I2C SM8 footprint properly oriented from TI tape and reel datasheet

pull/3/head
Emard 7 years ago
parent d0802747ac
commit 55f4a44ee5

@ -0,0 +1,29 @@
(module SM8:SM8 (layer F.Cu) (tedit 0)
(descr "SM8 Surface Mount Small Outline 150mil 8pin Package")
(tags "TI I2C 8-pin package")
(fp_text reference U7 (at 0.031144 0.008064) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value PCF8523 (at 0.031144 0.008064) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center -1.873856 0.770064) (end -1.746856 0.770064) (layer F.SilkS) (width 0.15))
(fp_line (start -2.508856 1.405064) (end 2.571144 1.405064) (layer F.SilkS) (width 0.15))
(fp_line (start -2.508856 -1.896936) (end 2.571144 -1.896936) (layer F.SilkS) (width 0.15))
(fp_line (start -2.508856 1.913064) (end 2.571144 1.913064) (layer F.SilkS) (width 0.15))
(fp_line (start -2.508856 1.913064) (end -2.508856 -1.896936) (layer F.SilkS) (width 0.15))
(fp_line (start 2.571144 1.913064) (end 2.571144 -1.896936) (layer F.SilkS) (width 0.15))
(pad 1 smd oval (at -1.873856 2.802064) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 2 smd oval (at -0.603856 2.802064) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 3 smd oval (at 0.666144 2.802064) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 4 smd oval (at 1.936144 2.802064) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 5 smd oval (at 1.936144 -2.785936) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 6 smd oval (at 0.666144 -2.785936) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 7 smd oval (at -0.603856 -2.785936) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 8 smd oval (at -1.873856 -2.785936) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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