readme update (paste is now at DIP switch footprint)

pull/3/head
davor 6 years ago
parent 6b26c88675
commit 75d343620c

@ -274,3 +274,4 @@ Here is checklist what was done or should be done in the next PCB release.
[x] Noise filter for ADC (LC) [x] Noise filter for ADC (LC)
[x] Non-GND yellow layer clearance from board's edge [x] Non-GND yellow layer clearance from board's edge
[x] VIAs thru-GND [x] VIAs thru-GND
[x] no paste on SW1 pads

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