add 8 solder pins to SD contactpull/3/head
parent
39034db585
commit
48f9abacba
@ -0,0 +1,112 @@
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dim=[12.43,16.8,1.7]; // base dimensions
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above=0.1; // base above the PCB clearance
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color_base=[0.2,0.1,0.1];
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// 2 small pins (small) GND
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dim_pin_small=[1.1,0.4,0.1];
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pos_pin_small=[
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[-dim[0]/2-dim_pin_small[0]/2,dim[1]/2-2.75,0.05],
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[ dim[0]/2+dim_pin_small[0]/2,dim[1]/2-14.45,0.05]
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];
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// mounting 4 side pins (big)
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dim_pin_big=[1.1,1.4,0.1];
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pos_pin_big=[
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[-dim[0]/2-dim_pin_big[0]/2,dim[1]/2-4.45,0.05],
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[ dim[0]/2+dim_pin_big[0]/2,dim[1]/2-4.45,0.05],
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[-dim[0]/2-dim_pin_big[0]/2,dim[1]/2-12.75,0.05],
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[ dim[0]/2+dim_pin_big[0]/2,dim[1]/2-12.75,0.05]
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];
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// Pins for signal solder contacts
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pin_th = 0.1; // Thickness
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pin_W = 0.4; // Pin width
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pin_L = 7.3; // Total Length
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pin_H = 0.3+pin_th/2; // Pin height (from bottom to top)
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pin_l = 0.4; // Length of the bottom part
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pin_a = 115; // Bending angle
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pin_pitch = 1.1;
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pin_count = 8;
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color_pin="white";
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// Bent pin
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// _L - whole pin length
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// _l - length of bottom part
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// _H - whole pin height
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// _th - pin thickness
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// _a - bending angle
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// _W - pin width
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module pin(_L,_l,_H,_th,_a,_W)
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{
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// Internal variables
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_d1 = _th*sin(_a) / (1-cos(_a));
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_d2 = (_th-_H)*cos(_a) / sin(_a);
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rotate([90,0,90])
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// Extrude the following polygon
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linear_extrude(height = _W, center = true, convexity = 10, twist = 0)
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polygon([[0,0],
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[_l,0],
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[_l+_d2,_H-_th],
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[_L,_H-_th],
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[_L,_H],
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[_l+_d2-_d1,_H],
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[_l-_d1,_th],
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[0,_th]]);
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}
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// Array of pins
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// _cnt - number of pins
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// _distance - distance between pin centres
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module pins_array(_cnt, _distance)
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{
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if (_cnt>0)
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color(color_pin)
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{
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for (_i = [0:_cnt-1])
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{
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translate([_distance*_i,0,0])
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pin(pin_L,pin_l,pin_H,pin_th,pin_a,pin_W);
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}
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}
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}
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module SCHD3A100()
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{
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translate([0,0,dim[2]/2+above])
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difference()
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{
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color(color_base)
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cube(dim, center=true);
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// cut SD card area
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translate([0,0,dim[2]/2-1/2+0.01])
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color(color_base)
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cube([11,15,1],center=true);
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// cut pin soldering area
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translate([-1.3/2,dim[1]/2-10.15,0])
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color(color_base)
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cube([8.9,2,4],center=true);
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// cut pin spring area
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translate([-1.3/2,dim[1]/2-5,0])
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color(color_base)
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cube([8.9,6,4],center=true);
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}
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for(i=[0:len(pos_pin_big)-1])
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translate(pos_pin_big[i])
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color(color_pin)
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cube(dim_pin_big,center=true);
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for(i=[0:len(pos_pin_small)-1])
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translate(pos_pin_small[i])
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color(color_pin)
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cube(dim_pin_small,center=true);
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translate([3.2-(pin_count-1)*pin_pitch,-1.9,0])
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pins_array(pin_count, pin_pitch);
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}
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SCHD3A100();
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@ -1,53 +0,0 @@
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dim=[12.43,16.8,1.7]; // base dimensions
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above=0.0; // base above the PCB clearance
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color_base=[0.2,0.1,0.1];
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dim_pin_small=[1.1,0.4,0.1];
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pos_pin_small=[
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[-dim[0]/2-dim_pin_small[0]/2,dim[1]/2-2.75,0.05],
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[ dim[0]/2+dim_pin_small[0]/2,dim[1]/2-14.45,0.05]
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];
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dim_pin_big=[1.1,1.4,0.1];
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pos_pin_big=[
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[-dim[0]/2-dim_pin_big[0]/2,dim[1]/2-4.45,0.05],
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[ dim[0]/2+dim_pin_big[0]/2,dim[1]/2-4.45,0.05],
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[-dim[0]/2-dim_pin_big[0]/2,dim[1]/2-12.75,0.05],
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[ dim[0]/2+dim_pin_big[0]/2,dim[1]/2-12.75,0.05]
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];
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color_pin="white";
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module SCHD3A100()
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{
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translate([0,0,dim[2]/2+above])
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difference()
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{
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color(color_base)
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cube(dim, center=true);
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// cut SD card area
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translate([0,0,dim[2]/2-1/2+0.01])
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color(color_base)
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cube([11,15,1],center=true);
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// cut pin soldering area
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translate([-1.3/2,dim[1]/2-10.15,0])
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color(color_base)
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cube([8.9,2,4],center=true);
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// cut pin spring area
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translate([-1.3/2,dim[1]/2-5,0])
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color(color_base)
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cube([8.9,6,4],center=true);
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}
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for(i=[0:len(pos_pin_big)-1])
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translate(pos_pin_big[i])
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color(color_pin)
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cube(dim_pin_big,center=true);
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for(i=[0:len(pos_pin_small)-1])
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translate(pos_pin_small[i])
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color(color_pin)
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cube(dim_pin_small,center=true);
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}
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SCHD3A100();
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