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PCB: fix selection of parts for insertion

Browse Source
pull/3/head
Emard 6 years ago
parent 08c7348419
commit 1ba56909c8
2 changed files with 46 additions and 43 deletions
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36
ulx3s.kicad_pcb
Unescape View File

@ -1211,10 +1211,11 @@
(module ESP32:ESP32-WROOM (layer B.Cu) (tedit 5B1AAE56) (tstamp 5A111CE5)
(at 117.23 105.75 180)
(path /58D6D447/58E5662B)
(attr smd)
(fp_text reference U9 (at -8.366 13.85 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value ESP-WROOM-32 (at 5.715 -14.224 180) (layer B.Fab)
(fp_text value ESP-WROOM32 (at 5.715 -14.224 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user "Espressif Systems" (at -6.858 0.889 90) (layer B.SilkS)
@ -2349,12 +2350,12 @@
(at 160.14 74.12 90)
(descr "4x-dip-switch, Slide, row spacing 8.61 mm (338 mils), SMD, LowProfile")
(tags "DIP Switch Slide 8.61mm 338mil SMD LowProfile")
(path /58D6547C/595B94DC)
(path /58D6547C/5B1DD3B8)
(attr smd)
(fp_text reference SW1 (at -4.59 -7.224) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.25)))
)
(fp_text value DIPSW (at 0 6.98 90) (layer F.Fab)
(fp_text value SW_DIP_x04 (at 0 6.98 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.34 -5.86) (end 3.34 -5.86) (layer F.Fab) (width 0.1))
@ -3457,6 +3458,7 @@
(descr "Micro SD card slot SCHD3A0100 from ALPS or ON-STARS")
(tags "Micro SD SCHD3A0100")
(path /58DA7327/590C84AE)
(attr smd)
(fp_text reference SD1 (at 5.55 0) (layer F.SilkS)
(effects (font (size 0.59944 0.59944) (thickness 0.12446)))
)
@ -8210,14 +8212,14 @@
)
)
(module Resistor_SMD:R_0603_1608Metric (layer B.Cu) (tedit 59FE48B8) (tstamp 5B0D6FDC)
(module Resistor_SMD:R_0603_1608Metric (layer B.Cu) (tedit 5B1D7498) (tstamp 5B0D6FDC)
(at 128.39 109.68 270)
(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags resistor)
(path /58D6BF46/58EB9CB5)
(attr smd)
(fp_text reference R9 (at 1.542 -1.666) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
(fp_text reference R9 (at -2.141 -0.015 90) (layer B.SilkS)
(effects (font (size 1 0.75) (thickness 0.15)) (justify mirror))
)
(fp_text value 15k (at 0 -1.65 270) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
@ -9751,7 +9753,7 @@
(descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags "resistor handsolder")
(path /58D51CAD/5AF31FAC)
(attr smd)
(attr virtual)
(fp_text reference RV2 (at 0.254 -1.65) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
@ -9785,7 +9787,7 @@
(descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags "resistor handsolder")
(path /58D51CAD/5AF3694A)
(attr smd)
(attr virtual)
(fp_text reference RV3 (at 0 -1.65) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
@ -10063,7 +10065,7 @@
(at 115.07 65.629 180)
(descr "Imported from /home/davor/tmp/koncar/koncar.svg")
(tags svg2mod)
(attr smd)
(attr virtual)
(fp_text reference svg2mod (at 0 4.407697 180) (layer B.SilkS) hide
(effects (font (size 1.524 1.524) (thickness 0.3048)) (justify mirror))
)
@ -15859,7 +15861,7 @@
(segment (start 130.422 73.898) (end 129.622 73.898) (width 0.3) (layer B.Cu) (net 317))
(segment (start 129.622 73.898) (end 128.532 72.808) (width 0.3) (layer B.Cu) (net 317))
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B1BE106) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B1D7544) (hatch edge 0.508)
(connect_pads (clearance 0.254))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -17721,7 +17723,7 @@
)
)
)
(zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B1BE103) (hatch edge 0.508)
(zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B1D7541) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -17787,7 +17789,7 @@
)
)
)
(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B1BE100) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B1D753E) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.1)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -18979,7 +18981,7 @@
)
)
)
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B1BE0FD) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B1D753B) (hatch edge 0.508)
(connect_pads (clearance 0.254))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20097,7 +20099,7 @@
)
)
)
(zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1BE0FA) (hatch edge 0.508)
(zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1D7538) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.127)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20348,7 +20350,7 @@
)
)
)
(zone (net 170) (net_name +1V1) (layer In1.Cu) (tstamp 5B1BE0F7) (hatch edge 0.508)
(zone (net 170) (net_name +1V1) (layer In1.Cu) (tstamp 5B1D7535) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20425,7 +20427,7 @@
)
)
)
(zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1BE0F4) (hatch edge 0.508)
(zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1D7532) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.127)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20589,7 +20591,7 @@
)
)
)
(zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B1BE0F1) (hatch edge 0.508)
(zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B1D752F) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.127)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))

53
ulx3s.kicad_pcb-bak
Unescape View File

@ -11,10 +11,10 @@
(page A4)
(layers
(0 F.Cu signal hide)
(1 In1.Cu signal hide)
(2 In2.Cu signal hide)
(31 B.Cu signal hide)
(0 F.Cu signal)
(1 In1.Cu signal)
(2 In2.Cu signal)
(31 B.Cu signal)
(32 B.Adhes user)
(33 F.Adhes user)
(34 B.Paste user)
@ -62,7 +62,7 @@
(pad_to_mask_clearance 0.05)
(aux_axis_origin 94.1 112.22)
(grid_origin 93.48 113)
(visible_elements 7FFFFDFF)
(visible_elements 7FFFFFFF)
(pcbplotparams
(layerselection 0x010fc_ffffffff)
(usegerberextensions true)
@ -1211,10 +1211,11 @@
(module ESP32:ESP32-WROOM (layer B.Cu) (tedit 5B1AAE56) (tstamp 5A111CE5)
(at 117.23 105.75 180)
(path /58D6D447/58E5662B)
(attr smd)
(fp_text reference U9 (at -8.366 13.85 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value ESP-WROOM-32 (at 5.715 -14.224 180) (layer B.Fab)
(fp_text value ESP-WROOM32 (at 5.715 -14.224 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user "Espressif Systems" (at -6.858 0.889 90) (layer B.SilkS)
@ -2349,12 +2350,12 @@
(at 160.14 74.12 90)
(descr "4x-dip-switch, Slide, row spacing 8.61 mm (338 mils), SMD, LowProfile")
(tags "DIP Switch Slide 8.61mm 338mil SMD LowProfile")
(path /58D6547C/595B94DC)
(path /58D6547C/5B1DD3B8)
(attr smd)
(fp_text reference SW1 (at -4.59 -7.224) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.25)))
)
(fp_text value DIPSW (at 0 6.98 90) (layer F.Fab)
(fp_text value SW_DIP_x04 (at 0 6.98 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.34 -5.86) (end 3.34 -5.86) (layer F.Fab) (width 0.1))
@ -4441,7 +4442,7 @@
(tags capacitor)
(path /58D51CAD/59246E14)
(attr smd)
(fp_text reference C20 (at -2.703 -0.065) (layer B.SilkS)
(fp_text reference C20 (at -2.83 -0.065) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 2.2uF (at 0 -1.85 270) (layer B.Fab)
@ -4657,7 +4658,7 @@
(tags capacitor)
(path /58D51CAD/5A5F91FE)
(attr smd)
(fp_text reference C26 (at -3.192 -0.052 270) (layer B.SilkS)
(fp_text reference C26 (at -3.319 -0.052 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 22nF (at 0 -1.65 270) (layer B.Fab)
@ -4801,7 +4802,7 @@
(tags capacitor)
(path /58D51CAD/5A5FC402)
(attr smd)
(fp_text reference C30 (at 0.009 1.288 270) (layer B.SilkS)
(fp_text reference C30 (at 0.136 1.288 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 22nF (at 0 -1.65 270) (layer B.Fab)
@ -4837,7 +4838,7 @@
(tags capacitor)
(path /58D51CAD/5A5FEEA6)
(attr smd)
(fp_text reference C31 (at -2.869 0.069) (layer B.SilkS)
(fp_text reference C31 (at -2.869 -0.058) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 22nF (at 0 -1.65) (layer B.Fab)
@ -5593,7 +5594,7 @@
(tags capacitor)
(path /58D51CAD/5AC310F3)
(attr smd)
(fp_text reference C53 (at 2.8842 0 180) (layer B.SilkS)
(fp_text reference C53 (at 2.8842 -0.127 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value 22nF (at 0 -1.65 180) (layer B.Fab)
@ -9751,7 +9752,7 @@
(descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags "resistor handsolder")
(path /58D51CAD/5AF31FAC)
(attr smd)
(attr virtual)
(fp_text reference RV2 (at 0.254 -1.65) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
@ -9785,7 +9786,7 @@
(descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
(tags "resistor handsolder")
(path /58D51CAD/5AF3694A)
(attr smd)
(attr virtual)
(fp_text reference RV3 (at 0 -1.65) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
@ -10063,7 +10064,7 @@
(at 115.07 65.629 180)
(descr "Imported from /home/davor/tmp/koncar/koncar.svg")
(tags svg2mod)
(attr smd)
(attr virtual)
(fp_text reference svg2mod (at 0 4.407697 180) (layer B.SilkS) hide
(effects (font (size 1.524 1.524) (thickness 0.3048)) (justify mirror))
)
@ -10215,7 +10216,7 @@
(gr_line (start 138.057 84.679) (end 134.628 84.679) (layer B.SilkS) (width 0.2))
(gr_line (start 138.311 84.933) (end 138.057 84.679) (layer B.SilkS) (width 0.2))
(gr_line (start 138.057 89.378) (end 138.438 89.886) (layer B.SilkS) (width 0.2))
(gr_line (start 132.215 89.378) (end 138.057 89.378) (layer B.SilkS) (width 0.2))
(gr_line (start 132.342 89.378) (end 138.057 89.378) (layer B.SilkS) (width 0.2) (tstamp 5B1E2C48))
(gr_circle (center 153.551 76.551) (end 153.678 76.551) (layer F.SilkS) (width 0.2) (tstamp 5B1AF3C4))
(gr_circle (center 179.459 103.475) (end 179.586 103.475) (layer F.SilkS) (width 0.2))
(gr_text 9 (at 99.703 95.728) (layer B.SilkS) (tstamp 5B283687)
@ -10881,7 +10882,7 @@
(gr_text +3.3V (at 131.072 84.552) (layer B.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify mirror))
)
(gr_text +1.1V (at 128.659 89.251) (layer B.SilkS)
(gr_text +1.1V (at 128.786 89.251) (layer B.SilkS) (tstamp 5B1E2555)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify mirror))
)
(gr_text TCK (at 142.233 107.14 90) (layer B.SilkS)
@ -15859,7 +15860,7 @@
(segment (start 130.422 73.898) (end 129.622 73.898) (width 0.3) (layer B.Cu) (net 317))
(segment (start 129.622 73.898) (end 128.532 72.808) (width 0.3) (layer B.Cu) (net 317))
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B1BE106) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5B1D7522) (hatch edge 0.508)
(connect_pads (clearance 0.254))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -17721,7 +17722,7 @@
)
)
)
(zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B1BE103) (hatch edge 0.508)
(zone (net 13) (net_name +2V5) (layer In1.Cu) (tstamp 5B1D751F) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -17787,7 +17788,7 @@
)
)
)
(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B1BE100) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5B1D751C) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.1)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -18979,7 +18980,7 @@
)
)
)
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B1BE0FD) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5B1D7519) (hatch edge 0.508)
(connect_pads (clearance 0.254))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20097,7 +20098,7 @@
)
)
)
(zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1BE0FA) (hatch edge 0.508)
(zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1D7516) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.127)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20348,7 +20349,7 @@
)
)
)
(zone (net 170) (net_name +1V1) (layer In1.Cu) (tstamp 5B1BE0F7) (hatch edge 0.508)
(zone (net 170) (net_name +1V1) (layer In1.Cu) (tstamp 5B1D7513) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.254)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20425,7 +20426,7 @@
)
)
)
(zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1BE0F4) (hatch edge 0.508)
(zone (net 262) (net_name 2V5_3V3) (layer In1.Cu) (tstamp 5B1D7510) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.127)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -20589,7 +20590,7 @@
)
)
)
(zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B1BE0F1) (hatch edge 0.508)
(zone (net 5) (net_name +3V3) (layer In1.Cu) (tstamp 5B1D750D) (hatch edge 0.508)
(connect_pads (clearance 0.127))
(min_thickness 0.127)
(fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))

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