being done below. XXX + + ## KiCAD Steps + Do thusly: * Open your KiCAD `.pro` file. @@ -141,7 +157,7 @@ In the task bar set `X:` to `0.000` and `Y:` to `0.000`. * `Travel Speed (mm/min or in/min)`: `1000`. XXX confirm. -* `Laser Speed (mm/min or in/min)`: `500`. XXX confirm speed for transparencies. +* `Laser Speed (mm/min or in/min)`: `600`. XXX confirm speed for transparencies. * `Laser Power S# (0-255 or 0-12000)`: `255`. @@ -225,13 +241,14 @@ Position the transparency in landscape mode, unless portrait mode is needed. Bottom left of transparency should be in front left corner on printer. -* Secure the transparency/paper sandwich to the aluminium plate and bed -with three large paperclips. +* Secure the transparency/paper sandwich to the aluminium plate and bed. +Use three large paper clips and/or tape. * Slowly move toolhead to position where you want the bottom left corner of the stencil to begin (e.g. X=0, Y=0 of the stencil). It is probably best to have a margin of 50mm around the edges (XXX number). -Make sure the LASER will be past the clips holding the transparency in place. +Make sure the LASER will be past the paper clips and tape +holding the transparency in place. * Power on printer.