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compacting the board to hold 2.54mm headers, buttons moved

Browse Source 
randomly just to fit
pull/3/head
davor 8 years ago
parent 85cb0b3f93
commit 9b02f3265d
3 changed files with 230 additions and 230 deletions
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218
ulx3s.kicad_pcb
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@ -3,7 +3,7 @@
(general
(links 462)
(no_connects 462)
(area 93.949999 61.269999 178.070001 109.830001)
(area 93.949999 61.269999 178.070001 112.370001)
(thickness 1.6)
(drawings 6)
(tracks 14)
@ -455,7 +455,7 @@
)
(module SMD_Packages:SMD-1206_Pol (layer B.Cu) (tedit 0) (tstamp 56AA106E)
(at 105.149 102.06)
(at 110.61 81.74)
(path /56AC389C/56AC4846)
(attr smd)
(fp_text reference D52 (at 0 0) (layer B.SilkS)
@ -485,7 +485,7 @@
)
(module SMD_Packages:SMD-1206_Pol (layer B.Cu) (tedit 0) (tstamp 56AA1068)
(at 98.291 102.06 180)
(at 110.61 84.28 180)
(path /56AC389C/56AC483B)
(attr smd)
(fp_text reference D51 (at 0 0 180) (layer B.SilkS)
@ -515,12 +515,12 @@
)
(module micro-sd:MicroSD_TF02D (layer F.Cu) (tedit 52721666) (tstamp 56A966AB)
(at 95.8 90.03 90)
(at 114.5 110.52 180)
(path /58DA7327/58DA7C6C)
(fp_text reference SD1 (at 0 5.7 90) (layer F.SilkS)
(fp_text reference SD1 (at 0 5.7 180) (layer F.SilkS)
(effects (font (size 0.59944 0.59944) (thickness 0.12446)))
)
(fp_text value SD_Card (at 0 4.35 90) (layer F.SilkS)
(fp_text value SD_Card (at 0 4.35 180) (layer F.SilkS)
(effects (font (size 0.59944 0.59944) (thickness 0.12446)))
)
(fp_line (start 3.8 15.2) (end 3.8 16) (layer F.SilkS) (width 0.01016))
@ -530,26 +530,26 @@
(fp_line (start 7 15.2) (end -7 15.2) (layer F.SilkS) (width 0.01016))
(fp_line (start -7 15.2) (end -7 0) (layer F.SilkS) (width 0.01016))
(fp_line (start -7 0) (end 7 0) (layer F.SilkS) (width 0.01016))
(pad 1 smd rect (at 1.94 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 1 smd rect (at 1.94 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 23 SD_3))
(pad 2 smd rect (at 0.84 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at 0.84 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 49 SD_CMD))
(pad 3 smd rect (at -0.26 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 3 smd rect (at -0.26 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 4 smd rect (at -1.36 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 4 smd rect (at -1.36 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3))
(pad 5 smd rect (at -2.46 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 5 smd rect (at -2.46 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 50 SD_CLK))
(pad 6 smd rect (at -3.56 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 6 smd rect (at -3.56 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 7 smd rect (at -4.66 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 7 smd rect (at -4.66 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 51 SD_D0))
(pad 8 smd rect (at -5.76 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 8 smd rect (at -5.76 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 52 SD_D1))
(pad S smd rect (at -5.05 0.4 90) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask))
(pad S smd rect (at 0.75 0.4 90) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask))
(pad G smd rect (at -7.45 13.55 90) (size 1.4 1.9) (layers F.Cu F.Paste F.Mask))
(pad G smd rect (at 6.6 14.55 90) (size 1.4 1.9) (layers F.Cu F.Paste F.Mask))
(pad S smd rect (at -5.05 0.4 180) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask))
(pad S smd rect (at 0.75 0.4 180) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask))
(pad G smd rect (at -7.45 13.55 180) (size 1.4 1.9) (layers F.Cu F.Paste F.Mask))
(pad G smd rect (at 6.6 14.55 180) (size 1.4 1.9) (layers F.Cu F.Paste F.Mask))
)
(module Resistors_SMD:R_1210_HandSoldering (layer B.Cu) (tedit 58307C8D) (tstamp 58D58A37)
@ -800,7 +800,7 @@
)
(module Buttons_Switches_SMD:SW_SPST_SKQG (layer F.Cu) (tedit 56EC5E16) (tstamp 58D659A6)
(at 106.8 71.58)
(at 110.61 71.58)
(descr "ALPS 5.2mm Square Low-profile TACT Switch (SMD)")
(tags "SPST Button Switch")
(path /58D6547C/58D66058)
@ -843,7 +843,7 @@
)
(module Buttons_Switches_SMD:SW_SPST_SKQG (layer F.Cu) (tedit 56EC5E16) (tstamp 58D659AE)
(at 119.5 84.28)
(at 122.04 86.82)
(descr "ALPS 5.2mm Square Low-profile TACT Switch (SMD)")
(tags "SPST Button Switch")
(path /58D6547C/58D6605A)
@ -886,7 +886,7 @@
)
(module Buttons_Switches_SMD:SW_SPST_SKQG (layer F.Cu) (tedit 56EC5E16) (tstamp 58D659B6)
(at 119.5 96.98)
(at 110.61 86.82)
(descr "ALPS 5.2mm Square Low-profile TACT Switch (SMD)")
(tags "SPST Button Switch")
(path /58D6547C/58D6605B)
@ -1637,7 +1637,7 @@
)
(module SMD_Packages:SMD-1206_Pol (layer B.Cu) (tedit 0) (tstamp 58D6C684)
(at 156.711 62.69)
(at 165.22 72.85)
(path /58D6BF46/58D6C83A)
(attr smd)
(fp_text reference D8 (at 0 0) (layer B.SilkS)
@ -1667,7 +1667,7 @@
)
(module SMD_Packages:SMD-1206_Pol (layer B.Cu) (tedit 0) (tstamp 58D6C68A)
(at 156.584 65.484 180)
(at 165.22 75.39 180)
(path /58D6BF46/58D6C83C)
(attr smd)
(fp_text reference D9 (at 0 0 180) (layer B.SilkS)
@ -1948,15 +1948,15 @@
)
(module usb_otg:USB-MICRO-B-FCI-10118192-0001LF (layer B.Cu) (tedit 55D9BD68) (tstamp 58D81FA1)
(at 108.07 63.96)
(at 151.81 107.15 180)
(path /58D6BF46/58D6C841)
(fp_text reference US2 (at 0 4.2) (layer B.SilkS)
(fp_text reference US2 (at 0 4.2 180) (layer B.SilkS)
(effects (font (size 0.7 0.7) (thickness 0.15)) (justify mirror))
)
(fp_text value USB_FPGA (at 0 0) (layer B.SilkS) hide
(fp_text value USB_FPGA (at 0 0 180) (layer B.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user %R (at 0 0.6) (layer B.Fab)
(fp_text user %R (at 0 0.6 180) (layer B.Fab)
(effects (font (size 1.5 1.5) (thickness 0.15)) (justify mirror))
)
(fp_line (start -5 -2.4) (end -5 3.6) (layer B.Fab) (width 0.1))
@ -1977,21 +1977,21 @@
(fp_line (start 5 -2.4) (end -5 -2.4) (layer B.CrtYd) (width 0.05))
(fp_line (start 5 3.6) (end -5 3.6) (layer B.CrtYd) (width 0.05))
(fp_line (start -5 3.6) (end -5 -2.4) (layer B.CrtYd) (width 0.05))
(pad 6 smd rect (at -3.1 2.55) (size 2.1 1.6) (layers B.Cu B.Paste B.Mask)
(pad 6 smd rect (at -3.1 2.55 180) (size 2.1 1.6) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 6 smd rect (at 3.1 2.55) (size 2.1 1.6) (layers B.Cu B.Paste B.Mask)
(pad 6 smd rect (at 3.1 2.55 180) (size 2.1 1.6) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad "" smd rect (at -1.2 0) (size 1.9 1.9) (layers B.Cu B.Paste B.Mask))
(pad "" smd rect (at 1.2 0) (size 1.9 1.9) (layers B.Cu B.Paste B.Mask))
(pad 1 smd rect (at -1.3 2.675) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask)
(pad "" smd rect (at -1.2 0 180) (size 1.9 1.9) (layers B.Cu B.Paste B.Mask))
(pad "" smd rect (at 1.2 0 180) (size 1.9 1.9) (layers B.Cu B.Paste B.Mask))
(pad 1 smd rect (at -1.3 2.675 180) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask)
(net 21 "Net-(D9-Pad1)"))
(pad 2 smd rect (at -0.65 2.675) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask))
(pad 3 smd rect (at 0 2.675) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask))
(pad 4 smd rect (at 0.65 2.675) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask))
(pad 5 smd rect (at 1.3 2.675) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at -0.65 2.675 180) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask))
(pad 3 smd rect (at 0 2.675 180) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask))
(pad 4 smd rect (at 0.65 2.675 180) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask))
(pad 5 smd rect (at 1.3 2.675 180) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad "" smd rect (at -3.8 0) (size 1.8 1.9) (layers B.Cu B.Paste B.Mask))
(pad "" smd rect (at 3.8 0) (size 1.8 1.9) (layers B.Cu B.Paste B.Mask))
(pad "" smd rect (at -3.8 0 180) (size 1.8 1.9) (layers B.Cu B.Paste B.Mask))
(pad "" smd rect (at 3.8 0 180) (size 1.8 1.9) (layers B.Cu B.Paste B.Mask))
)
(module audio-jack:CUI_SJ-43516-SMT (layer B.Cu) (tedit 53B3001C) (tstamp 58D82B6C)
@ -2531,7 +2531,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58D8ED82)
(at 119.5 92.535 180)
(at 124.58 91.9 180)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D6547C/58D6605D)
@ -4014,15 +4014,15 @@
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer B.Cu) (tedit 54130A77) (tstamp 58D911E2)
(at 119.5 97.996)
(at 123.31 72.85 270)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /58D913EC/58D913F5)
(attr smd)
(fp_text reference U10 (at 0 3.5) (layer B.SilkS)
(fp_text reference U10 (at 0 3.5 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value S25FL164K0XMFI011 (at 0 -3.5) (layer B.Fab)
(fp_text value S25FL164K0XMFI011 (at 0 -3.5 270) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -0.95 2.45) (end 1.95 2.45) (layer B.Fab) (width 0.15))
@ -4041,15 +4041,15 @@
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 2.525) (end -3.475 2.525) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 2 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 3 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 4 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -2.7 1.905 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 2 smd rect (at -2.7 0.635 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 3 smd rect (at -2.7 -0.635 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 4 smd rect (at -2.7 -1.905 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 6 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 7 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 8 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(pad 5 smd rect (at 2.7 -1.905 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 6 smd rect (at 2.7 -0.635 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 7 smd rect (at 2.7 0.635 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 8 smd rect (at 2.7 1.905 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
@ -4211,19 +4211,19 @@
)
(module ESP32-footprints-Lib:ESP-32S (layer B.Cu) (tedit 58152DB7) (tstamp 58E56AFE)
(at 104.457338 89.302566 270)
(at 114.772566 101.512662)
(path /58D6D447/58E5662B)
(fp_text reference U2 (at -9.9 13.8 360) (layer B.SilkS)
(fp_text reference U2 (at -9.9 13.8 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value ESP-32S (at 0.7 12.3 270) (layer B.Fab)
(fp_text value ESP-32S (at 0.7 12.3) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user AI-Thinker/Espressif (at 6.3 1.6 540) (layer B.SilkS)
(fp_text user AI-Thinker/Espressif (at 6.3 1.6 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_circle (center -9.958566 10.871338) (end -10.085566 11.125338) (layer B.SilkS) (width 0.5))
(fp_text user ESP-32S (at 4.8 -2.8 540) (layer B.SilkS)
(fp_text user ESP-32S (at 4.8 -2.8 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start 8.947434 11.017338) (end -9.052566 11.017338) (layer B.SilkS) (width 0.15))
@ -4231,60 +4231,60 @@
(fp_line (start 8.947434 17.017338) (end 8.947434 -8.482662) (layer B.SilkS) (width 0.15))
(fp_line (start 8.947434 -8.482662) (end -9.052566 -8.482662) (layer B.SilkS) (width 0.15))
(fp_line (start 8.947434 17.017338) (end -9.052566 17.017338) (layer B.SilkS) (width 0.15))
(pad 38 smd oval (at 8.947434 9.517338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 37 smd oval (at 8.947434 8.247338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 36 smd oval (at 8.947434 6.977338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 35 smd oval (at 8.947434 5.707338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 34 smd oval (at 8.947434 4.437338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 33 smd oval (at 8.947434 3.167338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(pad 38 smd oval (at 8.947434 9.517338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 37 smd oval (at 8.947434 8.247338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 36 smd oval (at 8.947434 6.977338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 35 smd oval (at 8.947434 5.707338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 34 smd oval (at 8.947434 4.437338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 33 smd oval (at 8.947434 3.167338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 26 JTAG_TMS))
(pad 32 smd oval (at 8.947434 1.897338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(pad 32 smd oval (at 8.947434 1.897338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 27 JTAG_TDO))
(pad 31 smd oval (at 8.947434 0.627338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(pad 31 smd oval (at 8.947434 0.627338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 24 JTAG_TDI))
(pad 30 smd oval (at 8.947434 -0.642662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(pad 30 smd oval (at 8.947434 -0.642662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 25 JTAG_TCK))
(pad 29 smd oval (at 8.947434 -1.912662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 28 smd oval (at 8.947434 -3.182662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 27 smd oval (at 8.947434 -4.452662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 26 smd oval (at 8.947434 -5.722662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 25 smd oval (at 8.947434 -6.992662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 24 smd oval (at 5.662434 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 23 smd oval (at 4.392434 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 22 smd oval (at 3.122434 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(pad 29 smd oval (at 8.947434 -1.912662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 28 smd oval (at 8.947434 -3.182662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 27 smd oval (at 8.947434 -4.452662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 26 smd oval (at 8.947434 -5.722662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 25 smd oval (at 8.947434 -6.992662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 24 smd oval (at 5.662434 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 23 smd oval (at 4.392434 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 22 smd oval (at 3.122434 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 52 SD_D1))
(pad 21 smd oval (at 1.852434 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(pad 21 smd oval (at 1.852434 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 51 SD_D0))
(pad 20 smd oval (at 0.582434 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(pad 20 smd oval (at 0.582434 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 50 SD_CLK))
(pad 19 smd oval (at -0.687566 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(pad 19 smd oval (at -0.687566 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 49 SD_CMD))
(pad 18 smd oval (at -1.957566 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(pad 18 smd oval (at -1.957566 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 23 SD_3))
(pad 17 smd oval (at -3.227566 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 16 smd oval (at -4.497566 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 15 smd oval (at -5.767566 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 14 smd oval (at -9.052566 -6.992662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 13 smd oval (at -9.052566 -5.722662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 12 smd oval (at -9.052566 -4.452662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 11 smd oval (at -9.052566 -3.182662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 10 smd oval (at -9.052566 -1.912662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 9 smd oval (at -9.052566 -0.642662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 8 smd oval (at -9.052566 0.627338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 7 smd oval (at -9.052566 1.897338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 6 smd oval (at -9.052566 3.167338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 5 smd oval (at -9.052566 4.437338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 4 smd oval (at -9.052566 5.707338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 3 smd oval (at -9.052566 6.977338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 2 smd oval (at -9.052566 8.247338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(pad 17 smd oval (at -3.227566 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 16 smd oval (at -4.497566 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 15 smd oval (at -5.767566 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 14 smd oval (at -9.052566 -6.992662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 13 smd oval (at -9.052566 -5.722662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 12 smd oval (at -9.052566 -4.452662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 11 smd oval (at -9.052566 -3.182662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 10 smd oval (at -9.052566 -1.912662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 9 smd oval (at -9.052566 -0.642662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 8 smd oval (at -9.052566 0.627338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 7 smd oval (at -9.052566 1.897338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 6 smd oval (at -9.052566 3.167338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 5 smd oval (at -9.052566 4.437338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 4 smd oval (at -9.052566 5.707338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 3 smd oval (at -9.052566 6.977338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 2 smd oval (at -9.052566 8.247338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 1 smd oval (at -9.052566 9.517338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(pad 1 smd oval (at -9.052566 9.517338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 39 smd rect (at -0.352566 1.817338 90) (size 6 6) (layers B.Cu B.Paste B.Mask))
(pad 39 smd rect (at -0.352566 1.817338 180) (size 6 6) (layers B.Cu B.Paste B.Mask))
)
(module Socket_Strips:Socket_Strip_Angled_2x20 (layer F.Cu) (tedit 0) (tstamp 58E6BE3D)
(at 91.56 62.69 270)
(at 102.99 62.69 270)
(descr "Through hole socket strip")
(tags "socket strip")
(path /56AC389C/58E6B7F6)
@ -4654,7 +4654,7 @@
)
(module Mounting_Holes:MountingHole_3.2mm_M3_ISO14580_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58E6B6EC)
(at 97.91 107.14)
(at 128.39 105.87)
(descr "Mounting Hole 3.2mm, M3, ISO14580")
(tags "mounting hole 3.2mm m3 iso14580")
(path /58E6B981)
@ -4671,7 +4671,7 @@
)
(module Mounting_Holes:MountingHole_3.2mm_M3_ISO14580_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58E6B6F1)
(at 167.76 107.14)
(at 169.03 105.87)
(descr "Mounting Hole 3.2mm, M3, ISO14580")
(tags "mounting hole 3.2mm m3 iso14580")
(path /58E6BACE)
@ -4688,7 +4688,7 @@
)
(module Mounting_Holes:MountingHole_3.2mm_M3_ISO14580_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58E6B6F6)
(at 97.91 72.85)
(at 156.33 65.23)
(descr "Mounting Hole 3.2mm, M3, ISO14580")
(tags "mounting hole 3.2mm m3 iso14580")
(path /58E6BAEF)
@ -4705,7 +4705,7 @@
)
(module Mounting_Holes:MountingHole_3.2mm_M3_ISO14580_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58E6B6FB)
(at 97.91 63.96)
(at 111.88 65.23)
(descr "Mounting Hole 3.2mm, M3, ISO14580")
(tags "mounting hole 3.2mm m3 iso14580")
(path /58E6BBE9)
@ -4799,7 +4799,7 @@
)
(module Buttons_Switches_SMD:SW_SPST_SKQG (layer F.Cu) (tedit 56EC5E16) (tstamp 58E794CD)
(at 99.18 79.2)
(at 110.61 79.2)
(descr "ALPS 5.2mm Square Low-profile TACT Switch (SMD)")
(tags "SPST Button Switch")
(path /58D51CAD/58E83FE0)
@ -5173,17 +5173,17 @@
)
)
(dimension 48.26 (width 0.3) (layer Eco2.User)
(gr_text "48,260 mm" (at 77.51 85.55 90) (layer Eco2.User)
(dimension 50.8 (width 0.3) (layer Eco2.User)
(gr_text "50,800 mm" (at 77.51 86.82 90) (layer Eco2.User)
(effects (font (size 1.5 1.5) (thickness 0.3)))
)
(feature1 (pts (xy 94.1 61.42) (xy 76.16 61.42)))
(feature2 (pts (xy 94.1 109.68) (xy 76.16 109.68)))
(crossbar (pts (xy 78.86 109.68) (xy 78.86 61.42)))
(feature2 (pts (xy 94.1 112.22) (xy 76.16 112.22)))
(crossbar (pts (xy 78.86 112.22) (xy 78.86 61.42)))
(arrow1a (pts (xy 78.86 61.42) (xy 79.446421 62.546504)))
(arrow1b (pts (xy 78.86 61.42) (xy 78.273579 62.546504)))
(arrow2a (pts (xy 78.86 109.68) (xy 79.446421 108.553496)))
(arrow2b (pts (xy 78.86 109.68) (xy 78.273579 108.553496)))
(arrow2a (pts (xy 78.86 112.22) (xy 79.446421 111.093496)))
(arrow2b (pts (xy 78.86 112.22) (xy 78.273579 111.093496)))
)
(dimension 83.82 (width 0.3) (layer Eco2.User)
(gr_text "83,820 mm" (at 136.01 44.83) (layer Eco2.User)
@ -5197,10 +5197,10 @@
(arrow2a (pts (xy 177.92 46.18) (xy 176.793496 45.593579)))
(arrow2b (pts (xy 177.92 46.18) (xy 176.793496 46.766421)))
)
(gr_line (start 94.1 61.42) (end 94.1 109.68) (layer Edge.Cuts) (width 0.3))
(gr_line (start 94.1 61.42) (end 94.1 112.22) (layer Edge.Cuts) (width 0.3))
(gr_line (start 177.92 61.42) (end 94.1 61.42) (layer Edge.Cuts) (width 0.3))
(gr_line (start 177.92 109.68) (end 177.92 61.42) (layer Edge.Cuts) (width 0.3))
(gr_line (start 94.1 109.68) (end 177.92 109.68) (layer Edge.Cuts) (width 0.3))
(gr_line (start 177.92 112.22) (end 177.92 61.42) (layer Edge.Cuts) (width 0.3))
(gr_line (start 94.1 112.22) (end 177.92 112.22) (layer Edge.Cuts) (width 0.3))
(segment (start 159.05 83.772) (end 158.95 83.772) (width 0.25) (layer B.Cu) (net 0))
(segment (start 102.26 81.74) (end 102.26 83.78) (width 0.2) (layer B.Cu) (net 24))

216
ulx3s.kicad_pcb-bak
Unescape View File

@ -455,7 +455,7 @@
)
(module SMD_Packages:SMD-1206_Pol (layer B.Cu) (tedit 0) (tstamp 56AA106E)
(at 105.149 102.06)
(at 110.61 81.74)
(path /56AC389C/56AC4846)
(attr smd)
(fp_text reference D52 (at 0 0) (layer B.SilkS)
@ -485,7 +485,7 @@
)
(module SMD_Packages:SMD-1206_Pol (layer B.Cu) (tedit 0) (tstamp 56AA1068)
(at 98.291 102.06 180)
(at 110.61 84.28 180)
(path /56AC389C/56AC483B)
(attr smd)
(fp_text reference D51 (at 0 0 180) (layer B.SilkS)
@ -515,12 +515,12 @@
)
(module micro-sd:MicroSD_TF02D (layer F.Cu) (tedit 52721666) (tstamp 56A966AB)
(at 95.8 90.03 90)
(at 114.5 110.52 180)
(path /58DA7327/58DA7C6C)
(fp_text reference SD1 (at 0 5.7 90) (layer F.SilkS)
(fp_text reference SD1 (at 0 5.7 180) (layer F.SilkS)
(effects (font (size 0.59944 0.59944) (thickness 0.12446)))
)
(fp_text value SD_Card (at 0 4.35 90) (layer F.SilkS)
(fp_text value SD_Card (at 0 4.35 180) (layer F.SilkS)
(effects (font (size 0.59944 0.59944) (thickness 0.12446)))
)
(fp_line (start 3.8 15.2) (end 3.8 16) (layer F.SilkS) (width 0.01016))
@ -530,26 +530,26 @@
(fp_line (start 7 15.2) (end -7 15.2) (layer F.SilkS) (width 0.01016))
(fp_line (start -7 15.2) (end -7 0) (layer F.SilkS) (width 0.01016))
(fp_line (start -7 0) (end 7 0) (layer F.SilkS) (width 0.01016))
(pad 1 smd rect (at 1.94 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 1 smd rect (at 1.94 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 23 SD_3))
(pad 2 smd rect (at 0.84 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at 0.84 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 49 SD_CMD))
(pad 3 smd rect (at -0.26 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 3 smd rect (at -0.26 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 4 smd rect (at -1.36 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 4 smd rect (at -1.36 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3))
(pad 5 smd rect (at -2.46 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 5 smd rect (at -2.46 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 50 SD_CLK))
(pad 6 smd rect (at -3.56 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 6 smd rect (at -3.56 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 1 GND))
(pad 7 smd rect (at -4.66 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 7 smd rect (at -4.66 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 51 SD_D0))
(pad 8 smd rect (at -5.76 11 90) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(pad 8 smd rect (at -5.76 11 180) (size 0.7 1.8) (layers F.Cu F.Paste F.Mask)
(net 52 SD_D1))
(pad S smd rect (at -5.05 0.4 90) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask))
(pad S smd rect (at 0.75 0.4 90) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask))
(pad G smd rect (at -7.45 13.55 90) (size 1.4 1.9) (layers F.Cu F.Paste F.Mask))
(pad G smd rect (at 6.6 14.55 90) (size 1.4 1.9) (layers F.Cu F.Paste F.Mask))
(pad S smd rect (at -5.05 0.4 180) (size 1.6 1.4) (layers F.Cu F.Paste F.Mask))
(pad S smd rect (at 0.75 0.4 180) (size 1.8 1.4) (layers F.Cu F.Paste F.Mask))
(pad G smd rect (at -7.45 13.55 180) (size 1.4 1.9) (layers F.Cu F.Paste F.Mask))
(pad G smd rect (at 6.6 14.55 180) (size 1.4 1.9) (layers F.Cu F.Paste F.Mask))
)
(module Resistors_SMD:R_1210_HandSoldering (layer B.Cu) (tedit 58307C8D) (tstamp 58D58A37)
@ -800,7 +800,7 @@
)
(module Buttons_Switches_SMD:SW_SPST_SKQG (layer F.Cu) (tedit 56EC5E16) (tstamp 58D659A6)
(at 106.8 71.58)
(at 110.61 71.58)
(descr "ALPS 5.2mm Square Low-profile TACT Switch (SMD)")
(tags "SPST Button Switch")
(path /58D6547C/58D66058)
@ -843,7 +843,7 @@
)
(module Buttons_Switches_SMD:SW_SPST_SKQG (layer F.Cu) (tedit 56EC5E16) (tstamp 58D659AE)
(at 119.5 84.28)
(at 122.04 84.28)
(descr "ALPS 5.2mm Square Low-profile TACT Switch (SMD)")
(tags "SPST Button Switch")
(path /58D6547C/58D6605A)
@ -886,7 +886,7 @@
)
(module Buttons_Switches_SMD:SW_SPST_SKQG (layer F.Cu) (tedit 56EC5E16) (tstamp 58D659B6)
(at 119.5 96.98)
(at 67.43 103.33)
(descr "ALPS 5.2mm Square Low-profile TACT Switch (SMD)")
(tags "SPST Button Switch")
(path /58D6547C/58D6605B)
@ -1637,7 +1637,7 @@
)
(module SMD_Packages:SMD-1206_Pol (layer B.Cu) (tedit 0) (tstamp 58D6C684)
(at 156.711 62.69)
(at 165.22 72.85)
(path /58D6BF46/58D6C83A)
(attr smd)
(fp_text reference D8 (at 0 0) (layer B.SilkS)
@ -1667,7 +1667,7 @@
)
(module SMD_Packages:SMD-1206_Pol (layer B.Cu) (tedit 0) (tstamp 58D6C68A)
(at 156.584 65.484 180)
(at 165.22 75.39 180)
(path /58D6BF46/58D6C83C)
(attr smd)
(fp_text reference D9 (at 0 0 180) (layer B.SilkS)
@ -1948,15 +1948,15 @@
)
(module usb_otg:USB-MICRO-B-FCI-10118192-0001LF (layer B.Cu) (tedit 55D9BD68) (tstamp 58D81FA1)
(at 108.07 63.96)
(at 151.81 107.15 180)
(path /58D6BF46/58D6C841)
(fp_text reference US2 (at 0 4.2) (layer B.SilkS)
(fp_text reference US2 (at 0 4.2 180) (layer B.SilkS)
(effects (font (size 0.7 0.7) (thickness 0.15)) (justify mirror))
)
(fp_text value USB_FPGA (at 0 0) (layer B.SilkS) hide
(fp_text value USB_FPGA (at 0 0 180) (layer B.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user %R (at 0 0.6) (layer B.Fab)
(fp_text user %R (at 0 0.6 180) (layer B.Fab)
(effects (font (size 1.5 1.5) (thickness 0.15)) (justify mirror))
)
(fp_line (start -5 -2.4) (end -5 3.6) (layer B.Fab) (width 0.1))
@ -1977,21 +1977,21 @@
(fp_line (start 5 -2.4) (end -5 -2.4) (layer B.CrtYd) (width 0.05))
(fp_line (start 5 3.6) (end -5 3.6) (layer B.CrtYd) (width 0.05))
(fp_line (start -5 3.6) (end -5 -2.4) (layer B.CrtYd) (width 0.05))
(pad 6 smd rect (at -3.1 2.55) (size 2.1 1.6) (layers B.Cu B.Paste B.Mask)
(pad 6 smd rect (at -3.1 2.55 180) (size 2.1 1.6) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 6 smd rect (at 3.1 2.55) (size 2.1 1.6) (layers B.Cu B.Paste B.Mask)
(pad 6 smd rect (at 3.1 2.55 180) (size 2.1 1.6) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad "" smd rect (at -1.2 0) (size 1.9 1.9) (layers B.Cu B.Paste B.Mask))
(pad "" smd rect (at 1.2 0) (size 1.9 1.9) (layers B.Cu B.Paste B.Mask))
(pad 1 smd rect (at -1.3 2.675) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask)
(pad "" smd rect (at -1.2 0 180) (size 1.9 1.9) (layers B.Cu B.Paste B.Mask))
(pad "" smd rect (at 1.2 0 180) (size 1.9 1.9) (layers B.Cu B.Paste B.Mask))
(pad 1 smd rect (at -1.3 2.675 180) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask)
(net 21 "Net-(D9-Pad1)"))
(pad 2 smd rect (at -0.65 2.675) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask))
(pad 3 smd rect (at 0 2.675) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask))
(pad 4 smd rect (at 0.65 2.675) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask))
(pad 5 smd rect (at 1.3 2.675) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at -0.65 2.675 180) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask))
(pad 3 smd rect (at 0 2.675 180) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask))
(pad 4 smd rect (at 0.65 2.675 180) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask))
(pad 5 smd rect (at 1.3 2.675 180) (size 0.4 1.35) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad "" smd rect (at -3.8 0) (size 1.8 1.9) (layers B.Cu B.Paste B.Mask))
(pad "" smd rect (at 3.8 0) (size 1.8 1.9) (layers B.Cu B.Paste B.Mask))
(pad "" smd rect (at -3.8 0 180) (size 1.8 1.9) (layers B.Cu B.Paste B.Mask))
(pad "" smd rect (at 3.8 0 180) (size 1.8 1.9) (layers B.Cu B.Paste B.Mask))
)
(module audio-jack:CUI_SJ-43516-SMT (layer B.Cu) (tedit 53B3001C) (tstamp 58D82B6C)
@ -2531,7 +2531,7 @@
)
(module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 58307AEF) (tstamp 58D8ED82)
(at 119.5 92.535 180)
(at 124.58 91.9 180)
(descr "Resistor SMD 0603, hand soldering")
(tags "resistor 0603")
(path /58D6547C/58D6605D)
@ -4014,15 +4014,15 @@
)
(module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer B.Cu) (tedit 54130A77) (tstamp 58D911E2)
(at 119.5 97.996)
(at 123.31 72.85 270)
(descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SOIC 1.27")
(path /58D913EC/58D913F5)
(attr smd)
(fp_text reference U10 (at 0 3.5) (layer B.SilkS)
(fp_text reference U10 (at 0 3.5 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value S25FL164K0XMFI011 (at 0 -3.5) (layer B.Fab)
(fp_text value S25FL164K0XMFI011 (at 0 -3.5 270) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -0.95 2.45) (end 1.95 2.45) (layer B.Fab) (width 0.15))
@ -4041,15 +4041,15 @@
(fp_line (start -2.075 2.575) (end 2.075 2.575) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer B.SilkS) (width 0.15))
(fp_line (start -2.075 2.525) (end -3.475 2.525) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 2 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 3 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 4 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -2.7 1.905 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 2 smd rect (at -2.7 0.635 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 3 smd rect (at -2.7 -0.635 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 4 smd rect (at -2.7 -1.905 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 5 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 6 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 7 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 8 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(pad 5 smd rect (at 2.7 -1.905 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 6 smd rect (at 2.7 -0.635 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 7 smd rect (at 2.7 0.635 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask))
(pad 8 smd rect (at 2.7 1.905 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
(at (xyz 0 0 0))
@ -4211,19 +4211,19 @@
)
(module ESP32-footprints-Lib:ESP-32S (layer B.Cu) (tedit 58152DB7) (tstamp 58E56AFE)
(at 104.457338 89.302566 270)
(at 114.772566 101.512662)
(path /58D6D447/58E5662B)
(fp_text reference U2 (at -9.9 13.8 360) (layer B.SilkS)
(fp_text reference U2 (at -9.9 13.8 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value ESP-32S (at 0.7 12.3 270) (layer B.Fab)
(fp_text value ESP-32S (at 0.7 12.3) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text user AI-Thinker/Espressif (at 6.3 1.6 540) (layer B.SilkS)
(fp_text user AI-Thinker/Espressif (at 6.3 1.6 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_circle (center -9.958566 10.871338) (end -10.085566 11.125338) (layer B.SilkS) (width 0.5))
(fp_text user ESP-32S (at 4.8 -2.8 540) (layer B.SilkS)
(fp_text user ESP-32S (at 4.8 -2.8 270) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start 8.947434 11.017338) (end -9.052566 11.017338) (layer B.SilkS) (width 0.15))
@ -4231,60 +4231,60 @@
(fp_line (start 8.947434 17.017338) (end 8.947434 -8.482662) (layer B.SilkS) (width 0.15))
(fp_line (start 8.947434 -8.482662) (end -9.052566 -8.482662) (layer B.SilkS) (width 0.15))
(fp_line (start 8.947434 17.017338) (end -9.052566 17.017338) (layer B.SilkS) (width 0.15))
(pad 38 smd oval (at 8.947434 9.517338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 37 smd oval (at 8.947434 8.247338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 36 smd oval (at 8.947434 6.977338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 35 smd oval (at 8.947434 5.707338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 34 smd oval (at 8.947434 4.437338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 33 smd oval (at 8.947434 3.167338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(pad 38 smd oval (at 8.947434 9.517338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 37 smd oval (at 8.947434 8.247338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 36 smd oval (at 8.947434 6.977338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 35 smd oval (at 8.947434 5.707338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 34 smd oval (at 8.947434 4.437338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 33 smd oval (at 8.947434 3.167338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 26 JTAG_TMS))
(pad 32 smd oval (at 8.947434 1.897338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(pad 32 smd oval (at 8.947434 1.897338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 27 JTAG_TDO))
(pad 31 smd oval (at 8.947434 0.627338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(pad 31 smd oval (at 8.947434 0.627338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 24 JTAG_TDI))
(pad 30 smd oval (at 8.947434 -0.642662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(pad 30 smd oval (at 8.947434 -0.642662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 25 JTAG_TCK))
(pad 29 smd oval (at 8.947434 -1.912662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 28 smd oval (at 8.947434 -3.182662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 27 smd oval (at 8.947434 -4.452662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 26 smd oval (at 8.947434 -5.722662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 25 smd oval (at 8.947434 -6.992662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 24 smd oval (at 5.662434 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 23 smd oval (at 4.392434 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 22 smd oval (at 3.122434 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(pad 29 smd oval (at 8.947434 -1.912662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 28 smd oval (at 8.947434 -3.182662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 27 smd oval (at 8.947434 -4.452662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 26 smd oval (at 8.947434 -5.722662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 25 smd oval (at 8.947434 -6.992662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 24 smd oval (at 5.662434 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 23 smd oval (at 4.392434 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 22 smd oval (at 3.122434 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 52 SD_D1))
(pad 21 smd oval (at 1.852434 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(pad 21 smd oval (at 1.852434 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 51 SD_D0))
(pad 20 smd oval (at 0.582434 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(pad 20 smd oval (at 0.582434 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 50 SD_CLK))
(pad 19 smd oval (at -0.687566 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(pad 19 smd oval (at -0.687566 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 49 SD_CMD))
(pad 18 smd oval (at -1.957566 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(pad 18 smd oval (at -1.957566 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask)
(net 23 SD_3))
(pad 17 smd oval (at -3.227566 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 16 smd oval (at -4.497566 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 15 smd oval (at -5.767566 -8.482662 90) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 14 smd oval (at -9.052566 -6.992662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 13 smd oval (at -9.052566 -5.722662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 12 smd oval (at -9.052566 -4.452662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 11 smd oval (at -9.052566 -3.182662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 10 smd oval (at -9.052566 -1.912662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 9 smd oval (at -9.052566 -0.642662 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 8 smd oval (at -9.052566 0.627338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 7 smd oval (at -9.052566 1.897338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 6 smd oval (at -9.052566 3.167338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 5 smd oval (at -9.052566 4.437338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 4 smd oval (at -9.052566 5.707338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 3 smd oval (at -9.052566 6.977338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 2 smd oval (at -9.052566 8.247338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(pad 17 smd oval (at -3.227566 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 16 smd oval (at -4.497566 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 15 smd oval (at -5.767566 -8.482662 180) (size 0.9 2.5) (layers B.Cu B.Paste B.Mask))
(pad 14 smd oval (at -9.052566 -6.992662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 13 smd oval (at -9.052566 -5.722662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 12 smd oval (at -9.052566 -4.452662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 11 smd oval (at -9.052566 -3.182662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 10 smd oval (at -9.052566 -1.912662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 9 smd oval (at -9.052566 -0.642662 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 8 smd oval (at -9.052566 0.627338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 7 smd oval (at -9.052566 1.897338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 6 smd oval (at -9.052566 3.167338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 5 smd oval (at -9.052566 4.437338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 4 smd oval (at -9.052566 5.707338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 3 smd oval (at -9.052566 6.977338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask))
(pad 2 smd oval (at -9.052566 8.247338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 1 smd oval (at -9.052566 9.517338 90) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(pad 1 smd oval (at -9.052566 9.517338 180) (size 2.5 0.9) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 39 smd rect (at -0.352566 1.817338 90) (size 6 6) (layers B.Cu B.Paste B.Mask))
(pad 39 smd rect (at -0.352566 1.817338 180) (size 6 6) (layers B.Cu B.Paste B.Mask))
)
(module Socket_Strips:Socket_Strip_Angled_2x20 (layer F.Cu) (tedit 0) (tstamp 58E6BE3D)
(at 91.56 62.69 270)
(at 102.99 62.69 270)
(descr "Through hole socket strip")
(tags "socket strip")
(path /56AC389C/58E6B7F6)
@ -4654,7 +4654,7 @@
)
(module Mounting_Holes:MountingHole_3.2mm_M3_ISO14580_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58E6B6EC)
(at 97.91 107.14)
(at 128.39 105.87)
(descr "Mounting Hole 3.2mm, M3, ISO14580")
(tags "mounting hole 3.2mm m3 iso14580")
(path /58E6B981)
@ -4671,7 +4671,7 @@
)
(module Mounting_Holes:MountingHole_3.2mm_M3_ISO14580_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58E6B6F1)
(at 167.76 107.14)
(at 169.03 105.87)
(descr "Mounting Hole 3.2mm, M3, ISO14580")
(tags "mounting hole 3.2mm m3 iso14580")
(path /58E6BACE)
@ -4688,7 +4688,7 @@
)
(module Mounting_Holes:MountingHole_3.2mm_M3_ISO14580_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58E6B6F6)
(at 97.91 72.85)
(at 156.33 65.23)
(descr "Mounting Hole 3.2mm, M3, ISO14580")
(tags "mounting hole 3.2mm m3 iso14580")
(path /58E6BAEF)
@ -4705,7 +4705,7 @@
)
(module Mounting_Holes:MountingHole_3.2mm_M3_ISO14580_Pad (layer F.Cu) (tedit 56D1B4CB) (tstamp 58E6B6FB)
(at 97.91 63.96)
(at 111.88 65.23)
(descr "Mounting Hole 3.2mm, M3, ISO14580")
(tags "mounting hole 3.2mm m3 iso14580")
(path /58E6BBE9)
@ -4799,7 +4799,7 @@
)
(module Buttons_Switches_SMD:SW_SPST_SKQG (layer F.Cu) (tedit 56EC5E16) (tstamp 58E794CD)
(at 99.18 79.2)
(at 110.61 79.2)
(descr "ALPS 5.2mm Square Low-profile TACT Switch (SMD)")
(tags "SPST Button Switch")
(path /58D51CAD/58E83FE0)
@ -5173,17 +5173,17 @@
)
)
(dimension 48.26 (width 0.3) (layer Eco2.User)
(gr_text "48,260 mm" (at 77.51 85.55 90) (layer Eco2.User)
(dimension 50.8 (width 0.3) (layer Eco2.User)
(gr_text "50,800 mm" (at 77.51 86.82 90) (layer Eco2.User)
(effects (font (size 1.5 1.5) (thickness 0.3)))
)
(feature1 (pts (xy 94.1 61.42) (xy 76.16 61.42)))
(feature2 (pts (xy 94.1 109.68) (xy 76.16 109.68)))
(crossbar (pts (xy 78.86 109.68) (xy 78.86 61.42)))
(feature2 (pts (xy 94.1 112.22) (xy 76.16 112.22)))
(crossbar (pts (xy 78.86 112.22) (xy 78.86 61.42)))
(arrow1a (pts (xy 78.86 61.42) (xy 79.446421 62.546504)))
(arrow1b (pts (xy 78.86 61.42) (xy 78.273579 62.546504)))
(arrow2a (pts (xy 78.86 109.68) (xy 79.446421 108.553496)))
(arrow2b (pts (xy 78.86 109.68) (xy 78.273579 108.553496)))
(arrow2a (pts (xy 78.86 112.22) (xy 79.446421 111.093496)))
(arrow2b (pts (xy 78.86 112.22) (xy 78.273579 111.093496)))
)
(dimension 83.82 (width 0.3) (layer Eco2.User)
(gr_text "83,820 mm" (at 136.01 44.83) (layer Eco2.User)
@ -5197,10 +5197,10 @@
(arrow2a (pts (xy 177.92 46.18) (xy 176.793496 45.593579)))
(arrow2b (pts (xy 177.92 46.18) (xy 176.793496 46.766421)))
)
(gr_line (start 94.1 61.42) (end 94.1 109.68) (layer Edge.Cuts) (width 0.3))
(gr_line (start 94.1 61.42) (end 94.1 112.22) (layer Edge.Cuts) (width 0.3))
(gr_line (start 177.92 61.42) (end 94.1 61.42) (layer Edge.Cuts) (width 0.3))
(gr_line (start 177.92 109.68) (end 177.92 61.42) (layer Edge.Cuts) (width 0.3))
(gr_line (start 94.1 109.68) (end 177.92 109.68) (layer Edge.Cuts) (width 0.3))
(gr_line (start 177.92 112.22) (end 177.92 61.42) (layer Edge.Cuts) (width 0.3))
(gr_line (start 94.1 112.22) (end 177.92 112.22) (layer Edge.Cuts) (width 0.3))
(segment (start 159.05 83.772) (end 158.95 83.772) (width 0.25) (layer B.Cu) (net 0))
(segment (start 102.26 81.74) (end 102.26 83.78) (width 0.2) (layer B.Cu) (net 24))

26
ulx3s.net
Unescape View File

@ -1,7 +1,7 @@
(export (version D)
(design
(source /home/davor/src/circuits/fpga/ulx3s/ulx3s.sch)
(date "Pon 10 Tra 2017 12:33:25")
(date "Pon 10 Tra 2017 12:50:56")
(tool "Eeschema 4.0.5+dfsg1-4")
(sheet (number 1) (name /) (tstamps /)
(title_block
@ -1605,26 +1605,26 @@
(pin (num 5) (name GND) (type power_in))
(pin (num 6) (name shield) (type passive)))))
(libraries
(library (logical device)
(uri /usr/share/kicad/library/device.lib))
(library (logical conn)
(uri /usr/share/kicad/library/conn.lib))
(library (logical ESP32)
(uri footprints/esp32/ESP32.lib))
(library (logical ssd_13xx)
(uri footprints/oled/ssd_13xx.lib))
(library (logical memory)
(uri /usr/share/kicad/library/memory.lib))
(library (logical philips)
(uri /usr/share/kicad/library/philips.lib))
(library (logical lfe5bg381)
(uri footprints/lattice/lfe5bg381.lib))
(library (logical micro-hdmi-d)
(uri footprints/micro-hdmi-d/micro-hdmi-d.lib))
(library (logical ftdi)
(uri footprints/usbserial/ftdi.lib))
(library (logical lfe5bg381)
(uri footprints/lattice/lfe5bg381.lib))
(library (logical ap3429a)
(uri footprints/dcdc_converter/ap3429a.lib))
(library (logical device)
(uri /usr/share/kicad/library/device.lib))
(library (logical memory)
(uri /usr/share/kicad/library/memory.lib)))
(library (logical ESP32)
(uri footprints/esp32/ESP32.lib))
(library (logical ssd_13xx)
(uri footprints/oled/ssd_13xx.lib))
(library (logical ftdi)
(uri footprints/usbserial/ftdi.lib)))
(nets
(net (code 1) (name GND)
(node (ref U1) (pin T10))

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