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@ -286,4 +286,5 @@ Here is checklist what was done or should be done in the next PCB release.
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[x] min VIA enlarge 0.4 mm -> 0.419 mm
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[x] min VIA enlarge 0.4 mm -> 0.419 mm
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[x] USB: copper fill keepout
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[x] USB: copper fill keepout
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[x] ADC: footprint according to MAX1112x land pattern 90-0023
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[x] ADC: footprint according to MAX1112x land pattern 90-0023
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[ ] fix tombstoning see https://www.tempoautomation.com/blog/surface-mount-tombstone-experiment/
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