|  |  | @ -244,5 +244,5 @@ Here is checklist what was done or should be done in the next PCB release. | 
			
		
	
		
		
			
				
					
					|  |  |  |     [x] fix copper layer after using non-handsoldering resistor footprints |  |  |  |     [x] fix copper layer after using non-handsoldering resistor footprints | 
			
		
	
		
		
			
				
					
					|  |  |  |     [x] DIP switch must be pulled up at 2.5/3.3V or 2.5V line, not 3.3V |  |  |  |     [x] DIP switch must be pulled up at 2.5/3.3V or 2.5V line, not 3.3V | 
			
		
	
		
		
			
				
					
					|  |  |  |     [x] RTC time loss at power down fixed with 1k+22uF - see page 54 of datasheet |  |  |  |     [x] RTC time loss at power down fixed with 1k+22uF - see page 54 of datasheet | 
			
		
	
		
		
			
				
					
					|  |  |  |     [ ] Rotate SD card 180° for easier front loading |  |  |  |     [x] Rotate SD card 180° for easier front loading | 
			
				
				
			
		
	
		
		
	
		
		
			
				
					
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