moving routing out of inner layers under BGA to allow

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larger copper fill zone for power supply

pull/3/head

Emard 8 years ago

parent 3a9160cb16

commit 6e2e5f8c39

2 changed files with 3245 additions and 3056 deletions

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ulx3s.kicad_pcb

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3099

ulx3s.kicad_pcb-bak

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