readme update

pull/3/head
Emard 6 years ago
parent d4149df792
commit 70377d515f

@ -286,4 +286,5 @@ Here is checklist what was done or should be done in the next PCB release.
[x] min VIA enlarge 0.4 mm -> 0.419 mm [x] min VIA enlarge 0.4 mm -> 0.419 mm
[x] USB: copper fill keepout [x] USB: copper fill keepout
[x] ADC: footprint according to MAX1112x land pattern 90-0023 [x] ADC: footprint according to MAX1112x land pattern 90-0023
[ ] fix tombstoning see https://www.tempoautomation.com/blog/surface-mount-tombstone-experiment/

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