PCB: R56 made invisible on 3D view (file renamed to *.wrl_disabled)

updated ft231x outline on the silkscreen
pull/3/head
emard 6 years ago
parent 897143c330
commit 09bdc2ca4b

@ -760,6 +760,86 @@
(add_net 2V5_3V3) (add_net 2V5_3V3)
) )
(module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 5BC5CC01) (tstamp 5B2637EB)
(at 132.835 107.14 180)
(descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
(tags "FT231X SSOP 0.65")
(path /58D6BF46/58EB61C6)
(attr smd)
(fp_text reference U6 (at -3.556 4.318 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value FT231XS (at -0.045 -4.86 180) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start 2.286 -4.191) (end 2.286 -3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -4.191) (end 2.286 -4.191) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -3.429) (end -2.286 -4.191) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 3.429) (end -3.302 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 4.191) (end -2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -0.508 4.191) (end -2.286 4.191) (layer B.SilkS) (width 0.15))
(fp_line (start 2.286 4.191) (end 2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start 0.508 4.191) (end 2.286 4.191) (layer B.SilkS) (width 0.15))
(fp_arc (start 0 4.191) (end -0.508 4.191) (angle 180) (layer B.SilkS) (width 0.15))
(fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end 3.65 3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start 3.65 3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end -3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.2 2.25) (end -1.2 3.25) (layer B.Fab) (width 0.15))
(fp_line (start -2.2 -3.25) (end -2.2 2.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 -3.25) (end -2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 3.25) (end 2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start -1.2 3.25) (end 2.2 3.25) (layer B.Fab) (width 0.15))
(fp_text user %R (at 0 0 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(pad 20 smd oval (at 2.7 2.925 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 94 FTDI_TXD))
(pad 19 smd oval (at 2.7 2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 122 FTDI_nSLEEP))
(pad 18 smd oval (at 2.7 1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 160 FTDI_TXDEN))
(pad 17 smd oval (at 2.7 0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 287 FTDI_nRXLED))
(pad 16 smd oval (at 2.7 0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 15 smd oval (at 2.7 -0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 38 USB5V))
(pad 14 smd oval (at 2.7 -0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 40 nRESET))
(pad 13 smd oval (at 2.7 -1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 12 smd oval (at 2.7 -2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 100 USB_FTDI_D-))
(pad 11 smd oval (at 2.7 -2.925 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 99 USB_FTDI_D+))
(pad 10 smd oval (at -2.7 -2.925 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 121 FTDI_nTXLED))
(pad 9 smd oval (at -2.7 -2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 21 JTAG_TDO))
(pad 8 smd oval (at -2.7 -1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 20 JTAG_TMS))
(pad 7 smd oval (at -2.7 -0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 19 JTAG_TCK))
(pad 6 smd oval (at -2.7 -0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd oval (at -2.7 0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 18 JTAG_TDI))
(pad 4 smd oval (at -2.7 0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 95 FTDI_RXD))
(pad 3 smd oval (at -2.7 1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 2 smd oval (at -2.7 2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 93 FTDI_nRTS))
(pad 1 smd rect (at -2.7 2.925 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 41 FTDI_nDTR))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 0.93 1 1))
(rotate (xyz 0 0 0))
)
)
(module micro-sd-schd3a0100:SCHD3A100 (layer F.Cu) (tedit 5BC09B7F) (tstamp 59DE2A17) (module micro-sd-schd3a0100:SCHD3A100 (layer F.Cu) (tedit 5BC09B7F) (tstamp 59DE2A17)
(at 115.05 103.5 270) (at 115.05 103.5 270)
(descr "Micro SD card slot SCHD3A0100 from ALPS or ON-STARS") (descr "Micro SD card slot SCHD3A0100 from ALPS or ON-STARS")
@ -2755,86 +2835,6 @@
) )
) )
(module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 5B9966E3) (tstamp 5B2637EB)
(at 132.835 107.14 180)
(descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
(tags "FT231X SSOP 0.65")
(path /58D6BF46/58EB61C6)
(attr smd)
(fp_text reference U6 (at -3.556 4.318 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value FT231XS (at -0.045 -4.86 180) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start 2.286 -4.064) (end 2.286 -3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -4.064) (end 2.286 -4.064) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -3.429) (end -2.286 -4.064) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 3.429) (end -3.302 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 4.064) (end -2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -0.508 4.064) (end -2.286 4.064) (layer B.SilkS) (width 0.15))
(fp_line (start 2.286 4.064) (end 2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start 0.508 4.064) (end 2.286 4.064) (layer B.SilkS) (width 0.15))
(fp_arc (start 0 4.064) (end -0.508 4.064) (angle 180) (layer B.SilkS) (width 0.15))
(fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end 3.65 3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start 3.65 3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end -3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.2 2.25) (end -1.2 3.25) (layer B.Fab) (width 0.15))
(fp_line (start -2.2 -3.25) (end -2.2 2.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 -3.25) (end -2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 3.25) (end 2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start -1.2 3.25) (end 2.2 3.25) (layer B.Fab) (width 0.15))
(fp_text user %R (at 0 0 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(pad 20 smd oval (at 2.7 2.925 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 94 FTDI_TXD))
(pad 19 smd oval (at 2.7 2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 122 FTDI_nSLEEP))
(pad 18 smd oval (at 2.7 1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 160 FTDI_TXDEN))
(pad 17 smd oval (at 2.7 0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 287 FTDI_nRXLED))
(pad 16 smd oval (at 2.7 0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 15 smd oval (at 2.7 -0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 38 USB5V))
(pad 14 smd oval (at 2.7 -0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 40 nRESET))
(pad 13 smd oval (at 2.7 -1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 12 smd oval (at 2.7 -2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 100 USB_FTDI_D-))
(pad 11 smd oval (at 2.7 -2.925 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 99 USB_FTDI_D+))
(pad 10 smd oval (at -2.7 -2.925 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 121 FTDI_nTXLED))
(pad 9 smd oval (at -2.7 -2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 21 JTAG_TDO))
(pad 8 smd oval (at -2.7 -1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 20 JTAG_TMS))
(pad 7 smd oval (at -2.7 -0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 19 JTAG_TCK))
(pad 6 smd oval (at -2.7 -0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd oval (at -2.7 0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 18 JTAG_TDI))
(pad 4 smd oval (at -2.7 0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 95 FTDI_RXD))
(pad 3 smd oval (at -2.7 1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 2 smd oval (at -2.7 2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 93 FTDI_nRTS))
(pad 1 smd rect (at -2.7 2.925 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 41 FTDI_nDTR))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 0.93 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitor_SMD:C_0603_1608Metric (layer F.Cu) (tedit 5B301BBE) (tstamp 5AF6F50B) (module Capacitor_SMD:C_0603_1608Metric (layer F.Cu) (tedit 5B301BBE) (tstamp 5AF6F50B)
(at 151.758 75.771 90) (at 151.758 75.771 90)
(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator") (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
@ -4110,7 +4110,7 @@
(net 160 FTDI_TXDEN)) (net 160 FTDI_TXDEN))
(pad 1 smd roundrect (at -0.7875 0 90) (size 0.875 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25) (pad 1 smd roundrect (at -0.7875 0 90) (size 0.875 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
(net 1 GND)) (net 1 GND))
(model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl_disabled
(at (xyz 0 0 0)) (at (xyz 0 0 0))
(scale (xyz 1 1 1)) (scale (xyz 1 1 1))
(rotate (xyz 0 0 0)) (rotate (xyz 0 0 0))
@ -16821,7 +16821,7 @@
(segment (start 132.068384 105.398619) (end 132.277883 105.608118) (width 0.19) (layer In2.Cu) (net 287)) (segment (start 132.068384 105.398619) (end 132.277883 105.608118) (width 0.19) (layer In2.Cu) (net 287))
(segment (start 130.08 102.038622) (end 130.872879 102.831501) (width 0.19) (layer In2.Cu) (net 287)) (segment (start 130.08 102.038622) (end 130.872879 102.831501) (width 0.19) (layer In2.Cu) (net 287))
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5BBF20F1) (hatch edge 0.508) (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5BC5DAF7) (hatch edge 0.508)
(connect_pads (clearance 0.254)) (connect_pads (clearance 0.254))
(min_thickness 0.254) (min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -18454,64 +18454,64 @@
(xy 151.573073 68.159468) (xy 152.546 69.132395) (xy 152.560143 69.118253) (xy 152.739748 69.297858) (xy 152.725605 69.312) (xy 151.573073 68.159468) (xy 152.546 69.132395) (xy 152.560143 69.118253) (xy 152.739748 69.297858) (xy 152.725605 69.312)
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(pad 9 smd oval (at -2.7 -2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 21 JTAG_TDO))
(pad 8 smd oval (at -2.7 -1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 20 JTAG_TMS))
(pad 7 smd oval (at -2.7 -0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 19 JTAG_TCK))
(pad 6 smd oval (at -2.7 -0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd oval (at -2.7 0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 18 JTAG_TDI))
(pad 4 smd oval (at -2.7 0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 95 FTDI_RXD))
(pad 3 smd oval (at -2.7 1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 2 smd oval (at -2.7 2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 93 FTDI_nRTS))
(pad 1 smd rect (at -2.7 2.925 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 41 FTDI_nDTR))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 0.93 1 1))
(rotate (xyz 0 0 0))
)
)
(module micro-sd-schd3a0100:SCHD3A100 (layer F.Cu) (tedit 5BC09B7F) (tstamp 59DE2A17)
(at 115.05 103.5 270)
(descr "Micro SD card slot SCHD3A0100 from ALPS or ON-STARS")
(tags "Micro SD SCHD3A0100")
(path /58DA7327/590C84AE)
(solder_paste_margin -0.08)
(attr smd)
(fp_text reference SD1 (at -9.296 3.663 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SCHD3A0100 (at 5.9 -0.03) (layer F.Fab) hide
(effects (font (size 0.59944 0.59944) (thickness 0.12446)))
)
(fp_line (start -8.4 6.15) (end -6.25 6.15) (layer F.SilkS) (width 0.15))
(fp_line (start -8.4 -6.15) (end -8.4 6.15) (layer F.SilkS) (width 0.15))
(fp_line (start -5.15 -6.15) (end -8.4 -6.15) (layer F.SilkS) (width 0.15))
(fp_line (start 3.15 -6.15) (end -2.75 -6.15) (layer F.SilkS) (width 0.15))
(fp_line (start -2.75 6.15) (end 3.15 6.15) (layer F.SilkS) (width 0.15))
(fp_line (start 8.4 -6.15) (end 6.65 -6.15) (layer F.SilkS) (width 0.15))
(fp_line (start 8.4 6.15) (end 8.4 -6.15) (layer F.SilkS) (width 0.15))
(fp_line (start 5.5 6.15) (end 8.4 6.15) (layer F.SilkS) (width 0.15))
(fp_line (start 0.7 5) (end -4.25 -3.8) (layer Eco2.User) (width 0.15))
(fp_line (start -4.25 5) (end 0.7 -3.8) (layer Eco2.User) (width 0.15))
(fp_line (start 0.7 5) (end -4.25 5) (layer Eco2.User) (width 0.15))
(fp_line (start 0.7 -3.8) (end -4.25 -3.8) (layer Eco2.User) (width 0.15))
(fp_line (start -4.25 -3.8) (end -4.25 5) (layer Eco2.User) (width 0.15))
(fp_line (start 0.7 5) (end 0.7 -3.8) (layer Eco2.User) (width 0.15))
(fp_line (start 8.4 6.15) (end 8.4 -6.15) (layer F.Fab) (width 0.15))
(fp_line (start -8.4 6.15) (end 8.4 6.15) (layer F.Fab) (width 0.15))
(fp_line (start -8.4 -6.15) (end -8.4 6.15) (layer F.Fab) (width 0.15))
(fp_line (start 8.4 -6.15) (end -8.4 -6.15) (layer F.Fab) (width 0.15))
(fp_text user %R (at 0.0205 -0.005) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 1 smd rect (at 1.75 -3.2) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 126 SD_D2))
(pad 2 smd rect (at 1.75 -2.1) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 101 SD_D3))
(pad 3 smd rect (at 1.75 -1) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 34 SD_CMD))
(pad 4 smd rect (at 1.75 0.1) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 125 /sdcard/SD3V3))
(pad 5 smd rect (at 1.75 1.2) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 35 SD_CLK))
(pad 6 smd rect (at 1.75 2.3) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 7 smd rect (at 1.75 3.4) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 36 SD_D0))
(pad 8 smd rect (at 1.75 4.5) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 37 SD_D1))
(pad 10 smd rect (at 6.05 -6.875) (size 1.45 0.9) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 11 smd rect (at -5.65 6.875 90) (size 0.9 1.45) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 9 smd rect (at 4.35 6.875) (size 1.45 2) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 9 smd rect (at 4.35 -6.875) (size 1.45 2) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 9 smd rect (at -3.95 -6.875) (size 1.45 2) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 9 smd rect (at -3.95 6.875) (size 1.45 2) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(model ./footprints/micro-sd/micro-sd-schd3a0100.3dshapes/SCHD3A0100.wrl
(at (xyz 0 0 0))
(scale (xyz 0.3937 0.3937 0.3937))
(rotate (xyz 0 0 -90))
)
(model ${KIPRJMOD}/footprints/micro-sd/micro-sd-molex-47219-2001.3dshapes/molex-47219-2001.wrl_disabled
(offset (xyz -0.9 0 0.75))
(scale (xyz 0.3937 0.3937 0.3937))
(rotate (xyz -90 0 -90))
)
)
(module oscxo:Crystal_SMD_7050_4Pads (layer F.Cu) (tedit 5BC099EC) (tstamp 5B2837B5)
(at 105.672 72.36 180)
(descr "Crystal oscillator, 7.0x5.0mm, 4 Pads")
(tags "crystal oscillator quartz SMD SMT 7050")
(path /58D6BF46/5A079883)
(attr smd)
(fp_text reference Y1 (at 0 3.556 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value FNETHE025 (at 0 3.193 180) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.5 1.5) (end -3.5 -2.5) (layer F.Fab) (width 0.15))
(fp_line (start 3.5 2.5) (end -2.5 2.5) (layer F.Fab) (width 0.15))
(fp_line (start 3.5 -2.5) (end 3.5 2.5) (layer F.Fab) (width 0.15))
(fp_line (start -3.5 -2.5) (end 3.5 -2.5) (layer F.Fab) (width 0.15))
(fp_line (start -3.8 2.5) (end -4.35 2.5) (layer F.SilkS) (width 0.15))
(fp_line (start -3.5 -1.1) (end -3.5 1.1) (layer F.SilkS) (width 0.15))
(fp_line (start -1.2 2.5) (end 1.2 2.5) (layer F.SilkS) (width 0.15))
(fp_line (start -3.5 1.1) (end -4.35 1.1) (layer F.SilkS) (width 0.15))
(fp_line (start -4.75 -3.1) (end -4.75 3.1) (layer F.CrtYd) (width 0.05))
(fp_line (start 4.75 -3.1) (end -4.75 -3.1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.2 -2.5) (end 1.2 -2.5) (layer F.SilkS) (width 0.15))
(fp_line (start 3.5 1.1) (end 3.5 -1.1) (layer F.SilkS) (width 0.15))
(fp_line (start 4.75 3.1) (end -4.75 3.1) (layer F.CrtYd) (width 0.05))
(fp_line (start 4.75 -3.1) (end 4.75 3.1) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.5 2.5) (end -3.5 1.5) (layer F.Fab) (width 0.15))
(pad 1 smd rect (at -2.54 2.2 180) (size 2.2 1.8) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3) (solder_paste_margin -0.15))
(pad 2 smd rect (at 2.54 2.2 180) (size 2.2 1.8) (layers F.Cu F.Paste F.Mask)
(net 1 GND) (solder_paste_margin -0.15))
(pad 3 smd rect (at 2.54 -2.2 180) (size 2.2 1.8) (layers F.Cu F.Paste F.Mask)
(net 127 CLK_25MHz) (solder_paste_margin -0.15))
(pad 4 smd rect (at -2.54 -2.2 180) (size 2.2 1.8) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3) (solder_paste_margin -0.15))
(model ./footprints/crystal/oscxo.3dshapes/oscxo.wrl
(at (xyz 0 0 0))
(scale (xyz 0.3937 0.3937 0.3937))
(rotate (xyz 0 0 0))
)
)
(module L_1008_1210:L_1008_1210 (layer B.Cu) (tedit 5BC09943) (tstamp 5B191568) (module L_1008_1210:L_1008_1210 (layer B.Cu) (tedit 5BC09943) (tstamp 5B191568)
(at 156.33 74.755 180) (at 156.33 74.755 180)
(descr "Inductor SMD 1008-1210 (2520-3225 Metric), square (rectangular) end terminal") (descr "Inductor SMD 1008-1210 (2520-3225 Metric), square (rectangular) end terminal")
@ -2636,86 +2835,6 @@
) )
) )
(module ft231x:FT231X-SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 5B9966E3) (tstamp 5B2637EB)
(at 132.835 107.14 180)
(descr "FT231X SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
(tags "FT231X SSOP 0.65")
(path /58D6BF46/58EB61C6)
(attr smd)
(fp_text reference U6 (at -3.556 4.318 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value FT231XS (at -0.045 -4.86 180) (layer B.Fab) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start 2.286 -4.064) (end 2.286 -3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -4.064) (end 2.286 -4.064) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 -3.429) (end -2.286 -4.064) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 3.429) (end -3.302 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -2.286 4.064) (end -2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start -0.508 4.064) (end -2.286 4.064) (layer B.SilkS) (width 0.15))
(fp_line (start 2.286 4.064) (end 2.286 3.429) (layer B.SilkS) (width 0.15))
(fp_line (start 0.508 4.064) (end 2.286 4.064) (layer B.SilkS) (width 0.15))
(fp_arc (start 0 4.064) (end -0.508 4.064) (angle 180) (layer B.SilkS) (width 0.15))
(fp_line (start -3.65 -3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end 3.65 3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start 3.65 3.55) (end 3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -3.65 3.55) (end -3.65 -3.55) (layer B.CrtYd) (width 0.05))
(fp_line (start -2.2 2.25) (end -1.2 3.25) (layer B.Fab) (width 0.15))
(fp_line (start -2.2 -3.25) (end -2.2 2.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 -3.25) (end -2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start 2.2 3.25) (end 2.2 -3.25) (layer B.Fab) (width 0.15))
(fp_line (start -1.2 3.25) (end 2.2 3.25) (layer B.Fab) (width 0.15))
(fp_text user %R (at 0 0 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(pad 20 smd oval (at 2.7 2.925 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 94 FTDI_TXD))
(pad 19 smd oval (at 2.7 2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 122 FTDI_nSLEEP))
(pad 18 smd oval (at 2.7 1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 160 FTDI_TXDEN))
(pad 17 smd oval (at 2.7 0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 287 FTDI_nRXLED))
(pad 16 smd oval (at 2.7 0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 15 smd oval (at 2.7 -0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 38 USB5V))
(pad 14 smd oval (at 2.7 -0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 40 nRESET))
(pad 13 smd oval (at 2.7 -1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 12 smd oval (at 2.7 -2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 100 USB_FTDI_D-))
(pad 11 smd oval (at 2.7 -2.925 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 99 USB_FTDI_D+))
(pad 10 smd oval (at -2.7 -2.925 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 121 FTDI_nTXLED))
(pad 9 smd oval (at -2.7 -2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 21 JTAG_TDO))
(pad 8 smd oval (at -2.7 -1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 20 JTAG_TMS))
(pad 7 smd oval (at -2.7 -0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 19 JTAG_TCK))
(pad 6 smd oval (at -2.7 -0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd oval (at -2.7 0.325 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 18 JTAG_TDI))
(pad 4 smd oval (at -2.7 0.975 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 95 FTDI_RXD))
(pad 3 smd oval (at -2.7 1.625 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 173 FT2V5))
(pad 2 smd oval (at -2.7 2.275 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 93 FTDI_nRTS))
(pad 1 smd rect (at -2.7 2.925 180) (size 1.1 0.4) (layers B.Cu B.Paste B.Mask)
(net 41 FTDI_nDTR))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_4.4x6.5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 0.93 1 1))
(rotate (xyz 0 0 0))
)
)
(module Capacitor_SMD:C_0603_1608Metric (layer F.Cu) (tedit 5B301BBE) (tstamp 5AF6F50B) (module Capacitor_SMD:C_0603_1608Metric (layer F.Cu) (tedit 5B301BBE) (tstamp 5AF6F50B)
(at 151.758 75.771 90) (at 151.758 75.771 90)
(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator") (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
@ -3991,7 +4110,7 @@
(net 160 FTDI_TXDEN)) (net 160 FTDI_TXDEN))
(pad 1 smd roundrect (at -0.7875 0 90) (size 0.875 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25) (pad 1 smd roundrect (at -0.7875 0 90) (size 0.875 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
(net 1 GND)) (net 1 GND))
(model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl_disabled
(at (xyz 0 0 0)) (at (xyz 0 0 0))
(scale (xyz 1 1 1)) (scale (xyz 1 1 1))
(rotate (xyz 0 0 0)) (rotate (xyz 0 0 0))
@ -8061,124 +8180,6 @@
) )
) )
(module micro-sd-schd3a0100:SCHD3A100 (layer F.Cu) (tedit 5B893431) (tstamp 59DE2A17)
(at 115.05 103.5 270)
(descr "Micro SD card slot SCHD3A0100 from ALPS or ON-STARS")
(tags "Micro SD SCHD3A0100")
(path /58DA7327/590C84AE)
(attr smd)
(fp_text reference SD1 (at -9.296 3.663 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SCHD3A0100 (at 5.9 -0.03) (layer F.Fab) hide
(effects (font (size 0.59944 0.59944) (thickness 0.12446)))
)
(fp_line (start -8.4 6.15) (end -6.25 6.15) (layer F.SilkS) (width 0.15))
(fp_line (start -8.4 -6.15) (end -8.4 6.15) (layer F.SilkS) (width 0.15))
(fp_line (start -5.15 -6.15) (end -8.4 -6.15) (layer F.SilkS) (width 0.15))
(fp_line (start 3.15 -6.15) (end -2.75 -6.15) (layer F.SilkS) (width 0.15))
(fp_line (start -2.75 6.15) (end 3.15 6.15) (layer F.SilkS) (width 0.15))
(fp_line (start 8.4 -6.15) (end 6.65 -6.15) (layer F.SilkS) (width 0.15))
(fp_line (start 8.4 6.15) (end 8.4 -6.15) (layer F.SilkS) (width 0.15))
(fp_line (start 5.5 6.15) (end 8.4 6.15) (layer F.SilkS) (width 0.15))
(fp_line (start 0.7 5) (end -4.25 -3.8) (layer Eco2.User) (width 0.15))
(fp_line (start -4.25 5) (end 0.7 -3.8) (layer Eco2.User) (width 0.15))
(fp_line (start 0.7 5) (end -4.25 5) (layer Eco2.User) (width 0.15))
(fp_line (start 0.7 -3.8) (end -4.25 -3.8) (layer Eco2.User) (width 0.15))
(fp_line (start -4.25 -3.8) (end -4.25 5) (layer Eco2.User) (width 0.15))
(fp_line (start 0.7 5) (end 0.7 -3.8) (layer Eco2.User) (width 0.15))
(fp_line (start 8.4 6.15) (end 8.4 -6.15) (layer F.Fab) (width 0.15))
(fp_line (start -8.4 6.15) (end 8.4 6.15) (layer F.Fab) (width 0.15))
(fp_line (start -8.4 -6.15) (end -8.4 6.15) (layer F.Fab) (width 0.15))
(fp_line (start 8.4 -6.15) (end -8.4 -6.15) (layer F.Fab) (width 0.15))
(fp_text user %R (at 0.0205 -0.005) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 1 smd rect (at 1.75 -3.2) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 126 SD_D2))
(pad 2 smd rect (at 1.75 -2.1) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 101 SD_D3))
(pad 3 smd rect (at 1.75 -1) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 34 SD_CMD))
(pad 4 smd rect (at 1.75 0.1) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 125 /sdcard/SD3V3))
(pad 5 smd rect (at 1.75 1.2) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 35 SD_CLK))
(pad 6 smd rect (at 1.75 2.3) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 7 smd rect (at 1.75 3.4) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 36 SD_D0))
(pad 8 smd rect (at 1.75 4.5) (size 0.7 1.5) (layers F.Cu F.Paste F.Mask)
(net 37 SD_D1))
(pad 10 smd rect (at 6.05 -6.875) (size 1.45 0.9) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 11 smd rect (at -5.65 6.875 90) (size 0.9 1.45) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 9 smd rect (at 4.35 6.875) (size 1.45 2) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 9 smd rect (at 4.35 -6.875) (size 1.45 2) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 9 smd rect (at -3.95 -6.875) (size 1.45 2) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 9 smd rect (at -3.95 6.875) (size 1.45 2) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(model ./footprints/micro-sd/micro-sd-schd3a0100.3dshapes/SCHD3A0100.wrl
(at (xyz 0 0 0))
(scale (xyz 0.3937 0.3937 0.3937))
(rotate (xyz 0 0 -90))
)
(model ${KIPRJMOD}/footprints/micro-sd/micro-sd-molex-47219-2001.3dshapes/molex-47219-2001.wrl_disabled
(offset (xyz -0.9 0 0.75))
(scale (xyz 0.3937 0.3937 0.3937))
(rotate (xyz -90 0 -90))
)
)
(module oscxo:Crystal_SMD_7050_4Pads (layer F.Cu) (tedit 5B89348A) (tstamp 5B2837B5)
(at 105.672 72.36 180)
(descr "Crystal oscillator, 7.0x5.0mm, 4 Pads")
(tags "crystal oscillator quartz SMD SMT 7050")
(path /58D6BF46/5A079883)
(attr smd)
(fp_text reference Y1 (at 0 3.556 180) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value FNETHE025 (at 0 3.193 180) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.5 1.5) (end -3.5 -2.5) (layer F.Fab) (width 0.15))
(fp_line (start 3.5 2.5) (end -2.5 2.5) (layer F.Fab) (width 0.15))
(fp_line (start 3.5 -2.5) (end 3.5 2.5) (layer F.Fab) (width 0.15))
(fp_line (start -3.5 -2.5) (end 3.5 -2.5) (layer F.Fab) (width 0.15))
(fp_line (start -3.8 2.5) (end -4.35 2.5) (layer F.SilkS) (width 0.15))
(fp_line (start -3.5 -1.1) (end -3.5 1.1) (layer F.SilkS) (width 0.15))
(fp_line (start -1.2 2.5) (end 1.2 2.5) (layer F.SilkS) (width 0.15))
(fp_line (start -3.5 1.1) (end -4.35 1.1) (layer F.SilkS) (width 0.15))
(fp_line (start -4.75 -3.1) (end -4.75 3.1) (layer F.CrtYd) (width 0.05))
(fp_line (start 4.75 -3.1) (end -4.75 -3.1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.2 -2.5) (end 1.2 -2.5) (layer F.SilkS) (width 0.15))
(fp_line (start 3.5 1.1) (end 3.5 -1.1) (layer F.SilkS) (width 0.15))
(fp_line (start 4.75 3.1) (end -4.75 3.1) (layer F.CrtYd) (width 0.05))
(fp_line (start 4.75 -3.1) (end 4.75 3.1) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.5 2.5) (end -3.5 1.5) (layer F.Fab) (width 0.15))
(pad 1 smd rect (at -2.54 2.2 180) (size 2.2 1.8) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3))
(pad 2 smd rect (at 2.54 2.2 180) (size 2.2 1.8) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 3 smd rect (at 2.54 -2.2 180) (size 2.2 1.8) (layers F.Cu F.Paste F.Mask)
(net 127 CLK_25MHz))
(pad 4 smd rect (at -2.54 -2.2 180) (size 2.2 1.8) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3))
(model ./footprints/crystal/oscxo.3dshapes/oscxo.wrl
(at (xyz 0 0 0))
(scale (xyz 0.3937 0.3937 0.3937))
(rotate (xyz 0 0 0))
)
)
(module oled:oled_13xx (layer F.Cu) (tedit 5B893AFE) (tstamp 58F0DA19) (module oled:oled_13xx (layer F.Cu) (tedit 5B893AFE) (tstamp 58F0DA19)
(at 139.82 100.79 180) (at 139.82 100.79 180)
(descr "SPI OLED 0.96\"") (descr "SPI OLED 0.96\"")
@ -16820,7 +16821,7 @@
(segment (start 132.068384 105.398619) (end 132.277883 105.608118) (width 0.19) (layer In2.Cu) (net 287)) (segment (start 132.068384 105.398619) (end 132.277883 105.608118) (width 0.19) (layer In2.Cu) (net 287))
(segment (start 130.08 102.038622) (end 130.872879 102.831501) (width 0.19) (layer In2.Cu) (net 287)) (segment (start 130.08 102.038622) (end 130.872879 102.831501) (width 0.19) (layer In2.Cu) (net 287))
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5BBF20F1) (hatch edge 0.508) (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5BC5DAF7) (hatch edge 0.508)
(connect_pads (clearance 0.254)) (connect_pads (clearance 0.254))
(min_thickness 0.254) (min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -18730,7 +18731,7 @@
) )
) )
) )
(zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5BBF20EE) (hatch edge 0.508) (zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5BC5DAF4) (hatch edge 0.508)
(connect_pads (clearance 0.127)) (connect_pads (clearance 0.127))
(min_thickness 0.254) (min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -18797,7 +18798,7 @@
) )
) )
) )
(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5BBF20EB) (hatch edge 0.508) (zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5BC5DAF1) (hatch edge 0.508)
(connect_pads (clearance 0.127)) (connect_pads (clearance 0.127))
(min_thickness 0.126) (min_thickness 0.126)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20210,7 +20211,7 @@
) )
) )
) )
(zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5BBF20E8) (hatch edge 0.508) (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5BC5DAEE) (hatch edge 0.508)
(connect_pads (clearance 0.127)) (connect_pads (clearance 0.127))
(min_thickness 0.126) (min_thickness 0.126)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20470,7 +20471,7 @@
) )
) )
) )
(zone (net 169) (net_name +1V1) (layer In1.Cu) (tstamp 5BBF20E5) (hatch edge 0.508) (zone (net 169) (net_name +1V1) (layer In1.Cu) (tstamp 5BC5DAEB) (hatch edge 0.508)
(connect_pads (clearance 0.127)) (connect_pads (clearance 0.127))
(min_thickness 0.254) (min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20553,7 +20554,7 @@
) )
) )
) )
(zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5BBF20E2) (hatch edge 0.508) (zone (net 261) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5BC5DAE8) (hatch edge 0.508)
(connect_pads (clearance 0.127)) (connect_pads (clearance 0.127))
(min_thickness 0.127) (min_thickness 0.127)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20710,7 +20711,7 @@
) )
) )
) )
(zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5BBF20DF) (hatch edge 0.508) (zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5BC5DAE5) (hatch edge 0.508)
(connect_pads (clearance 0.127)) (connect_pads (clearance 0.127))
(min_thickness 0.126) (min_thickness 0.126)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -22182,7 +22183,7 @@
) )
) )
) )
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5BBF20DC) (hatch edge 0.508) (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5BC5DAE2) (hatch edge 0.508)
(connect_pads (clearance 0.127)) (connect_pads (clearance 0.127))
(min_thickness 0.254) (min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))

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