|
|
@ -281,5 +281,5 @@ Here is checklist what was done or should be done in the next PCB release.
|
|
|
|
[x] VIA align to 0.4mm raster
|
|
|
|
[x] VIA align to 0.4mm raster
|
|
|
|
[x] min VIA enlarge 0.4 mm -> 0.419 mm
|
|
|
|
[x] min VIA enlarge 0.4 mm -> 0.419 mm
|
|
|
|
[x] USB: copper fill keepout
|
|
|
|
[x] USB: copper fill keepout
|
|
|
|
[ ] ADC: new footprint pads clearance 8.0->8.7 mil, length 11.7->11.0 mil, fab: %R, silk: pin 1 mark
|
|
|
|
[x] ADC: new footprint according to MAX1112x packaing information
|
|
|
|
|
|
|
|
|
|
|
|