readme update

6 years ago · 01c84700b8
parent 04d0c95036
commit 01c84700b8
1 changed files with 1 additions and 1 deletions
--- a/README.md
+++ b/README.md
@ -287,7 +287,7 @@ Here is checklist what was done or should be done in the next PCB release.
    [x] USB: copper fill keepout
    [x] ADC: footprint according to MAX1112x land pattern 90-0023
    [ ] fix tombstoning see https://www.tempoautomation.com/blog/surface-mount-tombstone-experiment/
-    [ ] Avoid VIAs on the PADs
+    [x] Avoid VIAs on the PADs
    [x] aligment marks for BGA footprint using exposed gold plated copper
    [ ] Order ADCs in reel (not bulk, not tube).
    [x] check increased distance of 2 pad rows of SDRAM