NXP RTC SOT96-1 package, same as SOIC-8 but oriented with pin 1

in upper left quadrant, according to NXP SOT96-1 tape and reel datasheet
pull/3/head
Emard 7 years ago
parent 7e1f3515d8
commit 820064c65e

@ -0,0 +1,29 @@
(module NXP:SOT96-1 (layer F.Cu) (tedit 0)
(descr "SOT96-1 Surface Mount Small Outline 150mil 8pin Package")
(tags "NXP RTC 8-pin package")
(fp_text reference U7 (at -0.034496 0.002118 270) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value PCF8523 (at -0.034496 0.002118 270) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center -0.796496 -1.902882) (end -0.796496 -1.775882) (layer F.SilkS) (width 0.15))
(fp_line (start -1.431496 -2.537882) (end -1.431496 2.542118) (layer F.SilkS) (width 0.15))
(fp_line (start 1.870504 -2.537882) (end 1.870504 2.542118) (layer F.SilkS) (width 0.15))
(fp_line (start -1.939496 -2.537882) (end -1.939496 2.542118) (layer F.SilkS) (width 0.15))
(fp_line (start -1.939496 -2.537882) (end 1.870504 -2.537882) (layer F.SilkS) (width 0.15))
(fp_line (start -1.939496 2.542118) (end 1.870504 2.542118) (layer F.SilkS) (width 0.15))
(pad 1 smd oval (at -2.828496 -1.902882 270) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 2 smd oval (at -2.828496 -0.632882 270) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 3 smd oval (at -2.828496 0.637118 270) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 4 smd oval (at -2.828496 1.907118 270) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 5 smd oval (at 2.759504 1.907118 270) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 6 smd oval (at 2.759504 0.637118 270) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 7 smd oval (at 2.759504 -0.632882 270) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(pad 8 smd oval (at 2.759504 -1.902882 270) (size 0.6096 1.4732) (layers F.Cu F.Paste F.Mask))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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